公开(公告)号：US12230515B2

公开(公告)日：2025-02-18

申请号：US18419867

申请日：2024-01-23

Applicant: Tokyo Electron Limited

Inventor： Nobuhiko Mouri ,  Takanori Obaru ,  Yasushi Takiguchi ,  Teruhiko Kodama

IPC: H01L21/67 ,  B08B1/10 ,  B08B1/32 ,  B24B37/10 ,  B24B37/30 ,  H01L21/02 ,  H01L21/304 ,  H01L21/677 ,  H01L21/687

Abstract: A substrate processing method includes: performing a both-surface cleaning processing in which a first cleaning body, which ejects the fluid to the one surface or is brought into contact with the one surface, and subsequently moves both the first cleaning body and a second cleaning body, which is in contact with the remaining surface of the upper surface and the lower surface of the substrate and rotated around a first vertical axis, horizontally in synchronization with each other toward an outer peripheral portion of the substrate, and performing a side end cleaning processing in which a third cleaning body is rotated around a second vertical axis and brought into contact with the side end of the substrate to clean the side end of the substrate while simultaneously performing the both-surface cleaning processing.

公开(公告)号：US20210308828A1

公开(公告)日：2021-10-07

申请号：US17347824

申请日：2021-06-15

Applicant: Tokyo Electron Limited

Inventor： Yoshiki Okamoto ,  Yasushi Takiguchi ,  Akihiro Kubo ,  Hayato Hosaka ,  Ryuto Ozasa

IPC: B24B53/017 ,  B24B37/04 ,  B24B37/20 ,  B24B37/10 ,  B24B27/00 ,  B24B49/12 ,  B24B53/007 ,  B24B53/095 ,  B24B53/14

Abstract: A dressing apparatus includes a bus member which is equipped with a ceiling plate and a circular or polygonal cylindrical skirt portion provided at a bottom surface of the ceiling plate and which is configured to accommodate a polishing pad from thereabove. The bus member includes a dual fluid nozzle configured to jet a cleaning liquid and a gas onto a polishing surface of the polishing pad; a dress board configured to come into contact with the polishing surface of the polishing pad; and a rinse nozzle configured to supply a rinse liquid onto a contact surface between the polishing surface of the polishing pad and the dress board. A cleaning liquid, a fragment of a grindstone or a sludge is suppressed from being scattered around by the skirt portion.

公开(公告)号：US20210220878A1

公开(公告)日：2021-07-22

申请号：US17152870

申请日：2021-01-20

Applicant: Tokyo Electron Limited

Inventor： Akihiro Kubo ,  Yasushi Takiguchi ,  Teruhiko Kodama ,  Yoshiki Okamoto

IPC: B08B1/04 ,  B08B11/02 ,  B08B3/04 ,  H01L21/02

Abstract: A substrate cleaning apparatus configured to clean a surface of a substrate having a circular shape by bringing a cleaning member into contact with the surface of the substrate and rotating the substrate and the cleaning member relatively is provided. A contact region of the cleaning member which comes into contact with the surface of the substrate is widened in a radial shape from a center side of the substrate toward a peripheral side thereof.

公开(公告)号：US20190181022A1

公开(公告)日：2019-06-13

申请号：US16214501

申请日：2018-12-10

Applicant: Tokyo Electron Limited

Inventor： Nobuhiko Mouri ,  Takanori Obaru ,  Yasushi Takiguchi ,  Teruhiko Kodama

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/304 ,  B08B1/04 ,  B08B1/00 ,  B24B37/10 ,  B24B37/30

Abstract: A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.

公开(公告)号：US20190047118A1

公开(公告)日：2019-02-14

申请号：US16059344

申请日：2018-08-09

Applicant: Tokyo Electron Limited

Inventor： Yoshiki Okamoto ,  Yasushi Takiguchi ,  Akihiro Kubo ,  Hayato Hosaka ,  Ryuto Ozasa

IPC: B24B53/017 ,  B24B37/20 ,  B24B37/04

Abstract: A dressing apparatus 200 includes a bus member 203 which is equipped with a ceiling plate 201 and a circular or polygonal cylindrical skirt portion 202 provided at a bottom surface of the ceiling plate 201 and which is configured to accommodate a polishing pad 131 from thereabove. The bus member 203 includes a dual fluid nozzle 204 configured to jet a cleaning liquid and a gas onto a polishing surface of the polishing pad 131; a dress board 205 configured to come into contact with the polishing surface of the polishing pad 131; and a rinse nozzle 206 configured to supply a rinse liquid onto a contact surface between the polishing surface of the polishing pad 131 and the dress board 205. A cleaning liquid, a fragment of a grindstone or a sludge is suppressed from being scattered around by the skirt portion 202.

公开(公告)号：US09575411B2

公开(公告)日：2017-02-21

申请号：US14450704

申请日：2014-08-04

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kousuke Yoshihara ,  Hideharu Kyouda ,  Koshi Muta ,  Taro Yamamoto ,  Yasushi Takiguchi

IPC: B05C11/08 ,  G03F7/30 ,  H01L21/67 ,  B05C5/02 ,  B05D1/00 ,  B05D1/26

CPC classification number: G03F7/30 ,  B05C5/02 ,  B05C5/0287 ,  B05C11/08 ,  B05D1/005 ,  B05D1/26 ,  G03F7/3021 ,  H01L21/6715

Abstract: A developing apparatus includes: a substrate holder that hold a substrate horizontally; a developer nozzle that supplies a developer onto the substrate to form a liquid puddle; a turning flow generation mechanism including a rotary member that rotates about an axis perpendicular to the substrate while the rotary member is being in contact with the liquid puddle thereby to generate a turning flow in the liquid puddle of the developer formed on the substrate; and a moving mechanism for moving the turning flow generation mechanism along a surface of the substrate. The line-width uniformity of a pattern can be improved by forming turning flows in a desired region of the substrate and stirring the developer.

Abstract translation: 显影装置包括：水平保持基板的基板支架; 显影剂喷嘴，其将显影剂供应到所述基板上以形成液体熔池; 旋转流产生机构，其包括旋转构件，所述旋转构件在所述旋转构件与所述液体熔池接触的同时围绕垂直于所述基板的轴旋转，从而在形成在所述基板上的所述显影剂的液体池中产生转向流; 以及用于沿着基板的表面移动转向流产生机构的移动机构。 可以通过在衬底的期望区域中形成转向流并搅拌显影剂来改善图案的线宽均匀性。

公开(公告)号：US09570326B2

公开(公告)日：2017-02-14

申请号：US14570151

申请日：2014-12-15

Applicant: TOKYO ELECTRON LIMITED

Inventor： Ryoichi Uemura ,  Yasushi Takiguchi

IPC: B08B7/00 ,  H01L21/67 ,  G03F7/42

CPC classification number: G03F7/70925 ,  B08B3/024 ,  G01B11/02 ,  G03F7/422 ,  H01L21/67051

Abstract: A substrate cleaning method includes: a first step in which a cleaning liquid is ejected from a nozzle N2 to a central portion of a wafer W; a second step in which a dry gas is ejected from a nozzle N3 to the central portion of the wafer W to form a dry area; a third step in which the cleaning liquid is ejected from the nozzle N2 while the nozzle N2 is moved from a central side of the wafer W to a peripheral side thereof; a fourth step in which a width of an intermediate area generated between a wet area and the dry area is acquired; and a fifth step in which, when the width of the intermediate area exceeds a predetermined threshold value, a process parameter is changed such that the width of the intermediate area becomes the threshold value or less.

Abstract translation: 基板清洗方法包括：第一步骤，其中清洗液体从喷嘴N2喷射到晶片W的中心部分; 第二步骤，其中干燥气体从喷嘴N3喷射到晶片W的中心部分以形成干燥区域; 第三步骤，其中喷嘴N2从晶片W的中心侧移动到其周边，从喷嘴N2喷射清洗液; 第四步骤，其中获得在湿区域和干燥区域之间产生的中间区域的宽度; 以及第五步骤，当中间区域的宽度超过预定阈值时，改变处理参数，使得中间区域的宽度变为阈值以下。

公开(公告)号：US09304398B2

公开(公告)日：2016-04-05

申请号：US14022434

申请日：2013-09-10

Applicant: Tokyo Electron Limited

Inventor： Yasushi Takiguchi ,  Taro Yamamoto ,  Yoshinori Ikeda ,  Koki Yoshimura ,  Yoshiki Okamoto ,  Masahiro Fukuda

IPC: G03B27/32 ,  G03C5/26 ,  G03F7/30 ,  H01L21/67

CPC classification number: G03F7/16 ,  G03F7/3021 ,  G03F7/3092 ,  H01L21/67017

Abstract: The present invention is a developing treatment apparatus for performing development by supplying a developing solution to a substrate having a front surface coated with a positive resist or a negative resist and then subjected to exposure wherein a movable cup is raised to introduce one of scattering developing solutions for the positive and negative resists into an inner peripheral flow path of a cup and the movable cup is lowered to introduce the other of scattering developing solutions for the positive and negative resists into an outer peripheral flow path of the cup, and the developing solution introduced into the inner peripheral flow path and the developing solution introduced into the outer peripheral flow path are separately drained.

公开(公告)号：US20160054653A1

公开(公告)日：2016-02-25

申请号：US14919869

申请日：2015-10-22

Applicant: Tokyo Electron Limited

Inventor： Norihiko Sasagawa ,  Hiroichi Inada ,  Yasushi Takiguchi

IPC: G03F7/16

CPC classification number: G03F7/162 ,  B05D1/005 ,  G03F7/3021 ,  G06F19/00 ,  H01L21/6715 ,  H01L21/67178

Abstract: A liquid processing method includes: accommodating a substrate horizontally in each of a first processing region and a second processing region, for performing therein a process on the substrate by a processing solution from a nozzle; rotating a rotary body about a vertical axis; keeping a plurality of processing nozzles provided at the rotary body; supplying different kinds of processing solutions to the substrate from the plurality of processing nozzles; holding a processing nozzle selected from the plurality of processing nozzles by a nozzle holder provided at the rotary body; transferring the nozzle holder into selected one of the first and the second processing regions by a nozzle transfer device; and rotating the rotary body by a rotation driving unit so as to allow a front of the nozzle holder in a forward/backward direction thereof to face the selected one of the first and the second processing regions.

Abstract translation: 液体处理方法包括：在第一处理区域和第二处理区域中的每一个中水平地容纳衬底，用于通过来自喷嘴的处理溶液在衬底上进行处理; 围绕垂直轴旋转旋转体; 保持设置在所述旋转体上的多个处理喷嘴; 从所述多个处理喷嘴向所述基板供应不同种类的处理溶液; 通过设置在所述旋转体的喷嘴保持从所述多个处理喷嘴中选择的处理喷嘴; 通过喷嘴传送装置将喷嘴保持器转移到第一和第二处理区域中的选定的一个中; 并且通过旋转驱动单元旋转所述旋转体，以使得所述喷嘴保持器的前后方向与所述第一和第二处理区域中的所选择的一个相对。