Abstract:
At least three electrically conducting blocks are disposed within an isolating region; and at least two of them are mutually separated and capacitively coupled by a part of the isolating region. At least two of them, being semiconductor, have opposite types of conductivity or identical types of conductivity, but with different concentrations of dopants, and these are in mutual contact by one of their sides. The mutual arrangement of these blocks within the isolating region, their type of conductivity and their concentration of dopants form at least one electronic module. Some of the blocks define input and output blocks.
Abstract:
A secure memory includes a bistable memory cell having a programmed start-up state, and means for flipping the state of the cell in response to a flip signal. The memory may include a clock for generating the flip signal with a period, for example, smaller than the acquisition time of an emission microscope.
Abstract:
A device includes, within a layer of silicon on insulator, a central semiconductor zone including a central region having a first type of conductivity, two intermediate regions having a second type of conductivity opposite to that of the first one, respectively disposed on either side of and in contact with the central region in order to form two PN junctions, two semiconductor end zones respectively disposed on either side of the central zone, each end zone comprising two end regions of opposite types of conductivity, in contact with the adjacent intermediate region, the two end regions of each end zone being mutually connected electrically in order to form the two terminals of the device.
Abstract:
A device and corresponding fabrication method includes a vertical stack having an intermediate layer between a lower region and an upper region. The intermediate layer is extended by a protection layer. The vertical stack has a free lateral face on which the lower region, the upper region and the protection layer are exposed.
Abstract:
The vertical insulated gate transistor includes, on a semiconductor substrate, a vertical pillar incorporating one of the source and drain regions at the top, a gate dielectric layer situated on the flanks of the pillar and on the top surface of the substrate, and a semiconductor gate resting on the gate dielectric layer. The other of the source and drain regions is in the bottom part of the pillar PIL and the insulated gate includes an isolated external portion 15 resting on the flanks of the pillar and an isolated internal portion 14 situated inside the pillar between the source and drain regions. The isolated internal portion is separated laterally from the isolated external portion by two connecting semiconductor regions PL1, PL2 extending between the source and drain regions, and forming two very fine pillars.
Abstract:
The invention provides for a process and a device for de-interlacing a video signal, wherein at output (S) is produced a signal (Sde) of video images de-interlaced by interpolating the pixels missing from the interlaced video signal presented at input (E), the interpolation on the output signal (Sde) being composed selectively (10) from a spatial interpolation (6), based on a transition detection and from a temporal interpolation (8) with a decision being made on the variable degree of presence of spatial interpolation and/or of temporal interpolation in the output signal (Sde), the decision being made as a function of a motion detection in the relevant area of the image, wherein the decision is made additionally as a function of a detection of the detail (2) in a relevant area of the image.
Abstract:
A asynchronous frame receiver includes an input for receiving asynchronous frames. The asynchronous frames include standard characters, and a header that has a data bit length greater than a data bit length of the standard characters. A break character detection unit detects the break character. A standard character processing unit for detecting the standard characters is activated by the break character detection unit based upon the break character being detected.
Abstract:
A process for fabricating an integrated circuit includes forming a gate on a crystalline silicon substrate, and amorphizing a region of the substrate to obtain an amorphous silicon region. Dopant is implanted in a subregion lying substantially within the amorphous silicon region of the substrate to form drain and source extensions. A source and drain are then formed at a low temperature.
Abstract:
A method for generating a signal with a frequency equal to a product of a reference frequency and a real number includes providing an output signal from an oscillator, and performing a first integer division of a frequency of the output signal by a first integer divider to obtain a first intermediate signal. A first measurement signal representative of a time difference between the first intermediate signal and a reference signal having the reference frequency is determined. The method further includes generating a first comparison signal derived from the first measurement signal, and generating a second comparison signal dependent on a period of the reference signal, on integer and decimal parts of the real number and on the first integer divider. The first and second comparison signals are compared to obtain an error signal representative of a time difference between a period of a current output signal and the period of the reference signal. The first integer division is deactivated to deliver an error signal to the input of the oscillator, with the output signal from the oscillator forming the desired signal with a frequency equal to the product of the reference frequency and the real number.
Abstract:
The semiconductor memory device includes a non-volatile programmable and electrically erasable memory cell with a single layer of gate material and a floating gate transistor and a control gate, within an active semiconducting area formed in a region of the substrate and delimited by an isolation region. The layer of gate material in which the floating gate is made extends integrally above the active area without overlapping part of the isolation region, and the transistor is electrically isolated from the control gate by PN junctions that will be inverse polarized.