APPARATUS AND METHOD FOR MONITORING SUBSTRATE PROCESSING

    公开(公告)号:US20190131153A1

    公开(公告)日:2019-05-02

    申请号:US16168890

    申请日:2018-10-24

    Abstract: Disclosed is an apparatus for monitoring substrate processing, the apparatus including a process data acquisition unit that acquires process data regarding the substrate processing from substrate processing equipment, a storage unit that stores screen configuration data regarding a process monitoring screen that is configured to match a layout of the substrate processing equipment, a processing unit that imports the screen configuration data and operates the process monitoring screen according to the process data, and a control unit that classifies the process data according to time points and outputs a process data value at a specific time point on the process monitoring screen.

    APPARATUS AND METHOD FOR TREATING SUBSTRATE
    293.
    发明申请

    公开(公告)号:US20190131146A1

    公开(公告)日:2019-05-02

    申请号:US16166614

    申请日:2018-10-22

    Abstract: Disclosed is An apparatus for treating a substrate includes a chamber having a treatment space provided therein to treat the substrate and having an entrance for introducing or withdrawing the substrate, a liner disposed in the treatment space, disposed adjacent to an inner sidewall of the chamber, and having an opening formed at a position of facing the entrance to introduce or withdraw the substrate, a supporting unit to support the substrate in the treatment space, a gas supplying unit to supply process gas to the treatment space, a plasma source to produce plasma from the process gas, and a door assembly to open or close the entrance. The door assembly includes a door which includes a door unit provided outside the chamber to be movable between an opening position to open the entrance and a closing position to close the entrance, and an insertion unit extending from the door unit toward the treatment space and inserted into the opening of the liner at the closing position, and a door driving unit to drive the door.

    SUPPORT UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME

    公开(公告)号:US20190131115A1

    公开(公告)日:2019-05-02

    申请号:US16174679

    申请日:2018-10-30

    Abstract: The substrate treating apparatus includes a chamber having a treatment space in the interior thereof, a support unit configured to support a substrate, a gas supply unit configured to supply a gas into the treatment space, and a plasma source configured to generate plasma, wherein the support unit includes a support plate, on which the substrate is positioned, a ring assembly surrounding a circumference of the support plate and having a ring-shaped electrode, and a voltage applying unit configured to control an incident angle of the plasma onto the substrate by applying a voltage to the ring-shaped electrode, and wherein the voltage applying unit includes a base plate of a conductive material, a DC power source configured to apply a DC voltage to the base plate, and a plurality of connecting bodies connecting the base plate and the ring-shaped electrode, formed of a conductive material.

    SUBSTRATE TREATING APPARATUS AND METHOD FOR INSPECTING TREATMENT LIQUID NOZZLE

    公开(公告)号:US20190111450A1

    公开(公告)日:2019-04-18

    申请号:US16157541

    申请日:2018-10-11

    Inventor: Kwangsup Kim

    Abstract: Disclosed are a substrate treating apparatus and a method for inspecting a treatment liquid nozzle. The substrate treating apparatus includes a support member configured to support a substrate, a treatment liquid nozzle configured to discharge a treatment liquid to the substrate located on the support member, a light source configured to irradiate light to a point of the substrate, to which the treatment liquid is discharged, a camera configured to photograph the point of the substrate, to which the treatment liquid is discharged, and a controller configured to determine, through an image captured by the camera, whether a crown is generated when the treatment liquid collides with the substrate.

    APPARATUS AND METHOD FOR TREATING SUBSTRATE
    297.
    发明申请

    公开(公告)号:US20190103292A1

    公开(公告)日:2019-04-04

    申请号:US16131587

    申请日:2018-09-14

    Inventor: JUDONG LEE

    Abstract: Provided are an apparatus and a method for supplying a liquid. An apparatus for treating a substrate includes a substrate support unit to support the substrate, and a liquid supplying unit to supply a liquid to a substrate supported by the substrate support unit. The liquid supplying unit includes a nozzle to discharge the liquid, a liquid supplying line to supply the liquid to the nozzle, a constant pressure valve installed on the liquid supplying line, a shut-off valve installed on the liquid supplying line while being interposed between the constant pressure valve and the nozzle to supply the liquid or to stop the supply of the liquid, and a controller to control the constant pressure valve and the shut-off valve.

    APPARATUS AND METHOD FOR TREATING SUBSTRATE
    298.
    发明申请

    公开(公告)号:US20190096717A1

    公开(公告)日:2019-03-28

    申请号:US16133043

    申请日:2018-09-17

    Abstract: Provided are an apparatus and a method for treating a substrate at a high-pressure atmosphere. The apparatus for treating the substrate includes a first body and a second body combined with each other to define a treatment space in which the substrate is treated, a sealing member interposed between the first body and the second body to seal the treatment space from an outside at a position in which the first body is in close contact with the second body, and a driving member to drive the first body or the second body such that the treatment space is open or closed. The sealing member is positioned in a sealing groove formed in the first body. The sealing member is deformed to be in close contact with the second body by pressure of the treatment space when a process is performed.

    SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

    公开(公告)号:US20190088449A1

    公开(公告)日:2019-03-21

    申请号:US16120498

    申请日:2018-09-04

    Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a process chamber having a treatment space in the interior thereof, a support unit configured to support a substrate in the treatment space, a gas supply unit configured to supply a treatment gas into the treatment space, and a plasma generating unit configured to generate plasma from the gas in the treatment space, wherein the plasma generating unit includes a high-frequency power source, a high-frequency antenna, to which a current is applied from the high-frequency power source, and an additional antenna provided to be spaced apart from the high-frequency antenna and to which a coupling current is applied from the high-frequency antenna.

    Supporting unit and substrate treatment apparatus

    公开(公告)号:US10236194B2

    公开(公告)日:2019-03-19

    申请号:US14264410

    申请日:2014-04-29

    Abstract: Provided is a supporting unit supporting a substrate. The supporting unit includes a body including a plurality of heating regions and disposed with the substrate on a top surface thereof and a heating unit heating the body. Herein, the heating unit includes heating lines provided in the plurality of heating regions, respectively, to control temperatures of the plurality of heating regions independently from one another, terminals provided to the body and receiving power from the outside, and connecting lines connecting the heating lines to the terminals mutually corresponding to one another. Also, the terminals are disposed in one of the plurality of heating regions in a top view.

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