公开(公告)号：US06855966B2

公开(公告)日：2005-02-15

申请号：US10435416

申请日：2003-05-09

申请人： Ying-Cheng Chuang ,  Chung-Lin Huang

发明人： Ying-Cheng Chuang ,  Chung-Lin Huang

IPC分类号： H01L21/8247 ,  H01L27/115 ,  H01L31/072 ,  H01L31/0328 ,  H01L31/0336 ,  H01L31/109

CPC分类号： H01L21/28273 ,  H01L27/115 ,  H01L27/11521

摘要： A floating gate and a fabricating method of the same. A semiconductor substrate is provided. A gate dielectric layer and a conducting layer are sequentially formed on the semiconductor substrate. A patterned hard mask layer having an opening is formed on the conducting layer, wherein a portion of the conducting layer is exposed through the opening. A spacer is formed on the sidewall of the opening. The patterned hard mask layer is removed. A conducting spacer is formed on the sidewall of the spacer. The exposed conducting layer and the exposed gate dielectric layer are sequentially removed.

摘要翻译： 浮栅及其制造方法。 提供半导体衬底。 在半导体衬底上依次形成栅介电层和导电层。 在导电层上形成具有开口的图案化的硬掩模层，其中导电层的一部分通过开口露出。 间隔件形成在开口的侧壁上。 图案化的硬掩模层被去除。 导电间隔件形成在间隔件的侧壁上。 依次去除暴露的导电层和暴露的栅介质层。

公开(公告)号：US06770520B2

公开(公告)日：2004-08-03

申请号：US10436800

申请日：2003-05-13

申请人： Ying-Cheng Chuang ,  Chung-Lin Huang ,  Chi-Hui Lin

发明人： Ying-Cheng Chuang ,  Chung-Lin Huang ,  Chi-Hui Lin

IPC分类号： H01L21337

CPC分类号： H01L29/66825 ,  H01L21/28273 ,  H01L29/42324

摘要： A floating gate and fabrication method thereof. A semiconductor substrate is provided, on which a gate dielectric layer, a conducting layer, and a patterned hard mask layer are sequentially formed. The surface of the conducting layer is covered by the patterned hard mask layer to form a gate. The conducting layer is etched to a predetermined depth to form an indentation using the patterned hard mask layer as a mask. The conducting layer is oxidized to form an oxide layer on the surface of the conducting layer. The oxide layer and the conducting layer are etched to form multiple tips using the patterned hard mask layer as a mask.

摘要翻译： 浮栅及其制造方法。 提供半导体衬底，其上依次形成栅介电层，导电层和图案化的硬掩模层。 导电层的表面被图案化的硬掩模层覆盖以形成栅极。 使用图案化的硬掩模层作为掩模，将导电层蚀刻到预定深度以形成凹陷。 导电层被氧化以在导电层的表面上形成氧化物层。 使用图案化的硬掩模层作为掩模，蚀刻氧化物层和导电层以形成多个尖端。

公开(公告)号：US06670246B1

公开(公告)日：2003-12-30

申请号：US10465178

申请日：2003-06-19

申请人： Ching-Nan Hsiao ,  Ying-Cheng Chuang

发明人： Ching-Nan Hsiao ,  Ying-Cheng Chuang

IPC分类号： H01L21336

CPC分类号： H01L27/11568 ,  H01L27/115 ,  H01L29/792 ,  H01L29/7926

摘要： A method for forming a vertical nitride read-only memory cell. First, a substrate having at least one trench is provided. Next, a masking layer is formed over the sidewall of the trench. Next, ion implantation is performed on the substrate to respectively form doping areas in the substrate near its surface and the bottom of the substrate trench to serve as bit lines. Next, bit line oxides are formed over each of the doping areas and an oxide layer is formed overlying the mask layer by thermal oxidation. Finally, a conductive layer is formed overlying the bit line oxides and fills in the trench to serve as a word line.

摘要翻译： 一种用于形成垂直氮化物只读存储单元的方法。 首先，提供具有至少一个沟槽的衬底。 接下来，在沟槽的侧壁上形成掩模层。 接下来，在衬底上进行离子注入，以分别在衬底的表面和底部附近在衬底中形成掺杂区域，以用作位线。 接下来，在每个掺杂区域上形成位线氧化物，并且通过热氧化在掩模层上形成氧化物层。 最后，形成覆盖位线氧化物的导电层并填充在沟槽中以用作字线。

公开(公告)号：US07576381B2

公开(公告)日：2009-08-18

申请号：US11955397

申请日：2007-12-13

申请人： Ching-Nan Hsiao ,  Ying-Cheng Chuang ,  Chung-Lin Huang ,  Shih-Yang Chiu

发明人： Ching-Nan Hsiao ,  Ying-Cheng Chuang ,  Chung-Lin Huang ,  Shih-Yang Chiu

IPC分类号： H01L27/108

CPC分类号： H01L27/115 ,  H01L27/11521 ,  H01L29/42336

摘要： A memory structure including a substrate, a first dielectric layer, a first conducting layer, a second conducting layer, a second dielectric layer, a spacer and a doped region is provided. The substrate has a trench wherein. The first dielectric layer is disposed on the interior surface of the trench. The first conducting layer is disposed on the first dielectric layer of the lower portion of the trench. The second conducting layer is disposed above the first conducting layer and filling the trench. The second dielectric layer is disposed between the first conducting layer and the second conducting layer. The spacer is disposed between the first dielectric layer and the second conducting layer. The doped region is disposed in the substrate of a side of the trench.

摘要翻译： 提供了包括基板，第一介电层，第一导电层，第二导电层，第二介电层，间隔物和掺杂区域的存储器结构。 衬底具有沟槽，其中。 第一介电层设置在沟槽的内表面上。 第一导电层设置在沟槽下部的第一电介质层上。 第二导电层设置在第一导电层上方并填充沟槽。 第二电介质层设置在第一导电层和第二导电层之间。 间隔物设置在第一介电层和第二导电层之间。 掺杂区域设置在沟槽侧面的衬底中。

公开(公告)号：US20090014773A1

公开(公告)日：2009-01-15

申请号：US11946868

申请日：2007-11-29

申请人： Ching-Nan Hsiao ,  Ying-Cheng Chuang ,  Chung-Lin Huang ,  Shih-Yang Chiu

发明人： Ching-Nan Hsiao ,  Ying-Cheng Chuang ,  Chung-Lin Huang ,  Shih-Yang Chiu

IPC分类号： H01L29/78 ,  H01L21/76

CPC分类号： H01L29/7881 ,  H01L29/66825

摘要： A method for fabricating the memory structure includes: providing a substrate having a pad, forming an opening in the pad, forming a first spacer on a sidewall of the opening, filling the opening with a sacrificial layer, removing the first spacer and exposing a portion of the substrate, removing the exposed substrate to define a first trench and a second trench, removing the sacrificial layer to expose a surface of the substrate to function as a channel region, forming a first dielectric layer on a surface of the first trench, a surface of the second trench and a surface of the channel region, filling the first trench and the second trench with a first conductive layer, forming a second dielectric layer on a surface of the first conductive layer and the surface of the channel region, filling the opening with a second conductive layer, and removing the pad.

摘要翻译： 一种用于制造存储器结构的方法包括：提供具有焊盘的衬底，在焊盘中形成开口，在开口的侧壁上形成第一间隔物，用牺牲层填充开口，移除第一间隔物并露出一部分 去除所述暴露的衬底以限定第一沟槽和第二沟槽，去除所述牺牲层以暴露所述衬底的表面以用作沟道区域，在所述第一沟槽的表面上形成第一介电层， 第二沟槽的表面和沟道区的表面，用第一导电层填充第一沟槽和第二沟槽，在第一导电层的表面和沟道区的表面上形成第二介电层，填充第二沟槽 用第二导电层打开，并移除垫。

公开(公告)号：US20080265302A1

公开(公告)日：2008-10-30

申请号：US11955397

申请日：2007-12-13

申请人： Ching-Nan Hsiao ,  Ying-Cheng Chuang ,  Chung-Lin Huang ,  Shih-Yang Chiu

发明人： Ching-Nan Hsiao ,  Ying-Cheng Chuang ,  Chung-Lin Huang ,  Shih-Yang Chiu

IPC分类号： H01L29/00 ,  H01L21/76

CPC分类号： H01L27/115 ,  H01L27/11521 ,  H01L29/42336

摘要： A memory structure including a substrate, a first dielectric layer, a first conducting layer, a second conducting layer, a second dielectric layer, a spacer and a doped region is provided. The substrate has a trench wherein. The first dielectric layer is disposed on the interior surface of the trench. The first conducting layer is disposed on the first dielectric layer of the lower portion of the trench. The second conducting layer is disposed above the first conducting layer and filling the trench. The second dielectric layer is disposed between the first conducting layer and the second conducting layer. The spacer is disposed between the first dielectric layer and the second conducting layer. The doped region is disposed in the substrate of a side of the trench.

摘要翻译： 提供了包括基板，第一介电层，第一导电层，第二导电层，第二介电层，间隔物和掺杂区域的存储器结构。 衬底具有沟槽，其中。 第一介电层设置在沟槽的内表面上。 第一导电层设置在沟槽下部的第一电介质层上。 第二导电层设置在第一导电层上方并填充沟槽。 第二电介质层设置在第一导电层和第二导电层之间。 间隔物设置在第一介电层和第二导电层之间。 掺杂区域设置在沟槽侧面的衬底中。

公开(公告)号：US07323743B2

公开(公告)日：2008-01-29

申请号：US11603771

申请日：2006-11-22

申请人： Ying-Cheng Chuang ,  Chung-Lin Huang ,  Chi-Hui Lin

发明人： Ying-Cheng Chuang ,  Chung-Lin Huang ,  Chi-Hui Lin

IPC分类号： H01L29/788

CPC分类号： H01L27/11521 ,  H01L21/28273 ,  H01L29/42324 ,  H01L29/7881

摘要： A floating gate and fabrication method thereof. A semiconductor substrate is provided, on which an oxide layer, a first conducting layer, and a patterned hard mask layer having an opening are sequentially formed. A spacer is formed on the sidewall of the opening. A second conducting layer is formed on the hard mask layer. The second conducting layer is planarized to expose the surface of the patterned hard mask layer. The surface of the second conducting layer is oxidized to form an oxide layer. The patterned hard mask layer and the oxide layer and the first conducting layer underlying the patterned hard mask layer are removed.

摘要翻译： 浮栅及其制造方法。 提供了半导体衬底，其上依次形成有氧化物层，第一导电层和具有开口的图案化硬掩模层。 间隔件形成在开口的侧壁上。 在硬掩模层上形成第二导电层。 将第二导电层平坦化以暴露图案化硬掩模层的表面。 第二导电层的表面被氧化形成氧化物层。 图案化的硬掩模层和氧化物层以及图案化的硬掩模层下面的第一导电层被去除。

公开(公告)号：US07135731B2

公开(公告)日：2006-11-14

申请号：US10707396

申请日：2003-12-10

申请人： Ching-Nan Hsiao ,  Ying-Cheng Chuang ,  Chi-Hui Lin

发明人： Ching-Nan Hsiao ,  Ying-Cheng Chuang ,  Chi-Hui Lin

IPC分类号： H01L27/108 ,  H01L29/76 ,  H01L29/94 ,  H01L31/119

CPC分类号： H01L27/10876 ,  H01L27/10841 ,  H01L27/10864 ,  H01L27/10885 ,  Y10S257/905 ,  Y10S257/906 ,  Y10S257/908

摘要： A vertical DRAM and fabrication method thereof. The vertical DRAM has a plurality of memory cells on a substrate, and each of the memory cells has a trench capacitor, a vertical transistor, and a source-isolation oxide layer in a deep trench. The main advantage of the present invention is to form an annular source diffusion and an annular drain diffusion of the vertical transistor around the sidewall of the deep trench. As a result, when a gate of the transistor is turned on, an annular gate channel is provided. The width of the gate channel of the present invention is therefore increased.

摘要翻译： 垂直DRAM及其制造方法。 垂直DRAM在衬底上具有多个存储单元，并且每个存储单元在深沟槽中具有沟槽电容器，垂直晶体管和源极隔离氧化物层。 本发明的主要优点是在深沟槽的侧壁周围形成环形源极扩散和垂直晶体管的环形漏极扩散。 结果，当晶体管的栅极导通时，提供环形栅极沟道。 因此，本发明的栅极通道的宽度增加。

公开(公告)号：US07115477B2

公开(公告)日：2006-10-03

申请号：US10884769

申请日：2004-07-02

申请人： Chung-Lin Huang ,  Ying-Cheng Chuang

发明人： Chung-Lin Huang ,  Ying-Cheng Chuang

IPC分类号： H01L21/336

CPC分类号： H01L29/512 ,  H01L21/26506 ,  H01L21/28194 ,  H01L21/28202 ,  H01L21/2822 ,  H01L29/4983 ,  H01L29/513 ,  H01L29/518 ,  H01L29/6653 ,  H01L29/66553 ,  H01L29/66583

摘要： A gate with dual gate dielectric layer and fabrication method thereof. A semiconductor substrate is provided, on which a dielectric layer and a patterned hard mask layer with an opening are sequentially formed. A spacer is formed on a sidewall of the opening. The semiconductor substrate is ion implanted, the spacer and the exposed dielectric layer are removed, and a gate oxide layer is formed on the bottom of the opening.

摘要翻译： 具有双栅介质层的栅极及其制造方法。 提供半导体衬底，其上依次形成介电层和具有开口的图案化硬掩模层。 间隔件形成在开口的侧壁上。 离子注入半导体衬底，去除间隔物和暴露的电介质层，并且在开口的底部形成栅极氧化物层。

公开(公告)号：US20060088967A1

公开(公告)日：2006-04-27

申请号：US11114735

申请日：2005-04-26

申请人： Ching-Nan Hsiao ,  Ying-Cheng Chuang

发明人： Ching-Nan Hsiao ,  Ying-Cheng Chuang

IPC分类号： H01L21/336

CPC分类号： H01L29/7851 ,  H01L29/66795 ,  H01L29/7854

摘要： The present invention provides a method of manufacturing a FinFET transistor, comprising the steps of: forming a plurality of trenches in a semiconductor substrate, forming a dielectric layer on the semiconductor substrate and filling the trenches, and etching back the dielectric layer to a level below the surface of the substrate to form one or more semiconductor fins standing between the trenches as an active region, such as a source, drain, and channel for the FinFET transistor.

摘要翻译： 本发明提供一种制造FinFET晶体管的方法，包括以下步骤：在半导体衬底中形成多个沟槽，在半导体衬底上形成电介质层并填充沟槽，并将电介质层回蚀刻到低于 衬底的表面以形成一个或多个位于沟槽之间的半导体鳍片作为有源区域，例如用于FinFET晶体管的源极，漏极和沟道。