公开(公告)号：US20040101171A1

公开(公告)日：2004-05-27

申请号：US10335586

申请日：2002-12-31

Applicant: STMicroelectronics, Inc.

Inventor： Fred P. Lane ,  David Gill

IPC: G06K009/00

CPC classification number: G06K9/00013

Abstract: A finger imaging system for receiving and holding a finger of a person being fingerprinted by an automated fingerprint reader. The system includes a finger imaging device having a finger receiving portion and a finger positioning portion, together forming a recess of reducing dimension such that a subject finger forceably inserted into it is held in a stable position. The finger positioning portion may have a flexible or resilient surface contacting the finger to enhance the stabilizing effect. The flexible surface may be inflated to increase the retaining pressure.

Abstract translation: 一种手指成像系统，用于接收和握住被自动指纹读取器指纹的人的手指。 该系统包括具有手指接收部分和手指定位部分的手指成像装置，一起形成减小尺寸的凹部，使得可强制插入其中的主体手指保持在稳定位置。 手指定位部分可以具有接触手指的柔性或弹性表面以增强稳定效果。 柔性表面可以被充气以增加保持压力。

公开(公告)号：US20040096005A1

公开(公告)日：2004-05-20

申请号：US10299273

申请日：2002-11-19

Applicant: STMicroelectronics, Inc.

Inventor： Oleksiy Zabroda

IPC: H04B003/00

CPC classification number: H04L25/0292 ,  H04L12/413 ,  H04L25/0266 ,  H04L25/0272 ,  H04L25/028

Abstract: A gigabit ethernet line driver includes a transmitter having both transmitter and active hybrid outputs. The transmitter consists of a plurality of transmitter clusters each connected to both the transmitter and active hybrid outputs. Each transmitter cluster includes a plurality of transmitter cells consisting of a driver cell and digital to analog converter connected to driver cell. A hybrid circuit connects between the transmitter outputs and receiver inputs for separating a receiver signal from the transmitter signal responsive to a tuning signal.

Abstract translation: 千兆以太网线路驱动器包括具有发射机和主动混合输出的发射机。 发射机由多个发射机簇组成，每个发射机簇都连接到发射机和主动混合输出。 每个发射机簇包括多个发射机小区，由发射机小区和连接到驱动小区的数模转换器组成。 混合电路连接在发射器输出端和接收器输入端之间，用于根据调谐信号将发射机信号与接收机信号分离。

公开(公告)号：US20040089955A1

公开(公告)日：2004-05-13

申请号：US10291263

申请日：2002-11-08

Applicant: STMicroelectronics, Inc.

Inventor： Tiao Zhou

IPC: H01L023/31 ,  H05K003/30

CPC classification number: G06K9/0002 ,  H01L23/573 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: In one embodiment, a device includes but is not limited to: a first integrated circuit affixed to a substrate; an electronic circuit component affixed to the substrate; a first encapsulation structure encasing the first integrated circuit; a second integrated circuit affixed to the first encapsulation structure; and a second encapsulation structure which at least partially encases the first encapsulation structure, the first integrated circuit, and the electronic component.

Abstract translation: 在一个实施例中，设备包括但不限于：固定到基板的第一集成电路; 固定在基板上的电子电路部件; 封装第一集成电路的第一封装结构; 固定到第一封装结构的第二集成电路; 以及第二封装结构，其至少部分地包围第一封装结构，第一集成电路和电子部件。

公开(公告)号：US20040088592A1

公开(公告)日：2004-05-06

申请号：US10284006

申请日：2002-10-30

Applicant: STMICROELECTRONICS, INC.

Inventor： Davide Rizzo ,  Osvaldo Colavin

IPC: G06F001/32

CPC classification number: G06F8/4432 ,  G06F1/08 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/172 ,  Y02D10/41

Abstract: A coprocessor executing one among a set of candidate kernel loops within an application operates at the minimal clock frequency satisfying schedule constraints imposed by the compiler and data bandwidth constraints. The optimal clock frequency is statically determined by the compiler and enforced at runtime by software-controlled clock circuitry. Power dissipation savings and optimal resource usage are therefore achieved by the adaptation at runtime of the coprocessor clock rate for each of the various kernel loop implementations.

Abstract translation: 在应用程序中的一组候选内核循环中执行一个协处理器以满足由编译器施加的调度约束和数据带宽约束的最小时钟频率操作。 最佳时钟频率由编译器静态确定，并由运行时由软件控制的时钟电路执行。 因此，通过在运行时对各种内核循环实现中的每一个的协处理器时钟速率进行适应来实现功耗节省和最佳资源使用。

公开(公告)号：US20040073807A1

公开(公告)日：2004-04-15

申请号：US10268871

申请日：2002-10-10

Applicant: STMicroelectronics, Inc.

Inventor： Tom Youssef

IPC: G06F012/14

CPC classification number: G01R21/133 ,  G01R22/066

Abstract: An electronic timer may include a clock reference signal generator and a real time clock (RTC) circuit for generating real time data based upon the clock reference signal. The RTC circuit may include a plurality of registers each for storing a respective bit of the real time data. Further, each register may include a master latch for initially storing the real time data bit, a slave latch for subsequently storing the real time data bit, and a user latch for storing the real time data bit from the slave latch. The RTC circuit may further include a controller for causing at least some of the registers to increment based upon the clock reference signal. Additionally, the electronic timer may also advantageously include a tamper circuit for receiving a tamper event signal and causing each of the user latches to hold a time stamp therein.

Abstract translation: 电子计时器可以包括时钟参考信号发生器和用于基于时钟参考信号产生实时数据的实时时钟（RTC）电路。 RTC电路可以包括多个寄存器，每个寄存器用于存储实时数据的相应位。 此外，每个寄存器可以包括用于初始存储实时数据位的主锁存器，用于随后存储实时数据位的从锁存器和用于从从锁存器存储实时数据位的用户锁存器。 RTC电路还可以包括用于使得至少一些寄存器基于时钟参考信号而增加的控制器。 此外，电子计时器还可以有利地包括用于接收篡改事件信号的篡改电路，并使每个用户锁存器在其中保持时间戳。

公开(公告)号：US20040017668A1

公开(公告)日：2004-01-29

申请号：US10205692

申请日：2002-07-26

Applicant: STMicroelectronics, Inc.

Inventor： Harry M. Siegel ,  Anthony M. Chiu

IPC: H05K003/02 ,  H05K007/02 ,  H02G003/00

CPC classification number: H01L21/568 ,  H01L21/566 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2224/85444 ,  H01L2224/8547 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49172 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A method for providing a leadframeless package structure is provided. The method includes providing a temporary carrier. The temporary carrier is coupled to a metal foil layer with a temporary adhesive layer. An integrated circuit chip is coupled to the metal foil layer. The temporary adhesive layer and the temporary carrier are removed to form the leadframeless package structure after molding.

公开(公告)号：US20040017002A1

公开(公告)日：2004-01-29

申请号：US10206641

申请日：2002-07-26

Applicant: STMicroelectronics, Inc.

Inventor： Harry M. Siegel ,  Anthony M. Chiu

IPC: H01L023/06

CPC classification number: G06K9/0002 ,  H01L21/565 ,  H01L23/3107 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/48 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/85051 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An integrated circuit (IC) device comprising: 1) an integrated circuit (IC) die having a first surface, a second surface opposite the first surface, and sidewalls extending between the first surface and the second surface; and 2) an integrated circuit (IC) package for supporting the IC die, wherein the IC package is attached to at least one of the sidewalls of the IC die such that at least a portion of the IC die first surface and at least a portion of the IC die second surface are exposed.

Abstract translation: 1.一种集成电路（IC）装置，包括：1）具有第一表面，与第一表面相对的第二表面和在第一表面和第二表面之间延伸的侧壁的集成电路（IC）模具; 以及2）用于支撑所述IC芯片的集成电路（IC）封装，其中所述IC封装被附接到所述IC管芯的至少一个侧壁，使得所述IC的至少一部分裸片的第一表面和至少一部分 的IC芯片第二表面露出。

公开(公告)号：US20040012084A1

公开(公告)日：2004-01-22

申请号：US10201087

申请日：2002-07-22

Applicant: STMicroelectronics, Inc.

Inventor： Michael J. Hundt ,  Tiao Zhou

IPC: H01L023/34

CPC classification number: H01L21/565 ,  H01L23/3121 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of fabricating an integrated circuit sensor package. The method comprises the steps of: 1) mounting a substrate on a first mold block, the substrate comprising a substantially planar material having a first substrate surface and a second substrate surface that contacts a mounting surface of the first mold block; 2) placing an adhesive on the first substrate surface; 3) placing an integrated circuit sensor on the adhesive; and 4) pressing a second mold block against the first substrate surface. The second mold block comprising a cavity portion for receiving the integrated circuit sensor, a contact surface surrounding the cavity portion, and a compliant layer mounted with the cavity portion. Pressing the second mold block against the first substrate surface causes the contact surface to form with the first substrate surface a seal surrounding the integrated circuit sensor. Pressing also causes the compliant layer to press against a sensor array surface of the integrated circuit sensor, thereby pressing the integrated circuit sensor into the adhesive and the first substrate surface.

Abstract translation: 一种制造集成电路传感器封装的方法。 该方法包括以下步骤：1）将基板安装在第一模块上，该基板包括具有第一基板表面的基本上平面的材料和与第一模块的安装表面接触的第二基板表面; 2）将粘合剂放置在第一基板表面上; 3）将集成电路传感器放置在粘合剂上; 以及4）将第二模具块压靠在所述第一基板表面上。 第二模块包括用于接收集成电路传感器的空腔部分，围绕空腔部分的接触表面以及安装有空腔部分的顺应层。 将第二模具块压靠第一基板表面使得接触表面与第一基板表面形成围绕集成电路传感器的密封件。 按压也使得柔性层压在集成电路传感器的传感器阵列表面上，从而将集成电路传感器压入粘合剂和第一基板表面。

公开(公告)号：US20040004881A1

公开(公告)日：2004-01-08

申请号：US10190917

申请日：2002-07-08

Applicant: STMicroelectronics, Inc.

Inventor： Naren K. Sahoo

IPC: G11C007/02 ,  G11C005/00

CPC classification number: G11C7/067 ,  G11C11/419

Abstract: A sense amplifier circuit for a memory cell includes a sense amplifier that is operable to be coupled to a memory cell via data lines, and including read bus complement and read bus true lines operative with a data output through which a data output signal is passed. An equalization circuit and enable circuit are operable with the sense amplifier. A control circuit is operable for disconnecting the data output from preferably the one of the read bus complement line and minimize unwanted transitions on the data output signal.

公开(公告)号：US20040000885A1

公开(公告)日：2004-01-01

申请号：US10608273

申请日：2003-06-27

Applicant: STMicroelectronics, Inc.

Inventor： Jianwen Shao

IPC: H02P001/18

CPC classification number: H02P6/085 ,  H02P6/15 ,  H02P6/182

Abstract: A circuit and method provide a back EMF signal that represents a back EMF voltage induced in a coil of a brushless motor. In one embodiment of the invention, the circuit includes an input node operable to receive a tap voltage from the coil, and a network coupled to the input node and operable to generate the back EMF signal by removing a predetermined offset voltage from the tap voltage. Such a circuit provides a signal that more accurately indicates a zero crossing than existing circuits for controlling a sensorless brushless motor.

Abstract translation: 电路和方法提供表示在无刷电动机的线圈中感应的反电动势电压的反电动势信号。 在本发明的一个实施例中，电路包括可操作以从线圈接收抽头电压的输入节点和耦合到输入节点的网络，并且可操作以通过从分接电压去除预定偏移电压来产生反电动势信号。 这种电路提供了一种信号，该信号比用于控制无传感器的无刷电动机的现有电路更准确地指示过零点。