公开(公告)号：US20160293537A1

公开(公告)日：2016-10-06

申请号：US15078793

申请日：2016-03-23

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Yuichi SUGIYAMA ,  Masashi MIYAZAKI ,  Yutaka HATA ,  Masashi KATAKAI

IPC: H01L23/498 ,  H01L21/56

CPC classification number: H01L23/13 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/5389 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An embedded component substrate includes: a core layer; a first electrode provided on a top surface of the core layer with a first insulating layer therebetween; and a second electrode provided on a bottom surface of the core layer with a second insulating layer therebetween, wherein a cavity is formed in the embedded component substrate from a top surface thereof to expose the second insulating layer at a bottom of the cavity, wherein a placement region is defined on the bottom of the cavity, for accommodating an electronic component; and wherein the embedded component substrate further includes a pad electrode on a portion of the second insulating layer, exposed by the cavity, surrounding the placement region located on the bottom of the cavity, the pad electrode vertically protruding from a top surface of the exposed second insulating layer upwardly and being configured to electrically connect to the electronic component.

Abstract translation: 嵌入式部件基板包括：芯层; 设置在所述芯层的顶表面上的第一电极，其间具有第一绝缘层; 以及第二电极，其设置在所述芯层的底表面上，其间具有第二绝缘层，其中在所述嵌入式部件基板中从其顶表面形成空腔，以在所述空腔的底部暴露所述第二绝缘层，其中， 放置区域限定在空腔的底部，用于容纳电子部件; 并且其中所述嵌入式部件基板还包括在所述第二绝缘层的由所述空腔暴露的部分上的焊盘电极，所述焊盘电极围绕位于所述腔的底部的所述放置区域，所述焊盘电极从所述暴露的第二绝缘层的顶表面垂直突出 绝缘层向上并且被配置为电连接到电子部件。

公开(公告)号：US20160163751A1

公开(公告)日：2016-06-09

申请号：US14960094

申请日：2015-12-04

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Yuichi SUGIYAMA ,  Masashi MIYAZAKI ,  Yoshiki HAMADA

IPC: H01L27/146 ,  H01L31/0203

CPC classification number: H01L27/14618 ,  H01L24/32 ,  H01L27/14607 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14685 ,  H01L31/0203 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/10155 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A substrate for embedding an imaging device includes: a core layer; a first multilayered wiring layer that is formed onto the core layer, the core layer and the first multilayered wiring layer having a cavity penetrating therethrough; a second multilayered wiring layer that is formed onto the core layer on a side opposite to the first multilayered wiring layer and that includes a conductive pattern formed at a position facing the cavity; a resin portion that is arranged inside the cavity and includes a bottom surface supported by the second multilayered wiring layer, a side face supported by the core layer, and a curved surface formed on a side opposite to the bottom surface; and an imaging device adhered along the curved surface inside the cavity.

Abstract translation: 用于嵌入成像装置的基板包括：芯层; 形成在所述芯层上的第一多层布线层，所述芯层和所述第一多层布线层具有穿透其中的空腔; 第二多层布线层，形成在与第一多层布线层相反的一侧的芯层上，并且包括形成在面向空腔的位置处的导电图案; 布置在所述空腔内的树脂部分，其包括由所述第二多层布线层支撑的底面，由所述芯层支撑的侧面和形成在与所述底面相反的一侧的曲面; 以及沿着腔内的弯曲表面粘附的成像装置。

公开(公告)号：US20150098203A1

公开(公告)日：2015-04-09

申请号：US14566470

申请日：2014-12-10

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Tatsuro SAWATARI ,  Yuichi SUGIYAMA ,  Hiroshi NAKAMURA ,  Masaki NAGANUMA ,  Tetsuo SAJI

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/185 ,  H05K1/0213 ,  H05K1/0271 ,  H05K1/0298 ,  H05K2201/09063 ,  H05K2203/1178

Abstract: In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively.

Abstract translation: 在分别与具有穿过其的存储部分的芯层最靠近的第一导电层和第三导电层中，形成四个第一穿透孔和四个第一穿透孔，以与存储部分的开口边缘的一部分重叠 其分别投影到第一导电层和第三导电层上。

公开(公告)号：US20150010694A1

公开(公告)日：2015-01-08

申请号：US14316382

申请日：2014-06-26

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Masashi MIYAZAKI ,  Yuichi SUGIYAMA ,  Tatsuro SAWATARI ,  Hideki YOKOTA ,  Yutaka HATA

IPC: H05K3/06 ,  H05K3/44

CPC classification number: H05K3/4697 ,  B05D3/12 ,  B05D5/12 ,  H05K1/185 ,  H05K3/0044 ,  H05K3/007 ,  H05K3/0094 ,  H05K3/04 ,  H05K3/06 ,  H05K3/30 ,  H05K3/42 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4647 ,  H05K2201/10204

Abstract: The method of manufacturing a substrate includes: forming a penetrating hole in a base layer; inserting a metal dummy part in the penetrating hole; forming an insulating portion made of synthetic resin to fill a ring-shaped gap between the penetrating hole and the dummy part; forming lower insulating layers, covering the bottom surface of the dummy part, that are made of synthetic resin on the bottom surface of the base layer to be continuous with the insulating portion; forming upper insulating layers, covering the top surface of the dummy part, that are made of synthetic resin on the top surface of the base layer to be continuous with the insulating portion; forming an exposing hole by routing in the upper insulating layers to expose the top surface of the dummy part; and forming a cavity by removing the dummy part exposed through the exposing hole by etching.

Abstract translation: 制造基板的方法包括：在基层中形成贯通孔; 将金属虚设部件插入穿透孔中; 形成由合成树脂制成的绝缘部分，以填充所述穿透孔和所述虚拟部件之间的环形间隙; 在所述基底层的底面上形成覆盖所述虚拟部的底面的由合成树脂制成的下绝缘层，以与所述绝缘部连续; 在所述基底层的顶表面上形成覆盖所述虚拟部分的上表面的由合成树脂制成的上绝缘层，以与所述绝缘部分连续; 通过在上绝缘层中布线来形成暴露孔以暴露虚拟部分的顶表面; 并且通过蚀刻去除暴露在暴露孔中的虚拟部分来形成空腔。

公开(公告)号：US20140252522A1

公开(公告)日：2014-09-11

申请号：US14155308

申请日：2014-01-14

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Masashi MIYAZAKI ,  Yuichi SUGIYAMA ,  Tatsuro SAWATARI ,  Hideki YOKOTA ,  Yutaka HATA

IPC: H01L27/146

CPC classification number: H01L27/14627 ,  H01L27/146 ,  H01L27/14605 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15192 ,  H01L2924/19105 ,  H01L2924/00014

Abstract: In a camera module, a planar part, which is for mitigating deformation of the surface of a second insulating portion on which an imaging device is mounted, is embedded in the second insulating portion of a substrate so as to face the imaging device mounted on the surface (top surface) of the second insulating portion.

Abstract translation: 在相机模块中，用于减轻其上安装有成像装置的第二绝缘部分的表面的变形的平面部分被嵌入到基板的第二绝缘部分中，以面对安装在基板上的成像装置 第二绝缘部分的表面（顶表面）。