公开(公告)号：US20120045968A1

公开(公告)日：2012-02-23

申请号：US13015016

申请日：2011-01-27

申请人： Nobukazu HOSOKAI ,  Isamu OGURO ,  Jun WATANABE ,  Tetsujiro TADA

发明人： Nobukazu HOSOKAI ,  Isamu OGURO ,  Jun WATANABE ,  Tetsujiro TADA

IPC分类号： B24B1/00

CPC分类号： B24B9/065

摘要： A substrate polishing method includes starting to rotate a circular substrate and polishing an inner peripheral edge surface of a center circular hole formed in the circular substrate into a chamfered or rounded surface by pressing the inner peripheral edge surface against a bypass polishing part of a polishing tape that is conveyed intermittently or continuously and by oscillating the bypass polishing part of the polishing tape about a direction perpendicular to a direction that the center circular hole penetrates through the circular substrate. The polishing tape is guided so as to have an advancing portion advancing toward the circular substrate, a returning portion returning from the circular substrate, and a turning-back portion between the advancing portion and the returning portion guided along a side bypass. The bypass polishing part of the polishing tape is the turning-back portion of the polishing tape.

摘要翻译： 衬底抛光方法包括：开始旋转圆形衬底并将形成在圆形衬底中的中心圆形孔的内周缘表面通过将内周边表面压靠在抛光带的旁路抛光部分上来研磨成倒角或圆形表面 间歇地或连续地传送，并且通过围绕与中心圆孔穿过圆形基底的方向垂直的方向摆动抛光带的旁路抛光部分。 该抛光带被引导为具有朝向圆形基板前进的前进部分，从圆形基板返回的返回部分和沿着旁路引导引导的前进部分和返回部分之间的回转部分。 研磨带的旁路抛光部是研磨带的折回部。

公开(公告)号：US08029333B2

公开(公告)日：2011-10-04

申请号：US11911808

申请日：2007-10-17

申请人： Tamami Takahashi ,  Kenya Ito ,  Mitsuhiko Shirakashi ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki ,  Satoru Sato ,  Jun Watanabe ,  Kenji Kato ,  Jun Tamura ,  Souichi Asakawa

发明人： Tamami Takahashi ,  Kenya Ito ,  Mitsuhiko Shirakashi ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki ,  Satoru Sato ,  Jun Watanabe ,  Kenji Kato ,  Jun Tamura ,  Souichi Asakawa

IPC分类号： B24B49/00

CPC分类号： B24B9/065 ,  B24B21/16

摘要： A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.

摘要翻译： 用于抛光半导体晶片的周边部分的装置包括用于保持晶片的晶片台，包括用于旋转晶片台的装置的晶片台单元，使得晶片台在与表面相同的平面内进行旋转往复运动 的晶片台，并且平行于表面移动晶片台，用于抛光晶片上的凹口的凹口抛光部分和用于抛光晶片的斜面部分的斜面抛光部分。 将纯水供应到晶片，以防止其从凹口抛光部件输送到斜面抛光部件时变干。

公开(公告)号：US07828628B2

公开(公告)日：2010-11-09

申请号：US11946531

申请日：2007-11-28

申请人： Kenji Aoki ,  Toru Yamazaki ,  Takehiro Watanabe ,  Naoyuki Hamada

发明人： Kenji Aoki ,  Toru Yamazaki ,  Takehiro Watanabe ,  Naoyuki Hamada

IPC分类号： B24B7/22

CPC分类号： H01L21/02024 ,  B24B37/044 ,  C09G1/02 ,  C09K3/1436 ,  C09K3/1472 ,  H01L29/1608

摘要： A hard crystal substrate such as a GaN substrate or a SiC substrate is polished by using polishing oil slurry having abrading particles of artificial diamond clusters dispersed in a dispersant. The artificial diamond clusters include approximately spherical agglomerate particles with average particle size D50 of 20 nm or more and 50 nm or less, having primary particles with particle diameters of 2 nm or more and 10 nm or less. A rough polishing process is carried out first such that an average surface roughness of 0.5 nm or more and 1 nm or less is obtained, followed by a finishing process such that the average surface roughness of said surface becomes 0.2 nm or less.

摘要翻译： 通过使用分散在分散剂中的具有研磨人造金刚石颗粒的抛光油浆来研磨诸如GaN衬底或SiC衬底的硬质晶体衬底。 人造金刚石团簇包括具有粒径为2nm以上且10nm以下的一次粒子的平均粒径D 50为20nm以上且50nm以下的近似球状的聚集体颗粒。 首先进行粗抛光处理，使得得到0.5nm以上且1nm以下的平均表面粗糙度，然后进行表面的平均表面粗糙度为0.2nm以下的精加工。

公开(公告)号：US20100255764A1

公开(公告)日：2010-10-07

申请号：US12742292

申请日：2008-11-20

申请人： Nobuyoshi Watanabe ,  Kazunori Tani

发明人： Nobuyoshi Watanabe ,  Kazunori Tani

IPC分类号： B24D11/00 ,  B24D3/28

CPC分类号： B24D18/0018 ,  B24B37/22 ,  B24B37/245 ,  B24D3/28

摘要： A polishing sheet suitable for precise polishing is produced by arranging polishing particles as a single particle layer on a base sheet and includes a base sheet and a polishing layer made of polishing particles and a binder resin for fixing the polishing particles that are arranged as a single particle layer. The polishing particles protrude partially from the surface of the binder resin, being covered or not covered with a thin film of the binder resin.

摘要翻译： 通过将抛光颗粒作为单一颗粒层布置在基片上，并且包括基片和由抛光颗粒制成的抛光层和用于固定抛光颗粒的粘合剂树脂来制造适于精确抛光的抛光片 颗粒层。 抛光颗粒部分地从粘合剂树脂的表面突出，被覆盖或未被粘合剂树脂的薄膜覆盖。

公开(公告)号：US07790046B2

公开(公告)日：2010-09-07

申请号：US11809728

申请日：2007-05-31

申请人： Yuji Horie ,  Hiromitsu Okuyama ,  Tatsuya Tanifuji

发明人： Yuji Horie ,  Hiromitsu Okuyama ,  Tatsuya Tanifuji

IPC分类号： B44C1/22 ,  C03C15/00

CPC分类号： C09G1/02 ,  G11B5/8404

摘要： A method of texturing a surface of a magnetic hard disk substrate includes the steps of rotating the magnetic hard disk substrate, supplying polishing slurry on the surface of the substrate, and pressing a polishing tape on the substrate surface and running the polishing tape. The polishing slurry includes abrading particles of monocrystalline diamond that are cluster particles with corners having diameters in the range of 1-10 nm, dispersed in a dispersant such as water and a water-based aqueous solution. The cluster particles are tasseled assemblies of crystalline particles with no directionality.

摘要翻译： 对磁性硬盘基板的表面进行纹理化的方法包括以下步骤：旋转磁性硬盘基板，在基板的表面上提供研磨浆料，并将研磨带压在基板表面上并运行研磨带。 抛光浆料包括分散在分散剂如水和水基水溶液中的直径在1-10nm范围内的具有角度的簇粒子的单晶金刚石研磨颗粒。 簇颗粒是没有方向性的结晶颗粒的流苏组件。

公开(公告)号：US20100160170A1

公开(公告)日：2010-06-24

申请号：US12438601

申请日：2007-08-24

申请人： Sanaki Horimoto ,  Takuya Nagamine ,  Takehiro Watanabe ,  Fumi Murokawa ,  Yuji Horie ,  Noriyuki Kumasaka ,  Masahiro Hosoi

发明人： Sanaki Horimoto ,  Takuya Nagamine ,  Takehiro Watanabe ,  Fumi Murokawa ,  Yuji Horie ,  Noriyuki Kumasaka ,  Masahiro Hosoi

IPC分类号： H01B12/02 ,  B24B7/13 ,  B24B21/00 ,  H01L39/24

CPC分类号： B24B7/13 ,  B24B21/00 ,  B24B37/04 ,  H01L39/2454 ,  Y10S505/813

摘要： A surface polishing method for enhancing crystal orientation on the surface of a tapelike metal substrate in order to enhance the critical current of a superconducting thin film. In an oxide superconductor comprising a tapelike substrate, an intermediate layer formed on the tapelike substrate, and an oxide superconducting thin film layer formed on the intermediate layer, the method for polishing a surface to be polished of the tapelike substrate comprises a step for polishing the surface to be polished while traveling the tapelike substrate continuously, wherein an initial polishing step and a finish polishing step are included. Ultimately, the average surface roughness Ra of the polished surface is 2 nanometer or less and the in-plane orientation Δφ is 5° or less.

摘要翻译： 为了提高超导薄膜的临界电流，在带状金属基板的表面上增强晶体取向的表面研磨方法。 在形成有带状基板的氧化物超导体，形成在带状基板上的中间层和形成在中间层上的氧化物超导薄膜层的情况下，对带状基板的被研磨面进行研磨的方法包括： 连续行进带状基板时要抛光的表面，其中包括初始抛光步骤和精抛光步骤。 最终，研磨表面的平均表面粗糙度Ra为2nm以下，面内取向为Dgr＆amp; 为5°以下。

公开(公告)号：US07631419B2

公开(公告)日：2009-12-15

申请号：US11893747

申请日：2007-08-17

申请人： Hiromitsu Okuyama ,  Yuji Horie

发明人： Hiromitsu Okuyama ,  Yuji Horie

IPC分类号： B23P19/00 ,  G11C5/12 ,  H01M2/04

CPC分类号： G11B23/505 ,  G11B5/8404 ,  Y10S428/922 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/49885 ,  Y10T29/53165 ,  Y10T428/13 ,  Y10T428/1352 ,  Y10T428/2918

摘要： A disk processing device holds and rotates a disk with a spindle. Processing tapes are supplied out and wound up by a tape reel unit so as to sandwich and be pressed on both surfaces of the disk through contact rollers. As a crankshaft is rotated, a sliding plate rotates around it and a slidable shaft rotates around a fulcrum part while sliding along the sliding plate such that the contact roller undergoes a reciprocating motion in a radial direction of the disk together with a slider rotatably attached to the slidable shaft.

摘要翻译： 磁盘处理装置保持并旋转具有主轴的盘。 处理带由磁带卷盘单元输出并卷起，以便通过接触辊将其夹在并压在盘的两个表面上。 当曲轴旋转时，滑板围绕其旋转，并且滑动轴围绕支点部分旋转，同时沿滑动板滑动，使得接触辊与盘的径向方向一起往复运动，滑块可旋转地连接到 滑动轴。

公开(公告)号：US20090163122A1

公开(公告)日：2009-06-25

申请号：US12064942

申请日：2007-07-05

申请人： Takehiro Watanabe ,  Sanaki Horimoto ,  Takuya Nagamine ,  Yuji Horie

发明人： Takehiro Watanabe ,  Sanaki Horimoto ,  Takuya Nagamine ,  Yuji Horie

IPC分类号： B24B7/12 ,  B24B1/00 ,  B24B21/12

CPC分类号： B24B7/13

摘要： A polishing system and a method are presented for uniformly polishing efficiently at a fast rate the surface of a tape-like metallic base material of several hundred meters in length. The polishing system is provided not only with devices for causing the base material to travel continuously and applying a specified tension in the base material but also with a first polishing device for randomly polishing the target surface and a second polishing device for carrying out a final polishing on the target surface in the direction of travel of the base material. Polishing marks are formed in the direction of travel on the target surface by the final polishing.

摘要翻译： 提出了一种抛光系统和方法，用于以高达数百米长的带状金属基材的表面快速均匀地均匀研磨。 抛光系统不仅具有用于使基材连续行进并在基材中施加特定张力的装置，而且还提供用于随机抛光目标表面的第一抛光装置和用于进行最终抛光的第二抛光装置 在基材的行进方向上的目标表面上。 通过最终研磨，在目标表面上的行进方向上形成抛光标记。

公开(公告)号：US20090163117A1

公开(公告)日：2009-06-25

申请号：US12394461

申请日：2009-02-27

申请人： Yuji Horie ,  Tatsuya Tanifuji ,  Noriyuki Kumasaka

发明人： Yuji Horie ,  Tatsuya Tanifuji ,  Noriyuki Kumasaka

IPC分类号： B24B7/24 ,  B24B7/26

CPC分类号： G11B5/7315 ,  B24B21/04 ,  B24B37/04 ,  C03C19/00 ,  C03C21/002 ,  C03C2204/08 ,  G11B5/8404

摘要： A glass substrate for perpendicular magnetic recording, having a surface with an average surface roughness of 2.0 Å or less and surface height variations of 1 Å or less with wavelengths in the range of 0.05 mm-0.5 mm in both radial and circumferential directions, is produced by rotating a glass substrate, supplying polishing slurry containing a specified amount of abrading particles of artificial diamond on its surface, pressing a polishing tape on the surface and causing this polishing tape to travel in a direction opposite to the direction of rotation of the glass substrate.

摘要翻译： 制造用于垂直磁记录的玻璃基板，具有平均表面粗糙度为2.0或更小的表面，以及在径向和圆周方向上的波长在0.05mm-0.5mm的范围内的表面高度变化为1或更小的表面高度变化 通过旋转玻璃基板，在其表面上供给包含特定量的人造金刚石研磨颗粒的研磨浆料，将表面上的研磨带压制，并使该研磨带沿与玻璃基板的旋转方向相反的方向行进 。

公开(公告)号：US20090093192A1

公开(公告)日：2009-04-09

申请号：US11911808

申请日：2006-04-18

申请人： Tamami Takahashi ,  Kenya Ito ,  Mitsuhiko Shirakashi ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki ,  Satoru Sato ,  Jun Watanabe ,  Kenji Kato ,  Jun Tamura ,  Souichi Asakawa

发明人： Tamami Takahashi ,  Kenya Ito ,  Mitsuhiko Shirakashi ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki ,  Satoru Sato ,  Jun Watanabe ,  Kenji Kato ,  Jun Tamura ,  Souichi Asakawa

IPC分类号： B24B9/00 ,  B24B49/12

CPC分类号： B24B9/065 ,  B24B21/16

摘要： A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.

摘要翻译： 用于抛光半导体晶片的周边部分的装置包括用于保持晶片的晶片台，包括用于旋转晶片台的装置的晶片台单元，使得晶片台在与表面相同的平面内进行旋转往复运动 的晶片台，并且平行于表面移动晶片台，用于抛光晶片上的凹口的凹口抛光部分和用于抛光晶片的斜面部分的斜面抛光部分。 将纯水供应到晶片，以防止其从凹口抛光部件输送到斜面抛光部件时变干。