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    Image sensor chip package
    21.
    发明申请
    Image sensor chip package 失效
    图像传感器芯片封装

    公开(公告)号：US20070023608A1

    公开(公告)日：2007-02-01

    申请号：US11448570

    申请日：2006-06-07

    Applicant: Steven Webster ,  Ying-Cheng Wu

    Inventor： Steven Webster ,  Ying-Cheng Wu

    IPC: C12Q1/68

    CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/16195 ,  H01L2924/00014

    Abstract: A chip package (200) includes a carrier (20), a chip (22), a second conductive means (26) and a transparent cover (28). The carrier (20) includes a base (24). The chip is mounted on the base and has an active area (222). The second conductive means electronically connects the chip with the conductive means. The first adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover is adhered with the first adhesive means so as to define a sealing space (32) for sealing the active area of the chip therein. It can be seen that the active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.

    Abstract translation: 芯片封装（200）包括载体（20），芯片（22），第二导电装置（26）和透明盖（28）。 载体（20）包括基座（24）。 芯片安装在基座上并具有有效区域（222）。 第二导电装置将芯片与导电装置电连接。 第一粘合装置被施加在芯片的有效区域周围。 透明盖安装在托架的底座上。 该盖用第一粘合装置粘合以便限定用于密封芯片的有效区域的密封空间（32）。 可以看出，芯片的有效面积被充分保护，免受小体积密封空间的污染。

    Miniaturization image capturing module and method of manufacturing the same
    23.
    发明授权
    Miniaturization image capturing module and method of manufacturing the same 有权
    小型化图像捕获模块及其制造方法

    公开(公告)号：US08760559B2

    公开(公告)日：2014-06-24

    申请号：US13195901

    申请日：2011-08-02

    Applicant: Ti-Lun Liu ,  Ying-Cheng Wu

    Inventor： Ti-Lun Liu ,  Ying-Cheng Wu

    IPC: H04N5/225 ,  H01L21/00

    CPC classification number: B29C65/5057 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: A miniaturization image capturing module includes a substrate unit, an image capturing unit, a fixing glue unit, and a lens unit. The substrate unit includes a hollow substrate body, a plurality of top conductive pads, a plurality of bottom conductive pads, a plurality of embedded conductive traces. The hollow substrate body has at least one receiving space, and each embedded conductive trace is electrically connected between at least one of the top conductive pads and at least one of the bottom conductive pads. The image capturing unit includes at least one image capturing chip received in the receiving space and electrically connected to the substrate unit. The fixing glue unit includes a fixing glue disposed in the receiving space and fixed between the hollow substrate body and the image capturing chip. The lens unit is disposed on the top side of the hollow substrate body.

    Abstract translation: 小型化图像拍摄模块包括基板单元，图像捕获单元，固定胶单元和透镜单元。 基板单元包括中空基板主体，多个顶部导电焊盘，多个底部导电焊盘，多个嵌入式导电迹线。 中空基板主体具有至少一个接收空间，并且每个嵌入的导电迹线电连接在至少一个顶部导电焊盘和至少一个底部导电焊盘之间。 图像拍摄单元包括容纳在接收空间中并电连接到基板单元的至少一个图像捕获芯片。 固定胶单元包括设置在容纳空间中并固定在中空基板主体和图像捕获芯片之间的固定胶。 透镜单元设置在中空基板主体的顶侧。

    Electronic elements carrier
    24.
    发明授权
    Electronic elements carrier 有权
    电子元件载体

    公开(公告)号：US08085547B2

    公开(公告)日：2011-12-27

    申请号：US11948526

    申请日：2007-11-30

    Applicant: Ying-Cheng Wu ,  Kun-Hsiao Liu

    Inventor： Ying-Cheng Wu ,  Kun-Hsiao Liu

    IPC: H05K1/18

    CPC classification number: H05K1/183 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/4611 ,  H05K3/4697 ,  H05K2201/043 ,  Y10T29/49128 ,  Y10T29/4913

    Abstract: An electronic elements carrier includes a body, at least an electronic element and a filler. The body includes a substrate having a plate and a dam formed on the peripheral of plate, a conductive layer mounted on a surface of the dam, and at least a cavity defined by the plate and the dam of the substrate. The electronic element is disposed in the cavity of the body. The filler is received in the cavity of the substrate for encapsulating, sealing and protecting the electronic element.

    Abstract translation: 电子元件载体包括主体，至少电子元件和填充物。 主体包括具有板和形成在板的周边上的坝的基板，安装在坝的表面上的导电层和至少由板和基板的坝限定的空腔。 电子元件设置在身体的空腔中。 填料被接收在衬底的空腔中，用于封装，密封和保护电子元件。

    Digital camera module packaging method
    25.
    发明授权
    Digital camera module packaging method 有权
    数码相机模块包装方式

    公开(公告)号：US07646429B2

    公开(公告)日：2010-01-12

    申请号：US11595297

    申请日：2006-11-10

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    IPC: H04N5/225

    CPC classification number: H04N5/2253 ,  H04N5/2254

    Abstract: A digital camera module packaging method includes: first, providing a carrier (20) including a base (21) defining a chamber (214) and a lead frame (23). The lead frame has a plurality of conduction pieces (233) embedded in the base. One end of each conduction piece is exposed at one surface of the base, and another end of the conduction piece is exposed at another surface of the base. An image sensor chip (30) with a photosensitive area (301) and a plurality of chip pads (302) is then mounted in the chamber. A plurality of wires (40) is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one exposed end of a corresponding conduction piece of the carrier. A holder (50) is then provided. The carrier is mounted to the holder. Finally, a lens module (70) is mounted on the holder.

    Abstract translation: 一种数字照相机模块封装方法，包括：首先，提供一个载体（20），其包括限定腔室（214）和引线框架（23）的底座（21）。 引线框具有嵌入基座中的多个导电片（233）。 每个导电件的一端在基座的一个表面露出，并且导电件的另一端暴露在基座的另一个表面。 然后将具有感光区域（301）和多个芯片焊盘（302）的图像传感器芯片（30）安装在室中。 然后提供多根电线（40）。 每条导线将图像传感器芯片的相应芯片焊盘和载体的相应导电片的一个暴露端部电连接。 然后提供支架（50）。 承载件安装在支架上。 最后，镜头模块（70）安装在支架上。

    Digital camera module
    26.
    发明授权
    Digital camera module 失效
    数码相机模组

    公开(公告)号：US07408205B2

    公开(公告)日：2008-08-05

    申请号：US11525447

    申请日：2006-09-22

    Applicant: Steven Webster ,  Ying-Cheng Wu

    Inventor： Steven Webster ,  Ying-Cheng Wu

    IPC: H01L29/22 ,  H01L33/00 ,  H01L29/227 ,  H01L29/24 ,  H01L23/495 ,  H01L23/02

    CPC classification number: H01L27/14618 ,  H01L24/73 ,  H01L27/14625 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15311 ,  H04N5/2257 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: A digital camera module (200) includes a carrier (20), an image sensor chip (30), a number of wires (50), a holder (60), and a lens module (70). The carrier includes a base (21) and a leadframe (23) embedded in the base. The base includes a board (211), a sidewall (213) and a cavity (24). The leadframe includes a number of conductive leads (233) spaced from each other. Each lead has a first terminal portion (235), a second terminal portion (236), and an interconnecting portion (237) connecting the first and second terminal portions. The chip is mounted on the carrier, and has an active area (301). The wires electrically connect the chip and the leadframe. The holder is mounted to the carrier to close the cavity. The lens module is received in the holder and guides light to the active area of the chip.

    Abstract translation: 数字照相机模块（200）包括载体（20），图像传感器芯片（30），多个电线（50），保持器（60）和透镜模块（70）。 载体包括嵌入基座中的基座（21）和引线框架（23）。 基座包括板（211），侧壁（213）和空腔（24）。 引线框架包括彼此间隔开的多个导电引线（233）。 每个引线具有连接第一和第二端子部分的第一端子部分（235），第二端子部分（236）和互连部分（237）。 芯片安装在载体上，并具有有效区域（301）。 导线将芯片和引线框架电连接。 保持器安装到载体以封闭空腔。 透镜模块被容纳在保持器中并将光引导到芯片的有效区域。

    Image sensor chip package
    28.
    发明申请
    Image sensor chip package 审中-公开
    图像传感器芯片封装

    公开(公告)号：US20070108561A1

    公开(公告)日：2007-05-17

    申请号：US11525446

    申请日：2006-09-22

    Applicant: Steven Webster ,  Ying-Cheng Wu

    Inventor： Steven Webster ,  Ying-Cheng Wu

    IPC: H01L23/495

    CPC classification number: H01L27/14618 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

    Abstract: An image sensor chip package (200) includes a carrier (20), an image sensor chip (30), a number of wires (50) and a holder (60). The carrier includes a base (21) and a leadframe (23) embedded in the base. The base includes a board (211), a sidewall (213) and a cavity (24). The leadframe includes a plurality of conductive leads (233) spaced from each other. Each lead has a first terminal portion (236), and an interconnecting portion (237) connecting the first and second terminal portions. The chip is mounted on the carrier, and has an active area (301) and a number of contacts (302). The wires electrically connect the contacts of the chip and the first terminal portions of the leadframe. The holder is mounted to the carrier to close the cavity, and allows light to pass therethrough to reach the active area of the chip.

    Abstract translation: 图像传感器芯片封装（200）包括载体（20），图像传感器芯片（30），多个导线（50）和保持器（60）。 载体包括嵌入基座中的基座（21）和引线框架（23）。 基座包括板（211），侧壁（213）和空腔（24）。 引线框架包括彼此间隔开的多个导电引线（233）。 每个引线具有第一端子部分（236）和连接第一和第二端子部分的互连部分（237）。 芯片安装在载体上，并具有有效区域（301）和多个触点（302）。 导线将芯片的触点与引线框架的第一端子部分电连接。 保持器安装到载体上以封闭空腔，并允许光通过，以到达芯片的有效区域。

    Digital camera module package fabrication method
    29.
    发明申请
    Digital camera module package fabrication method 有权
    数码相机模块封装制造方法

    公开(公告)号：US20070057148A1

    公开(公告)日：2007-03-15

    申请号：US11453454

    申请日：2006-06-14

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    IPC: H01J5/02 ,  H01L27/00

    CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/16195 ,  H01L2924/00014

    Abstract: A digital camera module package method includes the steps of: firstly, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces (322); Secondly, mounting an image sensor chip (34) on the base and received in the cavity, the image sensor having a photosensitive area. Thirdly, providing a plurality of wires (36), each electrically connecting the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourthly, applying an adhesive means (3262) around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover (38) on the carrier, where an adhesive means fixes the cover in place.

    Abstract translation: 数字照相机模块封装方法包括以下步骤：首先，提供一种包括基座（24）和引线框架（320）的载体（30）。 基座在其中具有空腔，引线框架包括多个导电片（322）; 其次，将图像传感器芯片（34）安装在基座上并容纳在空腔中，图像传感器具有感光区域。 第三，提供多个电线（36），每个电线电连接图像传感器芯片和载体的相应导电片之一。 第四，在图像传感器芯片周围施加至少部分地覆盖所有电线的粘合装置（3262）。 最后，将透明盖（38）安装在载体上，其中粘合剂将盖固定到位。

    Digital camera module with small sized image sensor chip package
    30.
    发明申请
    Digital camera module with small sized image sensor chip package 有权
    数码相机模块具有小尺寸图像传感器芯片封装

    公开(公告)号：US20060290802A1

    公开(公告)日：2006-12-28

    申请号：US11402467

    申请日：2006-04-12

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Po-Chih Hsu ,  Kun-Hsieh Liu

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Po-Chih Hsu ,  Kun-Hsieh Liu

    IPC: H04N5/225

    CPC classification number: H04N5/2253 ,  H04N5/2254

    Abstract: A digital camera module (200) includes a lens holder (20), a lens module (30) received in the lens holder, and an image sensor chip package (40) mounted to the lens holder. The lens module includes a lens barrel (301) movably engaged in the lens holder and at least one lens (302) received in the lens barrel. The image sensor chip package includes a base (401), an image sensor chip (402) mounted on the base, a transparent cover (405), and an adhesive (50) positioning the transparent cover with respect to the image sensor chip. The adhesive and the transparent cover cooperatively seal the image sensor chip therein.

    Abstract translation: 数码相机模块（200）包括透镜保持器（20），容纳在透镜保持器中的透镜模块（30）和安装到透镜保持器的图像传感器芯片封装（40）。 透镜模块包括可移动地接合在透镜保持器中的透镜镜筒（301）和容纳在镜筒中的至少一个透镜（302）。 图像传感器芯片封装包括基座（401），安装在基座上的图像传感器芯片（402），透明盖（405）和相对于图像传感器芯片定位透明盖的粘合剂（50）。 粘合剂和透明盖协同地将图像传感器芯片密封在其中。

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