-
公开(公告)号：US20200254584A1
公开(公告)日：2020-08-13
申请号：US16641958
申请日：2018-08-11
摘要： The present disclosure provides a fully automatic gemstone polishing robot. An aspect of the present disclosure provides an automatic gemstone polishing robot comprising: a gemstone polishing unit, comprising a gemstone holding unit for supporting a gemstone in contact with an abrasive surface, and configured to polish said gemstone in a plurality of iterations based on a feedback signal; an image capturing unit to capture, in one or more of the plurality of iterations, at least one image of the gemstone; and an image processing unit, which when executed by one or more processors, analyzes said at least one image of the gemstone with respect to one or a plurality of gemstone parameters, wherein the image processing unit is further configured to compare the one or a plurality of analyzed gemstone parameters with one or a plurality of pre-determined gemstone parameters to generate the feedback signal to be transmitted to the gemstone polishing unit. Another aspect of the present disclosure relates to a method of polishing a gemstone utilizing the automatic gemstone polishing robot.
-
公开(公告)号：US10702972B2
公开(公告)日：2020-07-07
申请号：US14476680
申请日：2014-09-03
申请人： EBARA CORPORATION
发明人： Makoto Fukushima , Hozumi Yasuda , Keisuke Namiki , Osamu Nabeya , Shingo Togashi , Satoru Yamaki
IPC分类号： B24B37/32 , B24B49/16 , H01L21/304 , B24B37/005
摘要： A polishing apparatus capable of precisely controlling a polishing profile, particularly a polishing profile in an edge portion, of a wafer is disclosed. The polishing apparatus includes: a top ring shaft; a housing fixed to the top ring shaft; a flexible membrane configured to press a wafer against a polishing pad; a top ring body configured to hold the flexible membrane; a retaining ring coupled to the top ring body and disposed so as to surround the flexible membrane; a gimbal mechanism configured to allow the top ring body and the retaining ring to tilt with respect to the housing; and a local load exerting mechanism configured to exert a downward local load on a part of the retaining ring.
-
公开(公告)号：US20200030937A1
公开(公告)日：2020-01-30
申请号：US16045015
申请日：2018-07-25
发明人： Bach Pangho CHEN
摘要： A grinding machine for grinding non-horizontal grinding surfaces comprises a deformation device which is disposed between a grinding power source and a grinding pad driven by the grinding power source. The deformation device includes a set of an offset unit and the deformation members disposed near one end of the grinding pad, wherein the offset units, the first deformation member and the second deformation member define deformation angles. Therefore, one end of the grinding pad is correspondingly fitted to various non-horizontal grinding surfaces independently through the variable angles of the deformation angle, especially for continuous irregular non-horizontal grinding surfaces. Thus, the present invention has excellent grinding effectiveness.
-
公开(公告)号：US10532443B2
公开(公告)日：2020-01-14
申请号：US15554027
申请日：2016-03-11
发明人： Erwin Junker
摘要： A method is disclosed for grinding grooves on workpieces using a profiled grinding wheel, the profile of which is crushed. A reshaping crush process includes driven crush rollers, each being controlled on the basis of a rotational speed and current consumption. Thus, relative advancement between the grinding wheel and crush roller is controlled according to the speed and current consumption. A grinding machine is also disclosed for grinding a workpiece, wherein the workpiece is held by means of a workpiece spindle head. A crush device comprising a crush roller with a dedicated rotary drive is provided on the grinding machine. The grinding wheel is applied to the crush roller in order to dress the grinding wheel profile. The crush roller has a profile-crushing portion for profile-crushing the grinding wheel with a first dressing volume and a reshaping profile-crushing portion for profile-crushing the grinding wheel with a second dressing volume.
-
公开(公告)号：US10478935B2
公开(公告)日：2019-11-19
申请号：US15831971
申请日：2017-12-05
申请人： FANUC CORPORATION
发明人： Yihua Gu , Takashi Satou
摘要： A deburring apparatus including: a robot that uses a deburring tool to deburr an object supported by a support in a machine tool, a visual sensor, a relative movement mechanism for causing relative movement between the visual sensor and the object supported by the support; and a controller, wherein the controller is configured to conduct: an operation process that operates the relative movement mechanism based on a visual sensor relative movement program for controlling an operation of the relative movement mechanism so that a ridge of the object supported by the support is detected by the visual sensor during the relative movement; and a deburring operation program generation process which generates a deburring operation program by using the detected ridge obtained by the visual sensor when the relative movement mechanism is operated based on the visual sensor relative movement program.
-
公开(公告)号：US10449654B2
公开(公告)日：2019-10-22
申请号：US15756423
申请日：2016-09-01
发明人： Domenico Campolo , Gia-Hoang Phan , Asif Hussain
IPC分类号： G01L5/10 , B24B49/16 , B24B27/027 , G01L1/00 , G01L3/04
摘要： An instrumented tool for surface finishing of a work-piece, the instrumented tool comprising: a tool configured to be spun and brought into contact with the work-piece while spinning; a spindle configured to provide a spinning torque to spin the tool; a flexible coupler provided between the spindle and the tool to transmit only spinning torque of the spindle to the tool; a rigid connection provided between the spindle and the tool in parallel to the flexible coupler; and a multi-axis force/torque/strain/pressure sensor attached to at least the rigid connection; wherein the rigid connection and the multi-axis force/torque sensor are decoupled from spinning of the spindle and the tool, and wherein the multi-axis force/torque sensor is configured to measure at least one of: contact force and torque between the tool and the work-piece.
-
公开(公告)号：US20190275638A1
公开(公告)日：2019-09-12
申请号：US16424595
申请日：2019-05-29
发明人： Rudolf Lehner
IPC分类号： B24B49/16 , H01L21/67 , H01L29/16 , H01L21/683 , B24B51/00 , B24B49/00 , H01L21/304 , H01L21/78 , H01L21/463
摘要： A method for forming semiconductor devices includes: grinding a backside of a semiconductor wafer with a grinding wheel during a first time interval, wherein the grinding wheel is forward moved during the first time interval, wherein a plurality of semiconductor devices are formed on the semiconductor wafer; polishing the backside of the semiconductor wafer with the grinding wheel in a second time interval, wherein the grinding wheel is backward moved during the second time interval; and dicing the semiconductor wafer to separate the plurality of semiconductor devices from each other without additional polishing of the backside of the semiconductor wafer before dicing the semiconductor wafer.
-
公开(公告)号：US20190193243A1
公开(公告)日：2019-06-27
申请号：US16229712
申请日：2018-12-21
申请人： FANUC CORPORATION
发明人： Kazuhiko Akiyama , Tadanori Suzuki
CPC分类号： B24B49/16 , B24B9/04 , B24B49/183 , B25J9/0096 , B25J9/16 , B25J15/0019
摘要： A grinding apparatus including a robot, a grinding tool attached to the robot, a force sensor configured to detect a force exerted on the grinding tool, and a controller connected with the force sensor and configured to control the robot. The controller includes a variation acquiring section configured to acquire the present position of the robot by pressing the grinding tool against a reference surface in such a manner that a pressing force detected by the force sensor is constant, and to acquire a difference between the acquired present position and a reference position of the robot stored in advance, the difference being acquired as a variation of the grinding tool.
-
公开(公告)号：US20190193242A1
公开(公告)日：2019-06-27
申请号：US16230614
申请日：2018-12-21
申请人： EBARA CORPORATION
IPC分类号： B24B49/10 , B24B49/12 , B24B49/16 , B24B37/013 , G01N27/90
CPC分类号： B24B49/105 , B24B37/013 , B24B49/12 , B24B49/16 , G01N27/90
摘要： A magnetic element for strengthening a magnetic field formed in an object and an eddy current sensor using the magnetic field are provided. The eddy current sensor includes a bottom face portion which is a magnetic body, a magnetic core portion provided at the middle of the bottom face portion and a peripheral wall portion provided on the periphery of the bottom face portion. The eddy current sensor further includes an excitation coil disposed on an outer periphery of the magnetic core portion and capable of generating a magnetic field and an excitation coil disposed on an outer periphery of the peripheral wall portion and capable of generating a magnetic field.
-
公开(公告)号：US10287890B2
公开(公告)日：2019-05-14
申请号：US14851903
申请日：2015-09-11
申请人： ROLLS-ROYCE PLC
发明人： Richard Andreou , Wee Kin Teo , Arthur Wee
摘要： The present invention provides an apparatus and method for processing a component surface by abrading the component surface using an abrasive surface. The apparatus comprises an abrasive surface which is rotatable about an axis extending parallel to said component surface. A support is provided for moving the abrasive surface or the component surface along a computer-generated toolpath and for applying a force between the abrasive surface and the component surface. The support increases the force between the abrasive surface and the component surface from a minimum force to a maximum force as the distance along the toolpath increases to maintain constant material removal from the component surface.
-
-
-
-
-
-
-
-
-
搜索结果
724 条记录 (耗时 0.026 秒)
