公开(公告)号：US20070020812A1

公开(公告)日：2007-01-25

申请号：US11184979

申请日：2005-07-20

Applicant: Shih-Ping Hsu ,  Chu-Chin Hu

Inventor： Shih-Ping Hsu ,  Chu-Chin Hu

IPC: H01L21/00

CPC classification number: H05K3/323 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/29 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/24227 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K2201/10674 ,  H05K2203/0173 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199

Abstract: A circuit board structure integrated with semiconductor chip and a method of fabricating the same are proposed. A supporting plate formed with at least one cavity is provided and a semiconductor chip having a plurality of conductive contacts is embedded in the cavity. An anisotropic conductive film (ACF) layer and a circuit board formed with a plurality of conductive contacts on a surface thereof are provided. The circuit board is pressed to the supporting plate by the ACF layer, wherein the conductive contacts of the circuit board are electrically connected to the conductive contacts of the chip via the ACF layer, so as to form the circuit board structure integrated with semiconductor chip.

Abstract translation: 提出了与半导体芯片集成的电路板结构及其制造方法。 提供了形成有至少一个空腔的支撑板，并且具有多个导电触点的半导体芯片嵌入在空腔中。 提供各向异性导电膜（ACF）层和在其表面上形成有多个导电触点的电路板。 电路板通过ACF层压到支撑板上，其中电路板的导电触点通过ACF层电连接到芯片的导电触点，以形成与半导体芯片集成的电路板结构。

公开(公告)号：US20060279000A1

公开(公告)日：2006-12-14

申请号：US11407185

申请日：2006-04-20

Applicant: Ruei-Chih Chang ,  Chu-Chin Hu

Inventor： Ruei-Chih Chang ,  Chu-Chin Hu

IPC: H01L21/44 ,  H01L21/4763 ,  H01L23/48

CPC classification number: H05K3/4007 ,  H01L23/49816 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13109 ,  H01L2224/13609 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K3/3473 ,  H05K2201/0367 ,  H05K2201/09436 ,  H05K2203/043 ,  H05K2203/054 ,  H05K2203/0723 ,  H01L2224/29099 ,  H01L2224/05599

Abstract: A pre-solder structure on a semiconductor package substrate and a method for fabricating the same are proposed. A plurality of conductive pads are formed on the substrate, and a protective layer having a plurality of openings for exposing the conductive pads is formed over the substrate. A conductive seed layer is deposited over the protective layer and openings. A patterned resist layer is formed on the seed layer and has openings corresponding in position to the conductive pads. A plurality of conductive pillars and a solder material are deposited in sequence in each of the openings. The resist layer and the seed layer not covered by the conductive pillars and the solder material are removed. The solder material is subject to a reflow-soldering process to form pre-solder bumps covering the conductive pillars.

Abstract translation: 提出了半导体封装基板上的预焊结构及其制造方法。 在衬底上形成多个导电焊盘，并且在衬底上形成具有用于暴露导电焊盘的多个开口的保护层。 导电种子层沉积在保护层和开口上。 在种子层上形成图案化的抗蚀剂层，并且具有与导电焊盘相对应的位置的开口。 在每个开口中依次沉积多个导电柱和焊料。 除去未被导电柱和焊料材料覆盖的抗蚀剂层和籽晶层。 焊料材料经受回流焊接工艺以形成覆盖导电柱的预焊凸块。

公开(公告)号：US20060278999A1

公开(公告)日：2006-12-14

申请号：US11465750

申请日：2006-08-18

Applicant: Shih-Ping Hsu ,  Chu-Chin Hu

Inventor： Shih-Ping Hsu ,  Chu-Chin Hu

IPC: H01L23/48

CPC classification number: H01L24/81 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/1607 ,  H01L2224/16225 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2203/054 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A substrate for a pre-soldering material and a fabrication method of the substrate are proposed. The substrate having at least one surface formed with a plurality of conductive pads is provided. An insulating layer is formed over the surface of the substrate in such a way that a top surface of each of the conductive pads is exposed. Next, a conductive film and a resist layer are formed in sequence on the insulating layer and the conductive pads, wherein a plurality of openings are formed in the resist layer to expose a part of the conductive film above the conductive pad. Then, a pre-soldering material is deposited over the conductive pad by stencil printing or electroplating process.

Abstract translation: 提出了一种用于预焊材料的衬底和该衬底的制造方法。 提供具有形成有多个导电焊盘的至少一个表面的衬底。 在衬底的表面上形成绝缘层，使得每个导电焊盘的顶表面露出。 接下来，在绝缘层和导电焊盘上依次形成导电膜和抗蚀剂层，其中在抗蚀剂层中形成多个开口以暴露导电膜上方的导电膜的一部分。 然后，通过模板印刷或电镀工艺将预焊材料沉积在导电焊盘上。

公开(公告)号：US20050167830A1

公开(公告)日：2005-08-04

申请号：US10876474

申请日：2004-06-28

Applicant: Ruei-Chih Chang ,  Chu-Chin Hu

Inventor： Ruei-Chih Chang ,  Chu-Chin Hu

IPC: H01L21/44 ,  H01L21/60 ,  H01L23/48 ,  H01L23/498 ,  H01L23/52 ,  H01L29/40 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K3/4007 ,  H01L23/49816 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13109 ,  H01L2224/13609 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K3/3473 ,  H05K2201/0367 ,  H05K2201/09436 ,  H05K2203/043 ,  H05K2203/054 ,  H05K2203/0723 ,  H01L2224/29099 ,  H01L2224/05599

Abstract: A pre-solder structure on a semiconductor package substrate and a method for fabricating the same are proposed. A plurality of conductive pads are formed on the substrate, and a protective layer having a plurality of openings for exposing the conductive pads is formed over the substrate. A conductive seed layer is deposited over the protective layer and openings. A patterned resist layer is formed on the seed layer and has openings corresponding in position to the conductive pads. A plurality of conductive pillars and a solder material are deposited in sequence in each of the openings. The resist layer and the seed layer not covered by the conductive pillars and the solder material are removed. The solder material is subject to a reflow-soldering process to form pre-solder bumps covering the conductive pillars.

Abstract translation: 提出了半导体封装基板上的预焊结构及其制造方法。 在衬底上形成多个导电焊盘，并且在衬底上形成具有用于暴露导电焊盘的多个开口的保护层。 导电种子层沉积在保护层和开口上。 在种子层上形成图案化的抗蚀剂层，并且具有与导电焊盘相对应的位置的开口。 在每个开口中依次沉积多个导电柱和焊料。 除去未被导电柱和焊料材料覆盖的抗蚀剂层和籽晶层。 焊料材料经受回流焊接工艺以形成覆盖导电柱的预焊凸块。

公开(公告)号：US5314071A

公开(公告)日：1994-05-24

申请号：US988556

申请日：1992-12-10

Applicant: Donald J. Christian ,  Chin-Hu Feng ,  Jerry L. McComas ,  Andrew K. Chang

Inventor： Donald J. Christian ,  Chin-Hu Feng ,  Jerry L. McComas ,  Andrew K. Chang

IPC: B07C5/342 ,  B07C5/34 ,  G01N33/38 ,  B03B1/00

CPC classification number: G01N33/386 ,  B07C5/3416 ,  B07C5/366

Abstract: The invention provides a method and apparatus for purification and color sortation of waste glass, a glass beneficiation process and apparatus. The invention crushes the glass into pieces less than 3 inches in size, delables the glass, and then sorts the glass according to the light transmissive properties of the glass utilizing an array of lamps electrically connected to a control module.

Abstract translation: 本发明提供一种废玻璃净化和颜色分选方法和装置，一种玻璃选矿方法和装置。 本发明将玻璃粉碎成尺寸小于3英寸的碎片，使玻璃变得光滑，然后使用电连接到控制模块的灯阵列根据玻璃的透光性质对玻璃进行分类。