公开(公告)号：US08531021B2

公开(公告)日：2013-09-10

申请号：US13160874

申请日：2011-06-15

Applicant: Chu-Chin Hu ,  Shih-Ping Hsu ,  Yi-Ju Chen

Inventor： Chu-Chin Hu ,  Shih-Ping Hsu ,  Yi-Ju Chen

IPC: H01L23/02

CPC classification number: H01L21/56 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L25/105 ,  H01L25/162 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A package stack device includes a first package structure having a plurality of first metal posts and a first electronic element disposed on a surface thereof, a second package structure having a plurality of second metal posts and a second electronic element disposed on opposite surfaces thereof, and an encapsulant formed between the first and second package structures for encapsulating the first electronic element. By connecting the first and second metal posts, the second package structure is stacked on the first package structure with the support of the metal posts and the encapsulant filling the gap therebetween so as to prevent warpage of the substrate.

Abstract translation: 包装堆叠装置包括具有多个第一金属柱和设置在其表面上的第一电子元件的第一封装结构，具有多个第二金属柱的第二封装结构和设置在其相对表面上的第二电子元件， 形成在第一和第二封装结构之间用于封装第一电子元件的密封剂。 通过连接第一和第二金属柱，第二封装结构被堆叠在第一封装结构上，金属柱的支撑件和密封剂填充其间的间隙，以防止基板翘曲。

公开(公告)号：US07112524B2

公开(公告)日：2006-09-26

申请号：US10769451

申请日：2004-01-29

Applicant: Shih-Ping Hsu ,  Chu-Chin Hu

Inventor： Shih-Ping Hsu ,  Chu-Chin Hu

IPC: H01L21/44

CPC classification number: H01L24/81 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/1607 ,  H01L2224/16225 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2203/054 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A substrate for a pre-soldering material and a fabrication method of the substrate are proposed. The substrate having at least one surface formed with a plurality of conductive pads is provided. An insulating layer is formed over the surface of the substrate in such a way that a top surface of each of the conductive pads is exposed. Next, a conductive film and a resist layer are formed in sequence on the insulating layer and the conductive pads, wherein a plurality of openings are formed in the resist layer to expose a part of the conductive film above the conductive pad. Then, a pre-soldering material is deposited over the conductive pad by stencil printing or electroplating process.

Abstract translation: 提出了一种用于预焊材料的衬底和该衬底的制造方法。 提供具有形成有多个导电焊盘的至少一个表面的衬底。 在衬底的表面上形成绝缘层，使得每个导电焊盘的顶表面露出。 接下来，在绝缘层和导电焊盘上依次形成导电膜和抗蚀剂层，其中在抗蚀剂层中形成多个开口以暴露导电膜上方的导电膜的一部分。 然后，通过模板印刷或电镀工艺将预焊材料沉积在导电焊盘上。

公开(公告)号：US20050070084A1

公开(公告)日：2005-03-31

申请号：US10769451

申请日：2004-01-29

Applicant: Shih-Ping Hsu ,  Chu-Chin Hu

Inventor： Shih-Ping Hsu ,  Chu-Chin Hu

IPC: H01L21/44 ,  H01L21/60 ,  H05K3/34

CPC classification number: H01L24/81 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/1607 ,  H01L2224/16225 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2203/054 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A substrate for a pre-soldering material and a fabrication method of the substrate are proposed. The substrate having at least one surface formed with a plurality of conductive pads is provided. An insulating layer is formed over the surface of the substrate in such a way that a top surface of each of the conductive pads is exposed. Next, a conductive film and a resist layer are formed in sequence on the insulating layer and the conductive pads, wherein a plurality of openings are formed in the resist layer to expose a part of the conductive film above the conductive pad. Then, a pre-soldering material is deposited over the conductive pad by stencil printing or electroplating process.

Abstract translation: 提出了一种用于预焊材料的衬底和该衬底的制造方法。 提供具有形成有多个导电焊盘的至少一个表面的衬底。 在衬底的表面上形成绝缘层，使得每个导电焊盘的顶表面露出。 接下来，在绝缘层和导电焊盘上依次形成导电膜和抗蚀剂层，其中在抗蚀剂层中形成多个开口以暴露导电膜上方的导电膜的一部分。 然后，通过模板印刷或电镀工艺将预焊材料沉积在导电焊盘上。

公开(公告)号：US07319276B2

公开(公告)日：2008-01-15

申请号：US11465750

申请日：2006-08-18

Applicant: Shih-Ping Hsu ,  Chu-Chin Hu

Inventor： Shih-Ping Hsu ,  Chu-Chin Hu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/81 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/1607 ,  H01L2224/16225 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2203/054 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A substrate for a pre-soldering material and a fabrication method of the substrate are proposed. The substrate having at least one surface formed with a plurality of conductive pads is provided. An insulating layer is formed over the surface of the substrate in such a way that a top surface of each of the conductive pads is exposed. Next, a conductive film and a resist layer are formed in sequence on the insulating layer and the conductive pads, wherein a plurality of openings are formed in the resist layer to expose a part of the conductive film above the conductive pad. Then, a pre-soldering material is deposited over the conductive pad by stencil printing or electroplating process.

Abstract translation: 提出了一种用于预焊材料的衬底和该衬底的制造方法。 提供具有形成有多个导电焊盘的至少一个表面的衬底。 在衬底的表面上形成绝缘层，使得每个导电焊盘的顶表面露出。 接下来，在绝缘层和导电焊盘上依次形成导电膜和抗蚀剂层，其中在抗蚀剂层中形成多个开口以暴露导电膜上方的导电膜的一部分。 然后，通过模板印刷或电镀工艺将预焊材料沉积在导电焊盘上。

公开(公告)号：US20070020812A1

公开(公告)日：2007-01-25

申请号：US11184979

申请日：2005-07-20

Applicant: Shih-Ping Hsu ,  Chu-Chin Hu

Inventor： Shih-Ping Hsu ,  Chu-Chin Hu

IPC: H01L21/00

CPC classification number: H05K3/323 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/29 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/24227 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K2201/10674 ,  H05K2203/0173 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199

Abstract: A circuit board structure integrated with semiconductor chip and a method of fabricating the same are proposed. A supporting plate formed with at least one cavity is provided and a semiconductor chip having a plurality of conductive contacts is embedded in the cavity. An anisotropic conductive film (ACF) layer and a circuit board formed with a plurality of conductive contacts on a surface thereof are provided. The circuit board is pressed to the supporting plate by the ACF layer, wherein the conductive contacts of the circuit board are electrically connected to the conductive contacts of the chip via the ACF layer, so as to form the circuit board structure integrated with semiconductor chip.

Abstract translation: 提出了与半导体芯片集成的电路板结构及其制造方法。 提供了形成有至少一个空腔的支撑板，并且具有多个导电触点的半导体芯片嵌入在空腔中。 提供各向异性导电膜（ACF）层和在其表面上形成有多个导电触点的电路板。 电路板通过ACF层压到支撑板上，其中电路板的导电触点通过ACF层电连接到芯片的导电触点，以形成与半导体芯片集成的电路板结构。

公开(公告)号：US20060278999A1

公开(公告)日：2006-12-14

申请号：US11465750

申请日：2006-08-18

Applicant: Shih-Ping Hsu ,  Chu-Chin Hu

Inventor： Shih-Ping Hsu ,  Chu-Chin Hu

IPC: H01L23/48

CPC classification number: H01L24/81 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/1607 ,  H01L2224/16225 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2203/054 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A substrate for a pre-soldering material and a fabrication method of the substrate are proposed. The substrate having at least one surface formed with a plurality of conductive pads is provided. An insulating layer is formed over the surface of the substrate in such a way that a top surface of each of the conductive pads is exposed. Next, a conductive film and a resist layer are formed in sequence on the insulating layer and the conductive pads, wherein a plurality of openings are formed in the resist layer to expose a part of the conductive film above the conductive pad. Then, a pre-soldering material is deposited over the conductive pad by stencil printing or electroplating process.

Abstract translation: 提出了一种用于预焊材料的衬底和该衬底的制造方法。 提供具有形成有多个导电焊盘的至少一个表面的衬底。 在衬底的表面上形成绝缘层，使得每个导电焊盘的顶表面露出。 接下来，在绝缘层和导电焊盘上依次形成导电膜和抗蚀剂层，其中在抗蚀剂层中形成多个开口以暴露导电膜上方的导电膜的一部分。 然后，通过模板印刷或电镀工艺将预焊材料沉积在导电焊盘上。

公开(公告)号：US20120193789A1

公开(公告)日：2012-08-02

申请号：US13160874

申请日：2011-06-15

Applicant: Chu-Chin Hu ,  Shih-Ping Hsu ,  Yi-Ju Chen

Inventor： Chu-Chin Hu ,  Shih-Ping Hsu ,  Yi-Ju Chen

IPC: H01L23/488 ,  H01L21/56

CPC classification number: H01L21/56 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L25/105 ,  H01L25/162 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A package stack device includes a first package structure having a plurality of first metal posts and a first electronic element disposed on a surface thereof, a second package structure having a plurality of second metal posts and a second electronic element disposed on opposite surfaces thereof, and an encapsulant formed between the first and second package structures for encapsulating the first electronic element. By connecting the first and second metal posts, the second package structure is stacked on the first package structure with the support of the metal posts and the encapsulant filling the gap therebetween so as to prevent warpage of the substrate.

Abstract translation: 包装堆叠装置包括具有多个第一金属柱和设置在其表面上的第一电子元件的第一封装结构，具有多个第二金属柱的第二封装结构和设置在其相对表面上的第二电子元件， 形成在第一和第二封装结构之间用于封装第一电子元件的密封剂。 通过连接第一和第二金属柱，第二封装结构被堆叠在第一封装结构上，金属柱的支撑件和密封剂填充其间的间隙，以防止基板翘曲。

公开(公告)号：US08610006B2

公开(公告)日：2013-12-17

申请号：US12604907

申请日：2009-10-23

Applicant: Shih-Ping Hsu ,  Kun-Chen Tsai ,  Micallaef Ivan

Inventor： Shih-Ping Hsu ,  Kun-Chen Tsai ,  Micallaef Ivan

IPC: H01L23/28

CPC classification number: H05K9/0084 ,  B81B7/0061 ,  B81B7/0064 ,  B81B2201/0257 ,  H04R19/005

Abstract: A lid for a micro-electro-mechanical device and a method for fabricating the same are provided. The lid includes a board with opposite first and second surfaces and a first conductor layer. The first surface has a first metal layer thereon. The first metal layer and the board have a recess formed therein. The recess has a bottom surface and a side surface adjacent thereto. The first conductor layer is formed on the first metal layer and the bottom and side surfaces of the recess. The shielding effect of the side surface of the board is enhanced because of the recess integral to the board, the homogeneous bottom and side surfaces of the recess, and the first conductor layer covering the first metal layer, the bottom and side surfaces of the recess.

Abstract translation: 提供了一种微机电装置用盖及其制造方法。 盖子包括具有相对的第一和第二表面的板和第一导体层。 第一表面上具有第一金属层。 第一金属层和板具有形成在其中的凹部。 凹部具有底表面和与其相邻的侧表面。 第一导体层形成在第一金属层和凹部的底部和侧表面上。 板的侧面的屏蔽效果由于与板的整体凹部，凹部的均匀的底部和侧表面以及覆盖第一金属层的第一导体层，凹部的底部和侧表面而增强 。

公开(公告)号：US08101866B2

公开(公告)日：2012-01-24

申请号：US12175348

申请日：2008-07-17

Applicant: Shih-Ping Hsu

Inventor： Shih-Ping Hsu

IPC: H01R9/00

CPC classification number: H05K3/3473 ,  H01L23/498 ,  H01L23/49816 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/13006 ,  H01L2224/13565 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K3/243 ,  H05K3/3452 ,  H05K3/4007 ,  H05K2201/0341 ,  H05K2201/0367 ,  H05K2201/099 ,  H05K2203/054 ,  H01L2224/05552

Abstract: A packaging substrate with conductive structure is provided, including a substrate body having at least one conductive pad on a surface thereof, a stress buffer metal layer disposed on the conductive pad, a solder resist layer disposed on the substrate body and having at least one opening therein for correspondingly exposing a portion of top surface of the stress buffer metal layer, a metal post disposed on a central portion of the surface of the stress buffer metal layer, and a solder bump covering the surfaces of the metal post. Therefore, a highly reliable conductive structure is provided, by using the stress buffer metal layer to release thermal stresses, and using the metal post and the solder bump to increase the height of the conductive structure.

Abstract translation: 提供一种具有导电结构的封装基板，包括：具有在其表面上至少有一个导电焊盘的基板主体，设置在导电焊盘上的应力缓冲金属层，设置在基板主体上的阻焊层，并具有至少一个开口 用于相应地暴露应力缓冲金属层的顶表面的一部分，设置在应力缓冲金属层的表面的中心部分上的金属柱和覆盖金属柱的表面的焊料凸块。 因此，通过使用应力缓冲金属层来释放热应力，并且使用金属柱和焊料凸块来增加导电结构的高度，提供了高度可靠的导电结构。

公开(公告)号：US07656040B2

公开(公告)日：2010-02-02

申请号：US11756403

申请日：2007-05-31

Applicant: Shih-Ping Hsu ,  Chung-Cheng Lien ,  Chia-Wei Chang

Inventor： Shih-Ping Hsu ,  Chung-Cheng Lien ,  Chia-Wei Chang

IPC: H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/5389 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L25/105 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/19041 ,  H05K1/186 ,  H05K3/323 ,  H05K3/4602 ,  H05K3/4614 ,  H05K2201/09536 ,  H05K2203/061 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A stack structure of circuit boards embedded with semiconductor components therein is proposed, which includes at least two semiconductor components embedded circuit boards, a plurality of conductive bumps, and at least one adhesive layer. The circuit boards are each formed with a circuit layer having a plurality of electrical connection pads. The conductive bumps are formed on the electrical connection pads of at least one of the circuit boards. The adhesive layer is formed between the circuit boards such that a portion of the adhesive layer between the conductive bumps and the electrical connection pads, or between the opposing conductive bumps, forms a conductive channel and thereby forms an electrical connection between the circuit boards.

Abstract translation: 提出了嵌入其中的半导体部件的电路板的堆叠结构，其包括至少两个半导体部件嵌入式电路板，多个导电凸块和至少一个粘合剂层。 电路板各自形成有具有多个电连接焊盘的电路层。 导电凸块形成在至少一个电路板的电连接焊盘上。 粘合剂层形成在电路板之间，使得导电凸块和电连接焊盘之间或相对的导电凸块之间的粘合剂层的一部分形成导电通道，从而在电路板之间形成电连接。