摘要:
Disclosed is a method for preparing an original for projection by using a transfer film comprising a transparent plastic film substrate, an undercoating layer composed of an electrically conductive resin and having a surface resistance of 1.0.times.10.sup.6 to 9.0.times.10.sup.9 .OMEGA., and a toner receiving layer composed of a binder resin and having a surface resistance of 1.0.times.10.sup.10 to 1.0.times.10.sup.14 .OMEGA., which is formed on at least one surface of the transparent plastic film substrate through the undercoating layer.An original for projection which is excellent in the surface smoothness and image characteristics can be obtained by electrostatically transferring an image of a one-component type magnetic developer on a photosensitive plate for the electrostatic photography, onto the toner receiving layer of the above transfer film and bringing the transferred developer image into contact with a roller under application of a pressure to fix the developer image on the toner receiving layer.
摘要:
An electrophotograhic copying process forms an electrostatic latent image on the surface of a photosensitive member, developes the image by applying a monocomponent developer to the latent image to form a toner image, transfers the thus formed toner image by contacting a receptor sheet with the photosensitive member to transfer the toner image to the surface of the receptor sheet, fixes the toner image onto the surface of the receptor sheet, eliminates electrostatic charge from the photosensitive member by irradiating the surface of the photosensitive member with an electrostatic eliminating lamp after the toner image has been transferred to the receptor sheet, and cleans the surface of the photosensitive member by removing the developer remaining on the surface thereof. A developer-holding member holds the same kind of developer as used in the developing step on the surface of said developer-holding member by a stationary magnet disposed within the developer-holding member, and the surface of the developer-holding member is moved in a direction opposite to the direction of movement of the surface of the photosensitive member while contacting the two surfaces through the layer of the developer to mechanically brush the surface of the photosensitive member by the layer of the developer. The magnet having a plurality of poles, and the magnetic pole which is located closest to a position at which the surface of the developer-holding member is closest to the surface of the photosensitive member is downstream in the rotation direction of the developer-holding member by a certain angle with respect to the position at which the two surfaces are closest to each other.
摘要:
One end of a sub transmission line of which an impedance value is equal to or higher than a parallel impedance value of an output impedance value of a transmission circuit and an impedance value of a transmission line is connected to a connection point between the transmission circuit and the transmission line, and a correction resistor of which resistance is lower than an impedance value of the sub transmission line is connected to the other end of the sub transmission line. A length of the sub transmission line is set to satisfy a condition of 0.5×Tr (signal rise time)≦Td (signal propagation time of sub transmission line)≦0.5×Tmin (signal minimum pulse width), thereby achieving a de-emphasis function by a passive component, correcting a high-frequency component of a signal attenuated on the transmission line, and thus reducing timing jitters caused by intersymbol interference.
摘要:
In connecting flexible printed circuits, a structure with improved connection strength of the connection portion is provided. In this structure in which a first flexible printed circuit and a second flexible printed circuit are connected to each other, a through-hole is provided on the second flexible printed circuit, and a resin member passes through the through-hole and is adhered to the wires of a connection surface of the first flexible printed circuit and the side of the second flexible printed circuit opposite to the connection surface, whereby impact is absorbed by the elasticity of the resin; as for the first flexible printed circuit, adhesion is performed on a metal in a wiring layer with high adhesion strength, while as for the second flexible printed circuit, adhesion is performed on the back side upon which no peeling stress is exerted, improving joining strength to prevent peeling.
摘要:
Impedance mismatching points such as a VIA and a connector on a differential line between a differential driver element and a differential receiver element are arranged in predetermined positions. That is, the impedance mismatching points are arranged in such positions that a transmission time of a digital signal transmitted through a main differential line becomes (integral multiple of UI)±0.5×Trf, whereby noises are generated within the rise and fall times of a signal to be able to maintain an excellent waveform of the signal.
摘要:
A cleaning agent or a rinsing agent having no flash point which comprises a chlorine-free fluorine-containing compound have a vapor pressure at 20° C. of 1.33×103 Pa or more and one or more components having a vapor pressure at 20° C. less than 1.33×103 Pa and optionally an additive such as an antioxidant; a method for cleaning which comprises cleaning with the cleaning agent and rinsing and/or vapor cleaning utilizing a vapor being generated by boiling the cleaning agent or a condensate thereof; a method for separating a soil which comprises contacting a cleaning agent in a cleaning tank with a condensate of the vapor of the cleaning agent in a soil separating tank, to thereby continuously separate and remove a soil contained in the cleaning agent; and a cleaning apparatus.
摘要:
While gradually increasing the widths of signal lines (104a, 104b, 105a, 105b) of first and second groups of differential signal lines (104, 105) to suppress attenuation in the lines, the opening widths of slits (104s, 105s) formed in a GND layer (102) below the differential signal lines are similarly changed. Thereby, impedance matching is realized. Further, by alternately disposing a large-width side and a small-width side of the two groups of differential signal lines (104, 105), the total wiring area widths are reduced.
摘要:
While gradually increasing the widths of signal lines (104a, 104b, 105a, 105b) of first and second groups of differential signal lines (104, 105) to suppress attenuation in the lines, the opening widths of slits (104s, 105s) formed in a GND layer (102) below the differential signal lines are similarly changed. Thereby, impedance matching is realized. Further, by alternately disposing a large-width side and a small-width side of the two groups of differential signal lines (104, 105), the total wiring area widths are reduced.
摘要:
The invention is directed to provide a forming method and a forming apparatus that are, without extending a processing time compared with the conventional practice, capable of sufficiently lubricating a formed object and forming at safety without the lubricant igniting under pressure. In an extruding apparatus, a workpiece is successively transferred to a series of press stages, a conveying unit successively transferring the workpiece is provided with a nozzle for spraying the workpiece with lubricant, and the workpiece and the nozzle are located in fixed relative positions to each other in spraying the workpiece with the lubricant.
摘要:
On a silicon substrate, a silicon oxide layer, a first platinum layer, a dielectric film and a second platinum layer are formed, and then the second platinum layer and the dielectric film are dry etched, via a resist layer, in a 1-5 Pa low pressure region with a mixed gas of HBr and 0.sub.2 as the etching gas. As soon as the first platinum layer is exposed, the unetched portion of dielectric film is etched off in a 5-50 Pa high pressure region, and then the first platinum layer is dry etched again in the low pressure region to form a capacitor consisting of a top electrode, a capacitance insulation layer and a bottom electrode in a semiconductor integrated circuit chip. Using this manufacturing method prevents the deterioration in definition caused by the use of a thick resist and the operation failure of circuit elements such as transistors due to over etching on the insulation layer.