公开(公告)号：US20240111089A1

公开(公告)日：2024-04-04

申请号：US17956750

申请日：2022-09-29

申请人： Intel Corporation

发明人： Yi YANG ,  Suddhasattwa NAD ,  Robert Alan MAY

IPC分类号： G02B6/12 ,  B82Y20/00 ,  G02B1/115 ,  G02B6/122 ,  G02B6/132 ,  G02B6/136 ,  G02B6/43

CPC分类号： G02B6/12004 ,  B82Y20/00 ,  G02B1/115 ,  G02B6/1228 ,  G02B6/132 ,  G02B6/136 ,  G02B6/43 ,  G02B2006/12038 ,  G02B2006/12061 ,  G02B2006/12097 ,  G02B2006/12147 ,  G02B2006/12176

摘要： Embodiments herein relate to systems, apparatuses, techniques, or processes for improving the refractive index of the coating that optically couples with an optical medium, wherein the coating includes one or more layers that include a plurality of nanorods. The plurality of nanorods within each of the one or more layers may have a similar orientation in the chemical composition. The nanorods within separate layers may have different characteristics, including different orientations, different sizes, and/or different chemical compositions. Other embodiments may be described and/or claimed.

公开(公告)号：US20240105704A1

公开(公告)日：2024-03-28

申请号：US18458918

申请日：2023-08-30

申请人： Apple Inc.

发明人： Chonghua Zhong ,  Jiongxin Lu ,  Kunzhong Hu ,  Jun Zhai ,  Sanjay Dabral

IPC分类号： H01L25/18 ,  G02B6/43 ,  H01L23/00

CPC分类号： H01L25/18 ,  G02B6/43 ,  H01L24/08 ,  H01L28/10 ,  H01L28/40 ,  H01L2224/08145 ,  H01L2224/08225

摘要： Semiconductor packages formed utilizing wafer reconstitution and optionally including an integrated heat spreader and methods of fabrication are described. In an embodiment, a semiconductor package includes a first package level, a second package level including one or more second-level chiplets. A heat spreader may be bonded to the second package level with a metallic layer, which may include one or more intermetallic compounds formed by transient liquid phase bonding. The chiplets within the first and/or second package levels may optionally be connected with one or more optical interconnect paths.

公开(公告)号：US11940663B2

公开(公告)日：2024-03-26

申请号：US17612505

申请日：2019-05-28

申请人： Nippon Telegraph and Telephone Corporation

发明人： Hidetaka Nishi ,  Shinji Matsuo

IPC分类号： G02B6/43 ,  G02B6/122 ,  G02B6/42 ,  H01L31/0232 ,  H01L31/101 ,  H01L31/108

CPC分类号： G02B6/43 ,  G02B6/1226 ,  G02B6/4212 ,  H01L31/02327 ,  H01L31/101 ,  H01L31/108

摘要： An optical device includes a core formed on a substrate, a first source electrode and a second source electrode formed in contact with both side surfaces of the core interposed between the first source electrode and the second source electrode, and a drain electrode formed in contact with an upper surface of the core. The core, the first source electrode, and the second source electrode together form a plasmonic waveguide. The first source electrode and the second source electrode are Schottky coupled to the core.

公开(公告)号：US11927817B2

公开(公告)日：2024-03-12

申请号：US17477522

申请日：2021-09-16

申请人： Hisense Broadband Multimedia Technologies Co., Ltd.

发明人： Sigeng Yang ,  Shenzhen Fu ,  Xuxia Liu

IPC分类号： H04B10/00 ,  G02B6/42 ,  G02B6/43

CPC分类号： G02B6/428 ,  G02B6/4204 ,  G02B6/43

摘要： An optical module includes a lens assembly and an optical fiber holder. The lens assembly includes a lens base, a first positioning column and a second positioning column. The optical fiber holder includes a first positioning hole and a second positioning hole. The first positioning hole is disposed on a second assembly surface and corresponds to a position of the first positioning column; the first positioning hole has an opening on the second assembly surface and an opening on a first side surface connected with the second assembly surface, and the two openings are connected. The second positioning hole is disposed on the second assembly surface and corresponds to a position of the second positioning column; the second positioning hole has an opening on the second assembly surface and has an opening on a second side surface connected with the second assembly surface, and the two openings are connected.

公开(公告)号：US20240061197A1

公开(公告)日：2024-02-22

申请号：US18379737

申请日：2023-10-13

申请人： Panduit Corp.

发明人： Benjamin J. Berridge ,  Robert A. Reid ,  Steven S. Puglise

IPC分类号： G02B6/43 ,  G02B6/44

CPC分类号： G02B6/43 ,  G02B6/4471 ,  G02B6/4453

摘要： A module for connecting 16 fiber MPOs to 12 fiber MPOs has a first, second, and third 16 fiber MPO, each 16 fiber MPO having first, second, and third fiber receiving areas. The module also has a first, second, third, and fourth 12 fiber MPO, each 12 fiber MPO having a first and second fiber receiving areas. The first and third fiber receiving area of the first, second, and third 16 fiber MPO is connected to the second and first fiber receiving area of the first, second, and fourth 12 fiber MPO. The second fiber receiving area of each 16 fiber MPO is being connected to the third 12 fiber MPO.

公开(公告)号：US20240061196A1

公开(公告)日：2024-02-22

申请号：US18082600

申请日：2022-12-16

申请人： Celestica Technology Consultancy (Shanghai) Co. Ltd

发明人： Chao SUN ,  Peng XIAO

IPC分类号： G02B6/43 ,  G02B6/42 ,  H05K7/10 ,  H05K7/20

CPC分类号： G02B6/43 ,  G02B6/428 ,  H05K7/1092 ,  H05K7/2039 ,  H05K7/1007

摘要： The present disclosure provides a reverse clamping compression device for CPO or NPO. The device includes a mechanical bolster placed on a main board, a compression cover covering optical modules, and a fastening connecting and fixing the compression cover to the mechanical bolster and protruding below the mechanical bolster. In the present disclosure, the compression cover above the optical modules is used to apply a compression force to the optical modules, and the spring element is placed in space below the main board, therefore, the space above the compression cover is not occupied, which can maximize the use of the space above the optical modules, greatly shorten the heat conduct path of the heat sink module, and ensure that the entire device is still assembled from top to bottom.

公开(公告)号：US20240044776A1

公开(公告)日：2024-02-08

申请号：US18072655

申请日：2022-11-30

申请人： AUO Corporation

发明人： Shu-Jiang Liu ,  Chun-Cheng Hung ,  Wen-Jen Li ,  Zhi-Jain Yu ,  Han-Chung Lai

IPC分类号： G01N21/03 ,  B01L3/00 ,  G02B6/43

CPC分类号： G01N21/0303 ,  B01L3/502715 ,  G02B6/43 ,  G01N2201/0873 ,  G01N2201/0668

摘要： Disclosed is a microfluidic detection device including a circuit substrate and a transparent substrate. The circuit substrate is provided with at least one first light-emitting device used to emit a detection beam, a photodetector used to receive the detection beam and send out a sensing signal, and a control circuit electrically connected to the first light-emitting device and the photodetector. The transparent substrate overlaps the circuit substrate and is provided with a microfluidic channel and a light guide structure. The light guide structure has a light incident surface disposed corresponding to the first light-emitting device and a light exiting surface disposed corresponding to the photodetector. The light guide structure extends from each of the light incident surface and the light exiting surface to the microfluidic channel and is adapted to transmit the detection beam into and out of the microfluidic channel.

公开(公告)号：US20240036277A1

公开(公告)日：2024-02-01

申请号：US18480455

申请日：2023-10-03

申请人： II-VI Delaware, Inc.

发明人： Guanglong YU ,  Hong HUANG ,  Zihang WANG

IPC分类号： G02B6/42 ,  G02B6/293 ,  G02B6/43 ,  H04B10/2581 ,  H04B10/50 ,  H04B10/66 ,  H04J14/02 ,  H04B10/25

CPC分类号： G02B6/4246 ,  G02B6/29373 ,  G02B6/2938 ,  G02B6/43 ,  H04B10/2581 ,  H04B10/503 ,  H04B10/66 ,  H04J14/02 ,  H04B10/2589 ,  H04B10/5057

摘要： A short-waveband active optical component based on a vertical emitting laser and a multi-mode optical fiber has an emitting end and a receiving end. In the emitting end, multiple VCSELs generate multiple optical signals of different wavelengths, and multiple photodiodes in the receiving end receive the optical signals emitted by the VCSELs. Both ends use a focusing lens array to collimate and focus the optical signals A Z-block-shaped prism performs a light combining function at the emitting end, while another Z-block-shaped prism performs a light splitting function at the receiving end. Both ends use a focusing lens for collimating and focusing the optical signals at ends of a multi-mode optical fiber, which is used for transmitting the optical signals generated by the VCSELs. The short-waveband active optical component has a small size and a high transmission rate.

公开(公告)号：US20230418011A1

公开(公告)日：2023-12-28

申请号：US18252290

申请日：2021-11-09

申请人： PsiQuantum, Corp.

发明人： George A. KOVALL ,  Takashi ORIMOTO ,  Gabriel MENDOZA ,  Vimal KAMINENI ,  Himani KAMINENI ,  Luu NGUYEN

IPC分类号： G02B6/43 ,  G02B6/42

CPC分类号： G02B6/43 ,  G02B6/4293 ,  G02B6/4283 ,  G02B6/4215

摘要： A device includes a photonic integrated circuit (PIC) die and an electronic integrated circuit (EIC) die bonded to the PIC die. The PIC die includes a waveguide layer including a waveguide and a grating coupler configured to couple incident light into the waveguide, and a first set of dielectric layers on the waveguide layer. The EIC die includes a semiconductor substrate and a second set of dielectric layers on the semiconductor substrate. The first set of dielectric layers faces the second set of dielectric layers. The PIC die and the EIC die include a trench aligned with the grating coupler, the trench extending through the semiconductor substrate, the second set of dielectric layers, and the first set of dielectric layers to the waveguide layer such that the incident light may pass through the trench to reach the grating coupler. A multi-step dry etching process is used to form the trench.

公开(公告)号：US20230412281A1

公开(公告)日：2023-12-21

申请号：US18240762

申请日：2023-08-31

申请人： Intel Corporation

发明人： Debendra Das Sharma

IPC分类号： H04B10/80 ,  H04B10/516 ,  G02B6/43

CPC分类号： H04B10/801 ,  G02B6/43 ,  H04B10/516

摘要： Optical connectivity for interconnects are described. A method includes determining an optical interconnect supports a defined optical mode, decoding electrical signals from an electrical interconnect, the electrical signals to represent a number of bits from one or more messages, converting the electrical signals to optical signals for the optical interconnect, and mapping the decoded bits to one or more optical channels of the optical interconnect. Other embodiments are described and claimed.