摘要:
A watertight suit is capable of properly discharging air within the suit and safely maintaining a diver's position in the water. The suit includes an air outlet valve provided in an end section of a leg part, the air outlet valve functioning to discharge air from the inside of the leg part. Another air outlet valve can also be provided in an upper body part of the suit. An air inlet introduces air into the watertight suit as necessary to equalize external pressure. Where an automatic air outlet valve is provided, air in excess of external pressure is vented through the outlet valves automatically as warranted by the diving conditions, keeping an even balance of pressure even when air is excessively supplied form the air source through the inlet valve.
摘要:
In a semiconductor device which has through holes in an end face, in which a semiconductor element is fixedly mounted on a face of a substrate which has a wiring pattern, which is conductive to the wiring portion formed in the through hole, in at least one face, in which electrodes of the semiconductor element are electrically connected to the wiring pattern, and in which the face of the substrate which has the semiconductor element is coated with a resin, the through hole has a through hole land with a width of 0.02 mm or more, which is conductive to the wiring portion, in a substrate face, and the wiring portion and the through hole land are exposed.
摘要:
A first terminal portion constructed by a plurality of contact pins of a first circuit board and a second terminal portion constructed by a plurality of contact pins of a second circuit board are joined in a housing of a connector. The connector has a presser for applying a pressing force to a joint portion. The presser applies the pressing force, thereby joining the plurality of contact pins of the first terminal and the plurality of contact pins of the second terminal through soft metal projections. Thus, a joint area of the contact terminal portion can be increased and the reliability of the joining can be improved. Since the circuit boards are positioned, the terminal portions of the circuit boards can be accurately joined.
摘要:
In a semiconductor device which has through holes in an end face, in which a semiconductor element is fixedly mounted on a face of a substrate which has a wiring pattern, which is conductive to the wiring portion formed in the through hole, in at least one face, in which electrodes of the semiconductor element are electrically connected to the wiring pattern, and in which the face of the substrate which has the semiconductor element is coated with a resin, the through hole has a through hole land with a width of 0.02 mm or more, which is conductive to the wiring portion, in a substrate face, and the wiring portion and the through hole land are exposed.
摘要:
A guided-wave circuit module includes a guided-wave circuit chip having an input waveguide part and an output waveguide part at the ends thereof, a guided-wave circuit part having a predetermined function and positioned between the input waveguide part and the output waveguide part; and a holder for supporting the guided-wave circuit chip, wherein the guided-wave circuit part of the guided-wave circuit chip does not come in contact with the chip holder; at least part of the input and output waveguide parts of the guided-wave circuit chip is fixed to the holder with a fixing agent; and the packaged chip does not have a warp which leads to deterioration of characteristics. A fixing agent having a high hardness is applied to the periphery of the endfaces of the input and output waveguide parts of the guided-wave circuit module and to the periphery of the fiber endfaces of the optical fiber array connected to the module. Therefore, these endfaces can accurately be polished and the waveguide can be connected to the optical fibers at a sufficiently low fiber connection loss and a high return loss.
摘要:
In a semiconductor device which has through holes in an end face, in which a semiconductor element is fixedly mounted on a face of a substrate which has a wiring pattern, which is conductive to the wiring portion formed in the through hole, in at least one face, in which electrodes of the semiconductor element are electrically connected to the wiring pattern, and in which the face of the substrate which has the semiconductor element is coated with a resin, the through hole has a through hole land with a width of 0.02 mm or more, which is conductive to the wiring portion, in a substrate face, and the wiring portion and the through hole land are exposed.
摘要:
A semiconductor optical device is provided with a photo-electric conversion unit having plural photo-electric conversion elements and is entirely sealed by a sealing member. The photo-electric conversion elements are connected to external leads with electrical connectors. The distance D between a planar outer surface and a photoelectric conversion area satisfies the equation, D.gtoreq./2.multidot.l/tan .theta., where .theta. is a critical angle of total reflection of the sealing member with respect to air and l is the maximum length of said photoelectric conversion area.
摘要:
In a method for manufacturing a semiconductor photo-sensor, an assembly including a photoelectric conversion element having a photoreceiving section, and a lead terminal having an inner lead connected to the photoelectric conversion element by a bonding wire is provided. A light transmitting member is also provided within the cavity spaced apart from the photoelectric conversion element and at a light-incident side of the photoelectric conversion element, the light transmitting member having an inner surface facing an upper surface of the photoelectric conversion element and an outer surface opposite the inner surface. The photoelectric conversion element, the inner lead and the bonding wire are sealed by introducing a light transmitting resin into the cavity so as to provide a relation l
摘要:
An electrical connecting member comprising a holder made of electrically insulative material and a plurality of conductive members electrically insulated from each other and embedded in the holder and having ends exposed from the holder, and wherein a conductive adhesive layer eutectoidally formed from an adhesive resin solution including one or both of pulverized metal powder and metalized ceramic powder by electrophoresis method is disposed on the end of each conductive member exposed from one surface of the holder. A conductive adhesive layers and the other ends of the conductive members exposed from the other surface of the holder are flush with or protruded from the surfaces of the holder.
摘要:
An aquascooter apparatus including a controller for preventing problems associated with water leakage into the aquascooter. The aquascooter has a battery, a driving motor and a clutch in a housing, and the controller includes a water leak detecting sensor that detects a leakage of water into the housing. A motor control is responsive to the signal from the water leak detecting sensor, and prevents the battery from supplying electric power to the driving motor responsive to this signal. This prevents electrical energy from being used if a water leak is detected, and therefore prevents any possibility of a dangerous situation of a spark in contact with hydrogen gas.