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268 条记录 (耗时 0.027 秒)

    Switchgear
    21.
    发明授权
    Switchgear 有权
    开关柜

    公开(公告)号：US08743532B2

    公开(公告)日：2014-06-03

    申请号：US13262022

    申请日：2009-08-25

    申请人： Tomotaka Yano ,  Satoru Yoshida ,  Masahiro Arioka

    发明人： Tomotaka Yano ,  Satoru Yoshida ,  Masahiro Arioka

    IPC分类号： H05K7/20

    CPC分类号： H02B13/025 ,  F28F2013/008 ,  H01H9/52 ,  H02B1/56 ,  H02B13/0352

    摘要： In order to obtain a switchgear which can improve heat dissipation efficiency, in the switchgear which dissipates heat outside an apparatus vessel, the heat being generated from an electrical apparatus placed in the apparatus vessel, the switchgear includes a first heat conductor in which one side is connected to a heat generation portion of the apparatus vessel and the other side is extended toward the apparatus vessel side, a second heat conductor in which one side is disposed near the other side of the first heat conductor and the other side is extended outside the apparatus vessel, and an insulating member between conductors disposed between the other side of the first heat conductor and one side of the second heat conductor.

    摘要翻译： 为了获得能够提高散热效率的开关装置，在将设备容器外部的热量散发的开关装置中，从放置在装置容器内的电气设备产生的热量，开关装置包括：第一导热体， 连接到装置容器的发热部分，另一侧朝向装置容器侧延伸;第二导热体，其一侧设置在第一导热体的另一侧附近，另一侧延伸到装置外侧 容器，以及设置在第一导热体的另一侧和第二导热体的一侧之间的导体之间的绝缘构件。

    Heat switch array for thermal hot spot cooling
    23.
    发明授权
    Heat switch array for thermal hot spot cooling 有权
    用于热热点冷却的热开关阵列

    公开(公告)号：US08659903B2

    公开(公告)日：2014-02-25

    申请号：US13312849

    申请日：2011-12-06

    申请人： David Eric Schwartz

    发明人： David Eric Schwartz

    IPC分类号： H05K7/20 ,  F25B21/02 ,  F28F27/02

    CPC分类号： F25B21/02 ,  F28F13/00 ,  F28F27/00 ,  F28F2013/008 ,  F28F2270/00 ,  H01L23/34 ,  H01L23/38 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A device has a passive cooling device having a surface, at least one active cooling device on the surface of the passive cooling device, and a thermal switch coupled to the passive cooling device, the switch having a first position that connects the active cooling device to a path of high thermal conductivity and a second position that connects the passive cooling device to the path of high thermal conductivity.

    摘要翻译： 一种设备具有被动冷却装置，其具有表面，在被动冷却装置的表面上的至少一个主动冷却装置和耦合到被动冷却装置的热开关，所述开关具有将主动冷却装置连接到 高导热性的路径和将被动冷却装置连接到高导热性路径的第二位置。

    Heat Dissipation Switch
    24.
    发明申请
    Heat Dissipation Switch 有权
    散热开关

    公开(公告)号：US20130314202A1

    公开(公告)日：2013-11-28

    申请号：US13477414

    申请日：2012-05-22

    申请人： Douglas Aaron Bolton

    发明人： Douglas Aaron Bolton

    IPC分类号： H01H37/32

    CPC分类号： F28F13/00 ,  F28F2013/008 ,  H01L23/34 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The disclosure herein provides for heat dissipation switches and systems, as well as their use for dissipating excess heat from a heat source. Various aspects of a heat dissipation switch may include a thermally isolating material having a number of conductive element cavities. A number of thermally switched conductive elements may nest within the conductive element cavities either independently or as part of a thermally switched sheet. The material of the thermally switched conductive elements may be configured to deform in response to a temperature change through a threshold temperature or temperature range in order to create or interrupt heat flow paths from the heat source to a heat sink.

    摘要翻译： 本文的公开内容提供了散热开关和系统，以及它们用于从热源散发多余热量的用途。 散热开关的各个方面可以包括具有多个导电元件空腔的隔热材料。 多个热转换导电元件可以独立地或作为热转换片的一部分嵌入导电元件空腔内。 热交换导电元件的材料可以被配置为响应于通过阈值温度或温度范围的温度变化而变形，以便产生或中断从热源到散热器的热流路径。

    Wall cooling device
    25.
    发明授权
    Wall cooling device 有权
    墙体冷却装置

    公开(公告)号：US08561386B2

    公开(公告)日：2013-10-22

    申请号：US12988398

    申请日：2009-04-15

    申请人： Claude Marcel Mons

    发明人： Claude Marcel Mons

    IPC分类号： F02K99/00

    CPC分类号： F28F1/10 ,  C08L2201/12 ,  F01D25/12 ,  F02C7/12 ,  F02K3/06 ,  F02K3/077 ,  F05D2260/2214 ,  F05D2260/22141 ,  F05D2300/505 ,  F28F2013/008 ,  F28F2255/04 ,  Y02T50/676

    摘要： A wall-cooling device for cooling a wall subjected to a heat source and to an outer fluid. The device includes a cooling part with a fastening portion and a cooling portion. The cooling part is made of a thermally-conductive shape-memory alloy having a transition temperature T. The fastener portion is for fastening the device rigidly on a face of the wall. The cooling portion is shaped so that it takes up a first position that is substantially parallel to the wall when the temperature of the wall is lower than the temperature T and so that it takes up a second position in which a plane of the second portion defines, relative to a plane tangential to the wall, a dihedral angle lying in the range 45° to 90° .

    摘要翻译： 一种用于冷却经受热源和外部流体的壁的壁冷却装置。 该装置包括具有紧固部分和冷却部分的冷却部分。 冷却部件由具有转变温度T的导热形状记忆合金制成。紧固件部分用于将装置刚性地紧固在壁的表面上。 冷却部分成形为当壁的温度低于温度T时，其占据基本上平行于壁的第一位置，并且使得其占据第二位置，其中第二部分的平面限定在第二位置 相对于与壁相切的平面，位于45°至90°范围内的二面角。

    FLEXIBLE METALLIC HEAT CONNECTOR
    26.
    发明申请
    FLEXIBLE METALLIC HEAT CONNECTOR 有权
    柔性金属热连接器

    公开(公告)号：US20130206363A1

    公开(公告)日：2013-08-15

    申请号：US13750078

    申请日：2013-01-25

    申请人： GENERAL ELECTRIC COMPANY

    发明人： Graham Charles Kirk ,  Stuart Connolly ,  Tao Deng ,  Zeshan Jabar Hussain ,  Binoy Milan Shah

    IPC分类号： F28F7/00 ,  B23P15/26

    CPC分类号： F28F27/00 ,  B23P15/26 ,  F28D20/02 ,  F28F7/00 ,  F28F2013/008 ,  F28F2255/02 ,  H01L23/40 ,  H01L23/4275 ,  H01L23/4338 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： A thermal connector configured to be placed within a recess of a heat sink between the heat sink and a heat generating component and transfer heat from the component to the heat sink, including a heat spreader configured to fit within the recess of the heat sink, a spring configured to sit between the heat spreader and with the heat sink and bias the heat spreader towards and away from the heat sink, a flexible membrane attached to the heat sink and the heat spreader and seal off the recess, and a phase change material that fills the recess, wherein the flexible membrane contains the phase change material and allows it to contract or expand in response to the movement of the heat spreader towards or away from the heat sink.

    摘要翻译： 一种热连接器，其构造成放置在散热器和发热部件之间的散热器的凹部内，并将热量从部件传递到散热器，包括构造成装配在散热器的凹部内的散热器， 弹簧构造成位于散热器和散热器之间并且将散热器朝向和远离散热器偏置，附接到散热器和散热器并且密封凹部的柔性膜以及相变材料， 填充凹部，其中柔性膜包含相变材料，并且允许其响应于散热器朝向或远离散热器的移动而收缩或膨胀。

    Compliant conduction rail assembly and method facilitating cooling of an electronics structure
    29.
    发明授权
    Compliant conduction rail assembly and method facilitating cooling of an electronics structure 失效
    符合导电组件和促进电子结构冷却的方法

    公开(公告)号：US08094453B2

    公开(公告)日：2012-01-10

    申请号：US12570215

    申请日：2009-09-30

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20772 ,  F28F2013/008 ,  H05K7/20781

    摘要： Compliant conduction rail assembly and method are provided for facilitating cooling of an electronics structure. The rail assembly includes a first thermally conductive rail mounted to a surface of the electronics structure, a second thermally conductive rail thermally conductively interfaced to the first rail, and a biasing mechanism biasing the second rail away from the first rail. The first and second rails and the biasing mechanism are configured for slidable insertion into a housing with the electronics structure, the housing containing a liquid-cooled cold plate(s). With insertion of the electronics structure into the housing, the second rail engages the liquid-cooled cold plate and is forced by the biasing mechanism into thermal contact with the cold plate, and is forced by the cold plate towards the first rail, which results in a compliant thermal interface between the electronics structure and the liquid-cooled cold plate of the housing.

    摘要翻译： 提供符合导轨组件和方法以便于电子结构的冷却。 轨道组件包括安装到电子结构的表面的第一导热轨道，与第一轨道热传导地接合的第二导热轨道，以及将第二轨道偏离第一轨道的偏置机构。 第一和第二轨道和偏置机构构造成可滑动地插入到具有电子结构的壳体中，壳体包含液冷冷板。 通过将电子结构插入壳体中，第二轨道接合液冷冷板，并被偏置机构强制与冷板热接触，并被冷板朝向第一轨道迫使，这导致 在电子结构和壳体的液冷冷板之间的柔性热界面。

    Wall or roof of a building with at least one heat controlling element
    30.
    发明申请
    Wall or roof of a building with at least one heat controlling element 有权
    具有至少一个热控元件的建筑物的墙壁或屋顶

    公开(公告)号：US20110198052A1

    公开(公告)日：2011-08-18

    申请号：US12747279

    申请日：2008-12-10

    申请人： Stephen Glyn Bourne

    发明人： Stephen Glyn Bourne

    IPC分类号： F28D17/00

    CPC分类号： F24S20/66 ,  F24S20/61 ,  F24S20/67 ,  F24S50/80 ,  F24S60/00 ,  F28F2013/008 ,  Y02B10/20 ,  Y02E10/44

    摘要： The invention concerns a wall or roof of a building, wherein at least one heat controlling element for controlling a temperature in the building is arranged in the wall or the roof to form a segment of the wall or roof, the heat controlling element comprising at least a first section and a second section, the first section comprising a heat collecting and storing material and the second section comprising a heat insulating material, wherein the heat controlling element may adopt a first configuration, in which the first section is directed towards the outside of the building and the second section is directed towards the inside of the building, and a second configuration, in which the second section is directed towards the outside of the building and the first section is directed towards the inside of the building.

    摘要翻译： 本发明涉及建筑物的墙壁或屋顶，其中用于控制建筑物中的温度的至少一个热控制元件布置在壁或屋顶中以形成壁或屋顶的一段，该热控制元件至少包括 第一部分和第二部分，第一部分包括集热和储存材料，第二部分包括绝热材料，其中热控制元件可以采用第一构造，其中第一部分指向 建筑物和第二部分被引向建筑物的内部，并且第二构造，其中第二部分指向建筑物的外部，并且第一部分指向建筑物的内部。