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公开(公告)号:US07626327B2
公开(公告)日:2009-12-01
申请号:US11067891
申请日:2005-03-01
IPC分类号: H01J1/62
CPC分类号: A61B17/0206 , A61B1/0638 , A61B1/0653 , A61B1/0684 , A61B1/07 , A61B1/267 , A61B1/307 , A61B90/36 , A61B90/50 , A61B2090/502
摘要: A lighting apparatus which improves identification of living body tissues, and is suitable for medical lighting. In the lighting apparatus, the light output in a range of wavelength 525 to 590 nm is not greater than ⅕ of the light output in a range of wavelength 380 to 780 nm corresponding to visible light components. The peak wavelength of a blue or bluish green light component included in the output light is in a range of 430 to 520 nm, and the peak wavelength of a red light component is not less than 600 nm. A green light component has the peak in a range of wavelength 520 to 590 nm, its spectral half-value width is not greater than 70 nm, and the light amount of at least the green light component can be independently adjusted.
摘要翻译: 一种改善身体组织识别的照明装置,适用于医疗照明。 在照明装置中,在波长525〜590nm的范围内的光输出不大于对应于可见光分量的380〜780nm波长范围内的光输出的1/5。 输出光中包含的蓝色或蓝绿色光分量的峰值波长在430〜520nm的范围内,红色光分量的峰值波长不小于600nm。 绿色光分量在波长520〜590nm的范围内具有峰值,其光谱半值宽度不大于70nm,并且可以独立地调节至少绿色光成分的光量。
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公开(公告)号:US20080259607A1
公开(公告)日:2008-10-23
申请号:US12149570
申请日:2008-05-05
申请人: Junichi Shimada , Yoichi Kawakami
发明人: Junichi Shimada , Yoichi Kawakami
IPC分类号: F21V29/00
CPC分类号: F21V23/06 , F21K9/20 , F21V29/505 , F21Y2115/10 , H01L25/0753 , H01L33/641 , H01L2924/0002 , H01L2924/00
摘要: The present invention is achieved with the object of providing an illumination system formed of an LED light emitting body and a socket which can appropriately release heat from LED chips. This object is achieved in the following manner. A heat conducting layer 12 made of diamond is provided on a substrate 11, and on top of this, a conductive layer 13 having a predetermined pattern is formed. LED chips 16 are mounted in predetermined positions on the conductive layer 13. Terminals of the conductive layer 13 and electrodes of the LED chips 16 are connected to each other. A connector part 14 for the connection to a socket is provided in an end portion of the substrate 11. The heat conducting layer 12 on the connector part 14 makes thermal contact with the heat conducting layer provided on the inner surface of the opening of the socket. A current is supplied to respective LED chips 16 through the conductive layer 13 from the socket, and respective LED chips 16 emit light. Heat that is generated in the LED chips 16 is released to the outside of the illumination system from the socket through the conductive layer 13, the heat conducting layer 12 and the connector part 14. As a result of this, an increase in the temperature of the LED chips 16 can be prevented, and an LED illumination system that emits a large amount of light can be formed.
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公开(公告)号:US20050194876A1
公开(公告)日:2005-09-08
申请号:US11067891
申请日:2005-03-01
IPC分类号: F21V9/08 , A61B1/04 , A61B1/06 , A61B1/07 , A61B1/267 , A61B1/307 , A61B17/02 , A61B19/00 , F21W131/205 , F21Y101/02 , H01K1/26
CPC分类号: A61B17/0206 , A61B1/0638 , A61B1/0653 , A61B1/0684 , A61B1/07 , A61B1/267 , A61B1/307 , A61B90/36 , A61B90/50 , A61B2090/502
摘要: The present invention provides a lighting apparatus which improves identification of living body tissues, and is suitable for medical lighting. In the lighting apparatus, the light output in a range of wavelength 525 to 590 nm is not greater than ⅕ of the light output in a range of wavelength 380 to 780 nm corresponding to visible light components. The peak wavelength of a blue or bluish green light component included in the output light is in a range 430 to 520 nm, and the peak wavelength of a red light component is not less than 600 nm. A green light component has the peak in a range of wavelength 520 to 590 nm, its spectral half-value width is not greater than 70 nm, and the light amount of at least the green light component can be independently adjusted.
摘要翻译: 本发明提供一种改善身体组织识别的照明装置,适用于医疗照明。 在照明装置中,在波长525〜590nm的范围内的光输出不大于对应于可见光分量的380〜780nm波长范围内的光输出的1/5。 包含在输出光中的蓝色或蓝绿色光分量的峰值波长在430〜520nm的范围内,红色光分量的峰值波长不小于600nm。 绿色光分量在波长520〜590nm的范围内具有峰值,其光谱半值宽度不大于70nm,并且可以独立地调节至少绿色光成分的光量。
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公开(公告)号:US08114286B2
公开(公告)日:2012-02-14
申请号:US12342441
申请日:2008-12-23
申请人: Yoichi Kawakami
发明人: Yoichi Kawakami
CPC分类号: B01D61/08 , B01D61/10 , C02F1/001 , C02F1/283 , C02F1/441 , C02F1/444 , C02F9/005 , C02F2201/003 , C02F2209/42 , C02F2301/024 , C02F2301/026
摘要: Prior water treatment equipments have several water clarifying process filters, water purifier and water reservoir separated from each other, occupying too much space to install under a water tank and resulting inconvenient installment. The water treatment equipments for home cannot be received in water tanks, and thus water clarifier and water purifier are disposed in the water tanks while the water reservoir is disposed separately. Water pipes are connected in between. Therefore, water clarifying processors, water reservoir and water purifier utilizing RO membrane may be integrated to eliminate unnecessary space in existing systems.
摘要翻译: 以前的水处理设备有几个水净化过滤器,净水器和水箱彼此分离,占用太多的空间,安装在水箱下面,造成不便之处。 家用水处理设备不能接收在水箱中,水箱分开处理时,水箱和净水器都放在水箱内。 水管之间连接。 因此,利用RO膜的净水处理器,储水池和净水器可以集成在一起,以消除现有系统中不必要的空间。
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公开(公告)号:US07834434B2
公开(公告)日:2010-11-16
申请号:US12149570
申请日:2008-05-05
申请人: Junichi Shimada , Yoichi Kawakami
发明人: Junichi Shimada , Yoichi Kawakami
IPC分类号: H01L23/495
CPC分类号: F21V23/06 , F21K9/20 , F21V29/505 , F21Y2115/10 , H01L25/0753 , H01L33/641 , H01L2924/0002 , H01L2924/00
摘要: The present invention is achieved with the object of providing an illumination system formed of an LED light emitting body and a socket which can appropriately release heat from LED chips. This object is achieved in the following manner. A heat conducting layer 12 made of diamond is provided on a substrate 11, and on top of this, a conductive layer 13 having a predetermined pattern is formed. LED chips 16 are mounted in predetermined positions on the conductive layer 13. Terminals of the conductive layer 13 and electrodes of the LED chips 16 are connected to each other. A connector part 14 for the connection to a socket is provided in an end portion of the substrate 11. The heat conducting layer 12 on the connector part 14 makes thermal contact with the heat conducting layer provided on the inner surface of the opening of the socket. A current is supplied to respective LED chips 16 through the conductive layer 13 from the socket, and respective LED chips 16 emit light. Heat that is generated in the LED chips 16 is released to the outside of the illumination system from the socket through the conductive layer 13, the heat conducting layer 12 and the connector part 14. As a result of this, an increase in the temperature of the LED chips 16 can be prevented, and an LED illumination system that emits a large amount of light can be formed.
摘要翻译: 本发明的目的是提供一种由LED发光体和能够适当地从LED芯片释放热量的插座形成的照明系统。 该目的以如下方式实现。 在基板11上设置由金刚石制成的导热层12,并且在其上形成具有预定图案的导电层13。 LED芯片16安装在导电层13上的预定位置。导电层13的端子和LED芯片16的电极彼此连接。 用于连接到插座的连接器部分14设置在基板11的端部。连接器部分14上的导热层12与设置在插座的开口的内表面上的导热层热接触 。 从插座通过导电层13向相应的LED芯片16提供电流,并且各个LED芯片16发光。 在LED芯片16中产生的热量通过导电层13,导热层12和连接器部分14从插座释放到照明系统的外部。其结果是, 可以防止LED芯片16,并且可以形成发射大量光的LED照明系统。
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公开(公告)号:US07400029B2
公开(公告)日:2008-07-15
申请号:US10539079
申请日:2003-12-15
申请人: Junichi Shimada , Yoichi Kawakami
发明人: Junichi Shimada , Yoichi Kawakami
IPC分类号: H01L29/06
CPC分类号: F21V23/06 , F21K9/20 , F21V29/505 , F21Y2115/10 , H01L25/0753 , H01L33/641 , H01L2924/0002 , H01L2924/00
摘要: The present invention is achieved with the object of providing an illumination system formed of an LED light emitting body and a socket which can appropriately release heat from LED chips. This object is achieved in the following manner. A heat conducting layer 12 made of diamond is provided on a substrate 11, and on top of this, a conductive layer 13 having a predetermined pattern is formed. LED chips 16 are mounted in predetermined positions on the conductive layer 13. Terminals of the conductive layer 13 and electrodes of the LED chips 16 are connected to each other. A connector part 14 for the connection to a socket is provided in an end portion of the substrate 11. The heat conducting layer 12 on the connector part 14 makes thermal contact with the heat conducting layer provided on the inner surface of the opening of the socket. A current is supplied to respective LED chips 16 through the conductive layer 13 from the socket, and respective LED chips 16 emit light. Heat that is generated in the LED chips 16 is released to the outside of the illumination system from the socket through the conductive layer 13, the heat conducting layer 12 and the connector part 14. As a result of this, an increase in the temperature of the LED chips 16 can be prevented, and an LED illumination system that emits a large amount of light can be formed.
摘要翻译: 本发明的目的是提供一种由LED发光体和能够适当地从LED芯片释放热量的插座形成的照明系统。 该目的以如下方式实现。 在基板11上设置由金刚石制成的导热层12,并且在其上形成具有预定图案的导电层13。 LED芯片16安装在导电层13上的预定位置。 导电层13的端子和LED芯片16的电极彼此连接。 用于连接到插座的连接器部分14设置在基板11的端部。 连接器部14上的导热层12与设置在插座的开口的内表面上的导热层进行热接触。 从插座通过导电层13向相应的LED芯片16提供电流,并且各个LED芯片16发光。 在LED芯片16中产生的热量通过导电层13,导热层12和连接器部分14从插座释放到照明系统的外部。 结果,可以防止LED芯片16的温度升高,并且可以形成发射大量光的LED照明系统。
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公开(公告)号:US20070190206A1
公开(公告)日:2007-08-16
申请号:US11703750
申请日:2007-02-08
申请人: Yoichi Kawakami
发明人: Yoichi Kawakami
IPC分类号: A21D8/02
摘要: In a method of producing bread which includes the steps of mixing separate leaven or yeast into bread dough, fermenting the dough, dividing and forming the dough, fermenting the dough again, and baking the thus fermented dough, the baking step includes at least one baking stage and at least in the final stage of baking, the dough is baked using superheated steam. The dough may be first baked partially, and after storing at room temperature or freezing, the dough may be completely baked. There is also provided a method of producing raisin yeast bread which includes the steps of fermenting water extracts of raisins and flour, further fermenting the mixture for 10 to 20 days while adding flour and water to obtain ripe raisin leaven, mixing the ripe leaven into separate leaven or bread dough, fermenting the mixture, dividing and forming the mixture, fermenting the thus divided and formed dough first at 20-25° C. for 0.5 to 2 hours, then at a low temperature of 2-10° C. for 7 to 22 hours, and finally at 20-25° C. for 1 to 6 hours, and baking the thus fermented dough. At least in the final stage of baking step, the dough is baked using superheated steam.
摘要翻译: 在一种生产面包的方法中,包括将单独的酵母或酵母混合成面团生面团,发酵面团,分成和形成面团,再次发酵面团,以及烘烤发酵面团,焙烤步骤包括至少一次烘烤 并且至少在烘烤的最后阶段,使用过热蒸汽烘烤面团。 面团可以首先被部分烘烤,并且在室温下贮存或冷冻后,面团可以被完全烘烤。 还提供了一种生产葡萄干酵母面包的方法,其中包括发酵葡萄干和面粉水提取物的步骤,进一步发酵混合物10至20天,同时加入面粉和水以获得成熟的葡萄干发酵,将成熟的酵母混合成分离 酵母或面包面团,发酵混合物,分离和形成混合物,首先在20-25℃下将分裂形成的面团发酵0.5至2小时,然后在2-10℃的低温下发酵7 至22小时,最后在20-25℃下搅拌1至6小时,并烘焙发酵的面团。 至少在烘烤步骤的最后阶段,使用过热蒸汽烘烤面团。
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公开(公告)号:US20050276052A1
公开(公告)日:2005-12-15
申请号:US10539079
申请日:2003-12-15
申请人: Junichi Shimada , Yoichi Kawakami
发明人: Junichi Shimada , Yoichi Kawakami
IPC分类号: F21V29/00 , F21S2/00 , F21S8/04 , F21V7/20 , F21Y101/02 , H01L25/075 , H01L33/48 , H01L33/60 , H01L33/64 , H01R13/533
CPC分类号: F21V23/06 , F21K9/20 , F21V29/505 , F21Y2115/10 , H01L25/0753 , H01L33/641 , H01L2924/0002 , H01L2924/00
摘要: The present invention is achieved with the object of providing an illumination system formed of an LED light emitting body and a socket which can appropriately release heat from LED chips. This object is achieved in the following manner. A heat conducting layer 12 made of diamond is provided on a substrate 11, and on top of this, a conductive layer 13 having a predetermined pattern is formed. LED chips 16 are mounted in predetermined positions on the conductive layer 13. Terminals of the conductive layer 13 and electrodes of the LED chips 16 are connected to each other. A connector part 14 for the connection to a socket is provided in an end portion of the substrate 11. The heat conducting layer 12 on the connector part 14 makes thermal contact with the heat conducting layer provided on the inner surface of the opening of the socket. A current is supplied to respective LED chips 16 through the conductive layer 13 from the socket, and respective LED chips 16 emit light. Heat that is generated in the LED chips 16 is released to the outside of the illumination system from the socket through the conductive layer 13, the heat conducting layer 12 and the connector part 14. As a result of this, an increase in the temperature of the LED chips 16 can be prevented, and an LED illumination system that emits a large amount of light can be formed.
摘要翻译: 本发明的目的是提供一种由LED发光体和能够适当地从LED芯片释放热量的插座形成的照明系统。 该目的以如下方式实现。 在基板11上设置由金刚石制成的导热层12,并且在其上形成具有预定图案的导电层13。 LED芯片16安装在导电层13上的预定位置。导电层13的端子和LED芯片16的电极彼此连接。 用于连接到插座的连接器部分14设置在基板11的端部。连接器部分14上的导热层12与设置在插座的开口的内表面上的导热层热接触 。 从插座通过导电层13向相应的LED芯片16提供电流,并且各个LED芯片16发光。 在LED芯片16中产生的热量通过导电层13,导热层12和连接器部分14从插座释放到照明系统的外部。其结果是, 可以防止LED芯片16,并且可以形成发射大量光的LED照明系统。
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