公开(公告)号：US07130379B2

公开(公告)日：2006-10-31

申请号：US10445856

申请日：2003-05-28

Applicant: Hendrik F. Hamann ,  Yves Martin ,  Theodore G. van Kessel ,  Hemantha K. Wickramasinghe

Inventor： Hendrik F. Hamann ,  Yves Martin ,  Theodore G. van Kessel ,  Hemantha K. Wickramasinghe

IPC: H01J35/08

CPC classification number: H01J35/08 ,  G21K7/00 ,  H01J2235/083 ,  H01J2235/086

Abstract: A device for generating an x-ray point source includes a target, and an electron source for producing electrons which intersect with the target to generate an x-ray point source having a size which is confined by a dimension of the target.

Abstract translation: 用于产生x射线点源的装置包括靶，以及用于产生与靶相交的电子的电子源，以产生具有被靶的尺寸限制的尺寸的x射线点源。

公开(公告)号：US06771445B1

公开(公告)日：2004-08-03

申请号：US09540726

申请日：2000-03-31

Applicant: Hendrik F. Hamann ,  Yves Martin ,  Hemantha Kumar Wickramasinghe

Inventor： Hendrik F. Hamann ,  Yves Martin ,  Hemantha Kumar Wickramasinghe

IPC: G11B502

CPC classification number: B82Y10/00 ,  G11B5/00 ,  G11B5/09 ,  G11B9/1409 ,  G11B2005/0002 ,  G11B2005/0005 ,  G11B2005/0021

Abstract: An assembly for writing/reading high-density data on a recording media as a series of tags comprising a magnetic information bit pattern. The assembly includes an antenna positionable near the media; a source of electromagnetic radiation for producing an incident wave at least a portion of which can be coupled to the antenna; and, a means for coordinating a mutual positioning of the source of the electromagnetic radiation and the antenna, so that the antenna can generate a highly localized electromagnetic field in the vicinity of the media for inducing localized heating of the media. The assembly is capable of writing/erasing said high-density data by using an information signal for modulating the localized field generated in the vicinity of the media; the assembly is capable of reading by coordinating the mutual positioning of the antenna and the media.

Abstract translation: 一种用于在记录介质上写入/读取高密度数据的组件，作为包括磁信息位模式的一系列标签。 组件包括可在介质附近定位的天线; 用于产生入射波的电磁辐射源，其至少一部分可耦合到天线; 以及用于协调电磁辐射源和天线的相互定位的装置，使得天线可以在介质附近产生高度局部化的电磁场，用于引起介质的局部加热。 该组件能够通过使用用于调制在介质附近产生的局部场的信息信号来写/擦除所述高密度数据; 该组件能够通过协调天线和介质的相互定位来读取。

公开(公告)号：US06757235B2

公开(公告)日：2004-06-29

申请号：US09774851

申请日：2001-01-31

Applicant: Hemantha Kumar Wickramasinghe ,  Hendrik F. Hamann ,  Yves Martin

Inventor： Hemantha Kumar Wickramasinghe ,  Hendrik F. Hamann ,  Yves Martin

IPC: G11B700

CPC classification number: B82Y10/00 ,  G11B9/00 ,  G11B9/14 ,  G11B9/1409 ,  G11B9/1418 ,  G11B9/1436

Abstract: An assembly suitable for reading data based on thermal coupling. The assembly can realize resolution/density specifications that can transcend diffraction limited focused laser beam techniques. The assembly includes a temperature sensor supported by a head-like structure, the temperature sensor capable of monitoring thermal coupling between the sensor and a media, and a heater element for heating the temperature sensor. A controller is used for coordinating a mutual positioning of the head-like structure and the media so that changes of thermal coupling between the assembly and a media provide indicia of a media bit pattern.

Abstract translation: 一种适合基于热耦合读取数据的组件。 该组件可以实现可以超越衍射限制聚焦的激光束技术的分辨率/密度规格。 组件包括由头状结构支撑的温度传感器，能够监测传感器和介质之间的热耦合的温度传感器和用于加热温度传感器的加热器元件。 控制器用于协调头状结构和介质的相互定位，使得组件和介质之间的热耦合的改变提供媒体位图案的标记。

公开(公告)号：US06433310B1

公开(公告)日：2002-08-13

申请号：US09773346

申请日：2001-01-31

Applicant: Hemantha Kumar Wickramasinghe ,  Hendrik F. Hamann ,  Yves Martin

Inventor： Hemantha Kumar Wickramasinghe ,  Hendrik F. Hamann ,  Yves Martin

IPC: G11C700

CPC classification number: B82Y10/00 ,  G11B9/14 ,  G11B9/1409 ,  G11B9/1418 ,  G11B2005/0021

Abstract: A thermal assembly comprising at once a reading-writing-erasing capability. The present invention, accordingly, can realize important advantages of providing dual yet independent capabilities or functionalities for manifesting reading-writing-erasing on the nanometer scale. An illustrative such thermal assembly includes a thermal heater for writing on a media; a temperature sensor capable of monitoring thermal coupling between the sensor and the media; and, a heater element for heating the temperature sensor.

Abstract translation: 一种热组件，其一次包括读写擦除能力。 因此，本发明可以实现提供双重但独立的能力或功能的重要优点，用于在纳米尺度上显示读写擦除。 说明性的这种热组件包括用于在介质上书写的热加热器; 温度传感器，能够监测传感器和介质之间的热耦合; 以及用于加热温度传感器的加热器元件。

公开(公告)号：US5382795A

公开(公告)日：1995-01-17

申请号：US209682

申请日：1994-03-10

Applicant: Thomas Bayer ,  Johann Greschner ,  Yves Martin ,  Helga Weiss ,  Hemantha K. Wickramasinghe ,  Olaf Wolter

Inventor： Thomas Bayer ,  Johann Greschner ,  Yves Martin ,  Helga Weiss ,  Hemantha K. Wickramasinghe ,  Olaf Wolter

IPC: G01B7/34 ,  G01B21/30 ,  G01N27/00 ,  G01Q10/04 ,  G01Q60/04 ,  G01Q60/16 ,  G01Q60/38 ,  G01Q70/10 ,  H01J37/28 ,  H01L21/00 ,  H01L21/66

CPC classification number: G01Q60/38 ,  B82Y35/00 ,  G01Q60/04 ,  G01Q60/16 ,  G01Q70/10 ,  Y10S977/878

Abstract: An ultrafine tip for AFM and STM profilometry of trenches having sidewalls. The tip includes a lateral circumferential edge protrusion to allow profilometry of the sidewalls of a trench located in a semiconductor or insulator substrate.

Abstract translation: 具有侧壁的沟槽的AFM和STM轮廓测量法的超细尖端。 尖端包括侧向周向边缘突起，以允许位于半导体或绝缘体衬底中的沟槽的侧壁的轮廓测量。

公开(公告)号：US5347854A

公开(公告)日：1994-09-20

申请号：US948503

申请日：1992-09-22

Applicant: Yves Martin ,  Hemantha K. Wickramasinghe

Inventor： Yves Martin ,  Hemantha K. Wickramasinghe

IPC: G01B21/30 ,  G01B5/28 ,  G01B7/34 ,  G01N27/00 ,  G01Q10/06 ,  G01Q20/00 ,  G01Q60/32 ,  G01Q60/36 ,  G01Q60/38

CPC classification number: G01Q10/06 ,  B82Y35/00 ,  G01Q60/32 ,  G01Q60/363 ,  G01Q60/38 ,  G01Q70/10 ,  Y10S977/851

Abstract: Two dimensional profiling of samples, such as integrated circuits containing trenches or lines, is accomplished using contact force atomic force microscopy by controlling the tip position responsive to the real-time measured local slope of the surface in contact with the tip.

Abstract translation: 使用接触力原子力显微镜，通过控制尖端位置来响应于与尖端接触的表面的实时测量的局部斜率来实现样品的二维轮廓，例如包含沟槽或线的集成电路。

公开(公告)号：US3962064A

公开(公告)日：1976-06-08

申请号：US503928

申请日：1974-09-13

Applicant: Albert Brut ,  Gerard Nave ,  Jean-Pierre Deleuil ,  Jean-Claude Brun ,  Yves Martin

Inventor： Albert Brut ,  Gerard Nave ,  Jean-Pierre Deleuil ,  Jean-Claude Brun ,  Yves Martin

IPC: C25C1/02 ,  C25C3/02 ,  C25C7/00 ,  C25C7/08

CPC classification number: C25C1/02 ,  C25C3/02 ,  C25C7/005

Abstract: A readily oxidizable metal such as lithium formed along a cathode is collected in an electrolytic tank within a collecting chamber, the level of electrolyte is caused to rise to a predetermined top level at which the lithium leaves the collecting chamber and overflows into a transfer compartment, the level of electrolyte is lowered to a predetermined bottom level at which the poured-off lithium leaves the transfer compartment and passes to the discharge compartment, the level of electrolyte is raised to the top level in order to ensure overflow into a discharge tube. A stream of inert gas is passed into the discharge compartment and the lithium is transferred to a chamber for treatment in an inert atmosphere and conversion to ingots in the pure state.

公开(公告)号：US08776868B2

公开(公告)日：2014-07-15

申请号：US12550090

申请日：2009-08-28

Applicant: Yves Martin ,  Theodore G. Van Kessel

Inventor： Yves Martin ,  Theodore G. Van Kessel

IPC: F28F7/00

CPC classification number: F28F3/12 ,  F28D2021/0031 ,  F28F2230/00 ,  F28F2255/02 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/53113 ,  H01L2924/00

Abstract: A cooling device for cooling a computer includes: a flexible and conformal fluid heat-exchanger coupled to a surface of the computer; a liquid coolant material circulated through the fluid heat-exchanger to convey heat from the fluid to an external cooling apparatus; an enclosure defined when the fluid heat-exchanger is placed against the computer surface; and a vacuum applied to the enclosure, removably sealing the fluid heat-exchanger to the computer to provide a vapor seal for the enclosure.

Abstract translation: 用于冷却计算机的冷却装置包括：耦合到计算机的表面的柔性和保形流体热交换器; 循环通过流体热交换器以将热量从流体传送到外部冷却装置的液体冷却剂材料; 当流体热交换器抵靠计算机表面放置时限定的外壳; 以及施加到外壳的真空，可移除地将流体热交换器密封到计算机以为外壳提供蒸气密封。

公开(公告)号：US08596655B2

公开(公告)日：2013-12-03

申请号：US13084713

申请日：2011-04-12

Applicant: Martin Belanger ,  Yves Martin ,  Mathieu Boivin ,  Martin Gauthier

Inventor： Martin Belanger ,  Yves Martin ,  Mathieu Boivin ,  Martin Gauthier

IPC: B62B3/00 ,  B62B3/06

CPC classification number: B29C65/483 ,  B29C65/524 ,  B29C65/562 ,  B29C65/565 ,  B29C66/126 ,  B29C66/322 ,  B29C66/474 ,  B29C66/54 ,  B29C66/721 ,  B29C66/7212 ,  B29C66/72141 ,  B29C66/72525 ,  B29C66/8322 ,  B29C70/443 ,  B62B5/0006 ,  B64D11/0007 ,  F16B5/126 ,  F16B11/006 ,  F16B21/16 ,  Y10T428/24008 ,  Y10T428/24017 ,  Y10T428/24322 ,  B29K2309/08

Abstract: Is hereby provided a method of securing a plastic part to a composite structure, the method comprising providing a composite structure, performing at least one hole in the composite structure, providing a plastic part including a surface and at least one pin extending therefrom, the at least one pin being sized and designed to mate with the at least one hole to create a clamping force capable of temporarily securing the plastic part to the composite structure, applying bonding material between the surface and the composite structure to bond the surface to the composite structure, engaging the at least one pin with the corresponding at least one hole and adding pressure to engage the at least one pin with the corresponding at least one hole and spreading the bonding material between the plastic part and the composite structure, and curing the bonding material to permanently secure the additional part to the composite structure. A plastic part adapted to be secured to a composite structure with pins thereof and a composite materials galley cart comprising parts secured thereof with pins are also hereby provided.

Abstract translation: 因此提供了将塑料部件固定到复合结构的方法，该方法包括提供复合结构，在复合结构中执行至少一个孔，提供包括表面的塑料部分和从其延伸的至少一个销， 至少一个销尺寸和设计成与所述至少一个孔配合以产生能够暂时将所述塑料部件固定到所述复合结构上的夹紧力，在所述表面和所述复合结构之间施加结合材料以将所述表面粘合到所述复合结构 将所述至少一个销与相应的至少一个孔接合并且增加压力以将所述至少一个销与相应的至少一个孔接合并将所述粘合材料铺展在所述塑料部分和所述复合结构之间，并且固化所述接合材料 将附加部件永久固定到复合结构体上。 还提供了一种塑料部件，其适于被固定到具有销的复合结构和复合材料厨房车，其包括用销固定的部件。

公开(公告)号：US08455998B2

公开(公告)日：2013-06-04

申请号：US13251371

申请日：2011-10-03

Applicant: Sushumna Iruvanti ,  Yves Martin ,  Theodore van Kessel ,  Xiaojin Wei

Inventor： Sushumna Iruvanti ,  Yves Martin ,  Theodore van Kessel ,  Xiaojin Wei

IPC: H01L23/34

CPC classification number: H01L23/433 ,  H01L23/10 ,  H01L23/367 ,  H01L24/32 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/83385 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/167 ,  H01L2924/3511 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2924/00014 ,  H01L2224/8381

Abstract: A method and a package for circuit chip package having a bent structure. The circuit chip package includes: a substrate having a first coefficient of thermal expansion (CTE); a circuit chip, having a second CTE, mounted onto the substrate; a metal foil disposed on the circuit chip in thermal contact with the chip; a metal lid having (i) a third CTE that is different from the first CTE and (ii) a bottom edge region, where the metal lid is disposed on the metal foil in thermal contact with the metal foil; and an adhesive layer along the bottom edge of the metal lid, cured at a first temperature, bonding the lid to the substrate, producing an assembly which, at a second temperature, is transformed to a bent circuit chip package.

Abstract translation: 一种具有弯曲结构的电路芯片封装的方法和封装。 电路芯片封装包括：具有第一热膨胀系数（CTE）的衬底; 具有安装在所述基板上的第二CTE的电路芯片; 设置在与芯片热接触的电路芯片上的金属箔; 金属盖，其具有（i）与第一CTE不同的第三CTE和（ii）底部边缘区域，金属盖设置在与金属箔热接触的金属箔上; 以及沿着金属盖的底部边缘的粘合剂层，在第一温度下固化，将盖结合到基底上，产生在第二温度下被转换成弯曲的电路芯片封装的组件。