公开(公告)号：US07880132B2

公开(公告)日：2011-02-01

申请号：US11872226

申请日：2007-10-15

Applicant: Stuart Brodie ,  Hazel McInnes ,  Kum Weng Loo ,  Mickael Miglietti ,  Eric Saugier

Inventor： Stuart Brodie ,  Hazel McInnes ,  Kum Weng Loo ,  Mickael Miglietti ,  Eric Saugier

IPC: H01J5/02 ,  H04N5/225 ,  G03B17/00 ,  G02B7/02

CPC classification number: G03B11/00 ,  H04N5/2257

Abstract: A camera module lens cap is provided to protect a camera module in a mobile device where the camera module is exposed. The camera module lens cap includes an optically transparent member for positioning adjacent a camera lens, and a housing for carrying the optically transparent member. The housing includes an overhanging lip for engaging a base of the camera module.

Abstract translation: 提供相机模块透镜盖，以保护相机模块暴露在的移动设备中的相机模块。 相机模块透镜盖包括用于定位在相机镜头附近的光学透明构件和用于承载光学透明构件的壳体。 壳体包括用于接合摄像机模块的基座的突出唇缘。

公开(公告)号：US20090057544A1

公开(公告)日：2009-03-05

申请号：US11872226

申请日：2007-10-15

Applicant: Stuart Brodie ,  Hazel McInnes ,  Kum Weng Loo ,  Mickael Miglietti ,  Eric Saugier

Inventor： Stuart Brodie ,  Hazel McInnes ,  Kum Weng Loo ,  Mickael Miglietti ,  Eric Saugier

IPC: G03B17/02

CPC classification number: G03B11/00 ,  H04N5/2257

Abstract: A camera module lens cap is provided to protect a camera module in a mobile device where the camera module is exposed. The camera module lens cap includes an optically transparent member for positioning adjacent a camera lens, and a housing for carrying the optically transparent member. The housing includes an overhanging lip for engaging a base of the camera module.

Abstract translation: 提供相机模块透镜盖，以保护相机模块暴露在的移动设备中的相机模块。 相机模块透镜盖包括用于定位在相机镜头附近的光学透明构件和用于承载光学透明构件的壳体。 壳体包括用于接合摄像机模块的基座的突出唇缘。

公开(公告)号：US12183646B2

公开(公告)日：2024-12-31

申请号：US18166922

申请日：2023-02-09

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: H01L23/29 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

Abstract: A semiconductor device having a channel between active sections or portions of the device is disclosed. An elastic material, such as dielectric or a polymer, is deposited into the channel and cured to increase flexibility and thermal expansion properties of the semiconductor device. The elastic material reduces the thermal and mechanical mismatch between the semiconductor device and the substrate to which the semiconductor device is coupled in downstream processing to improve reliability. The semiconductor device may also include a plurality of channels formed transverse with respect to each other. Some of the channels extend all the way through the semiconductor device, while other channels extend only partially through the semiconductor device.

公开(公告)号：US12176220B2

公开(公告)日：2024-12-24

申请号：US17513122

申请日：2021-10-28

Applicant: STMicroelectronics Pte Ltd

Inventor： Jing-En Luan

IPC: H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18 ,  H01S5/02218 ,  H01S5/02315 ,  H01S5/02345

Abstract: A molded carrier is formed by a unitary body made of a laser direct structuring (LDS) material and includes a blind opening with a bottom surface. The unitary body includes: a floor body portion defining a back side and the bottom surface of the blind opening and an outer peripheral wall body portion defining a sidewall surface of the blind opening. LDS activation followed by electro-plating is used to produce: a die attach pad and bonding pad at the bottom surface; land grid array (LGA) pads at the back side; and vias extending through the floor body portion to make electrical connections between the die attach pad and one LGA pad and between the bonding pad and another LGA pad. An integrated circuit chip is mounted to the die attach pad and wire bonded to the bonding pad. A wafer-scale manufacturing process is used to form the molded carrier.

公开(公告)号：US11942496B2

公开(公告)日：2024-03-26

申请号：US17326537

申请日：2021-05-21

Applicant: STMicroelectronics Pte Ltd

Inventor： Laurent Herard ,  David Gani

IPC: H01L27/146

CPC classification number: H01L27/14618

Abstract: A digital image sensor package includes an image sensor substrate and a glass covering. The image sensor substrate carries photodiodes. The glass covering has a bottom surface, a top surface opposite the bottom surface, and a sidewall delimiting a perimeter edge of the glass covering. The glass covering overlies the photodiodes. A surface area of the top surface of the glass covering is greater than a surface area of the bottom surface of the glass covering such that the sidewall is anti-perpendicular to the top and bottom surfaces of the glass.

公开(公告)号：US20240030115A1

公开(公告)日：2024-01-25

申请号：US18352962

申请日：2023-07-14

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Loic Pierre Louis RENARD

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L23/42

CPC classification number: H01L23/49811 ,  H01L24/32 ,  H01L24/48 ,  H01L23/3107 ,  H01L23/42 ,  H01L2224/48091 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/1306 ,  H01L2924/01029 ,  H01L2924/182

Abstract: The present disclosure is directed to a power package with copper plating terminals. The power package includes at least two terminals coupled to a semiconductor die. An area of a first terminal is greater than an area of a second terminal. The first and second terminals extend to a first and second conductive layers in a backside of the package. A third conductive layer is coupled to a backside surface of the die that is coplanar with the first and second conductive layers. The terminals and conductive layers are copper plating. A first molding compound covers the die and terminals, while a second molding compound fills distances between the die and the extensions of the terminals. The copper plating and the molding compounds enhance the performance of the packaged device in a high-power circuit. In addition, robustness of the package is enhanced compared with conventional packages including wire bonding.

公开(公告)号：US11828877B2

公开(公告)日：2023-11-28

申请号：US17015521

申请日：2020-09-09

Applicant: STMicroelectronics PTE LTD

Inventor： Jing-En Luan

IPC: G01S7/481

CPC classification number: G01S7/4813

Abstract: The present disclosure is directed to an optical sensor package with a first assembly and a second assembly with an encapsulant extending between and coupling the first assembly and the second assembly. The first assembly includes a first substrate, a first die on the first substrate, a transparent material on the first die, and an infrared filter on the transparent material. The second assembly includes a second substrate, a second die on the second substrate, a transparent material on the second die, and an infrared filter on the transparent material. Apertures are formed through the encapsulant aligned with the first die and the second die. The first die is configured to transmit light through one aperture, wherein the light reflects off an object to be detected and is received at the second die through another one of the apertures.

公开(公告)号：US11828875B2

公开(公告)日：2023-11-28

申请号：US17551001

申请日：2021-12-14

Applicant: STMICROELECTRONICS PTE LTD

Inventor： David Gani

IPC: G01S7/18 ,  G01J1/42 ,  G01S7/481 ,  G01S17/08 ,  G01S7/493 ,  G01S7/497 ,  G01S7/487 ,  G01S17/04 ,  G01S7/48

CPC classification number: G01S7/4808 ,  G01J1/4204 ,  G01S7/4813 ,  G01S7/4814 ,  G01S7/4816 ,  G01S7/4876 ,  G01S7/493 ,  G01S7/497 ,  G01S17/04 ,  G01S17/08

Abstract: A semiconductor package that is a proximity sensor includes a light transmitting die, a light receiving die, an ambient light sensor, a cap, and a substrate. The light receiving die and the light transmitting die are coupled to the substrate. The cap is coupled to the substrate forming a first chamber around the light transmitting die and a second chamber around the light receiving die. The cap further includes a recess with contact pads. The ambient light sensor is mounted within the recess of the cap and coupled to the contact pads. The cap includes electrical traces that are coupled to the contact pads within the recess coupling the ambient light sensor to the substrate. By utilizing a cap with a recess containing contact pads, a proximity sensor can be formed in a single semiconductor package all while maintaining a compact size and reducing the manufacturing costs of proximity sensors.

公开(公告)号：US20230307302A1

公开(公告)日：2023-09-28

申请号：US18184436

申请日：2023-03-15

Applicant: STMICROELECTRONICS LTD ,  STMICROELECTRONICS PTE LTD

Inventor： David GANI ,  Hui-Tzu Wang

IPC: H01L23/04 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/04 ,  H01L25/0655 ,  H01L24/32 ,  H01L2924/16151 ,  H01L2924/16788 ,  H01L2224/32225

Abstract: A semiconductor package includes a silicon substrate with an active surface and an inactive surface. A semiconductor device, such as an image, light, or optical sensor, is formed in the active surface and disposed on the substrate. A glass plate is coupled to the substrate with adhesive. The glass plate includes a sensor area that corresponds to the area of the semiconductor device and holes through the glass plate that are generally positioned around the sensor area of the glass plate. During formation of the package, the holes through the glass plate allow gas released by the adhesive to escape the package and prevent formation of a gas bubble.

公开(公告)号：US20230245992A1

公开(公告)日：2023-08-03

申请号：US18081248

申请日：2022-12-14

Applicant: STMicroelectronics PTE LTD

Inventor： Jing-En LUAN

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/822 ,  H01L21/56

CPC classification number: H01L24/24 ,  H01L23/49805 ,  H01L21/822 ,  H01L21/565 ,  H01L21/561 ,  H01L21/568 ,  H01L24/19 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/19 ,  H01L2224/24226 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/73209 ,  H01L2224/16227 ,  H01L2924/182

Abstract: An integrated circuit die includes a semiconductor substrate, an interconnect layer including bonding pads, and a passivation layer covering the interconnect layer and including openings at the bonding pads. A conductive redistribution layer including conductive lines and conductive vias is supported by the passivation layer. An insulating layer covers the conductive redistribution layer and the passivation layer. Channels formed in an upper surface of the insulating layer delimit pedestal regions in the insulating layer. A through via extends from an upper surface of each pedestal region through the pedestal region and the insulating layer to reach and make contact with a portion of the conductive redistribution layer. A metal pad is formed at the upper surface of each pedestal region in contact with its associated through via. The metal pads for leads of a quad-flat no-lead (QFN) type package.