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36 条记录 (耗时 0.016 秒)

    Lift-off method for forming write pole of a magnetic write head and write pole formed thereby
    31.
    发明授权
    Lift-off method for forming write pole of a magnetic write head and write pole formed thereby 失效
    用于形成磁写头和由此形成的写磁极的写极的剥离方法

    公开(公告)号：US07554764B2

    公开(公告)日：2009-06-30

    申请号：US11399820

    申请日：2006-04-07

    申请人： Hamid Balamane ,  Jyh-Shuey Lo ,  Yi Zheng

    发明人： Hamid Balamane ,  Jyh-Shuey Lo ,  Yi Zheng

    IPC分类号： G11B5/147

    CPC分类号： G11B5/3163 ,  G11B5/1278 ,  Y10T29/49043

    摘要： A lift-off method for forming write pole of a magnetic write head and write pole formed thereby is disclosed. A write pole including a hard mask on a top portion of the write pole is formed. A layer of material for reinforcing sidewall fencing of the write pole is deposited. Portions of the layer of material on top of the write pole are removed while the layer of material at the sidewall fencing is left to provide support to the sidewall fencing.

    摘要翻译： 公开了一种用于形成磁写头和由此形成的写磁极的写极的剥离方法。 形成在写入极的顶部包括硬掩模的写入极。 一层用于加强写柱的侧壁围栏的材料被沉积。 除去写磁极顶部的材料层的部分，同时留下侧壁围栏处的材料层以向侧壁围栏提供支撑。

    Process to open connection vias on a planarized surface
    32.
    发明授权
    Process to open connection vias on a planarized surface 有权
    在平坦化表面上打开连接通孔的过程

    公开(公告)号：US07523550B2

    公开(公告)日：2009-04-28

    申请号：US11411555

    申请日：2006-04-25

    申请人： Amanda Baer ,  Hamid Balamane ,  Michael Feldbaum ,  Ming Jiang ,  Aron Pentek

    发明人： Amanda Baer ,  Hamid Balamane ,  Michael Feldbaum ,  Ming Jiang ,  Aron Pentek

    IPC分类号： H01K3/10

    CPC分类号： G11B5/3163 ,  G11B5/1278 ,  G11B5/3116 ,  Y10T29/49021 ,  Y10T29/49032 ,  Y10T29/49044 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49169

    摘要： A method for forming a via in an alumina protective layer on a structure such as a magnetic write head for use in perpendicular magnetic recording. A structure such as a magnetic pole, and or magnetic trailing shield, is formed over a substrate and is covered with a thick layer of alumina. The alumina layer can then be planarized by a chemical mechanical polishing process (CMP) and then a mask structure, such as a photoresist mask, is formed over the alumina layer. The mask structure is formed with an opening disposed over the contact pad. A reactive ion mill is then performed to remove portions of the alumina layer that are exposed at the opening in the mask, thereby forming a via in the alumina layer.

    摘要翻译： 在用于垂直磁记录的诸如磁写头的结构上的氧化铝保护层中形成通孔的方法。 诸如磁极和/或磁性后屏蔽的结构形成在衬底上并被厚层氧化铝覆盖。 然后可以通过化学机械抛光工艺（CMP）将氧化铝层平坦化，然后在氧化铝层上形成诸如光致抗蚀剂掩模的掩模结构。 掩模结构形成有设置在接触垫上方的开口。 然后执行反应离子研磨机以除去在掩模中的开口处暴露的部分氧化铝层，从而在氧化铝层中形成通孔。

    Method of laser cutting a metal line on an MR head
    36.
    发明授权
    Method of laser cutting a metal line on an MR head 失效
    激光切割MR头上的金属线的方法

    公开(公告)号：US5759428A

    公开(公告)日：1998-06-02

    申请号：US616395

    申请日：1996-03-15

    申请人： Hamid Balamane ,  Chie Ching Poon ,  Neil Leslie Robertson ,  Andrew Ching Tam

    发明人： Hamid Balamane ,  Chie Ching Poon ,  Neil Leslie Robertson ,  Andrew Ching Tam

    IPC分类号： B23K26/40 ,  B23K26/08

    CPC分类号： B23K26/40 ,  B23K26/362 ,  B23K2203/26 ,  B23K2203/50 ,  Y10T29/49032

    摘要： A thin film conductive line is formed between MR pads on an MR head for protecting an MR sensor from electrostatic discharge (ESD) during assembly steps between row level fabrication of the head and prior to merge of a head stack assembly with a disk stack assembly. The conductive line may have a reduced thickness delete pad. A laser beam having a fluence sufficient to sever the conductive line at the delete pad but insufficient to damage or cause debris from structure underlying or surrounding the conductive line is used to sever the conductive line. The method traverses minimum energy, short laser pulses at a high pulse rate across the width of the conductive line so that each laser pulse melts conductive material across the line, the melted material withdrawing from the melted area and being heaped on top of adjacent portions of the delete pad by surface tension and the melted material cooling to room temperature before the next pulse so that there is no cumulative heating and therefore no damage to or debris from the underlying structure. The conductive material of the line is incrementally plowed to each side of a severed path by successive overlapping laser pulses so that when the series of laser pulses has traversed the width of the delete pad the conductive line has been severed.

    摘要翻译： 在MR头上的MR焊盘之间形成薄膜导电线，用于在磁头堆叠组件与磁盘堆叠组件合并之前的组装步骤期间保护MR传感器免受静电放电（ESD）的影响。 导线可以具有减小的厚度删除焊盘。 激光束具有足够的能量来切断在删除焊盘处的导线，但是不足以损坏或者导致来自导电线下面或周围的结构的碎屑被切断导线。 该方法在导线的宽度上以高脉冲速度穿过最小能量，短激光脉冲，使得每个激光脉冲在导线上熔化导电材料，熔化的材料从熔化区域中排出并堆叠在相邻部分的顶部 删除垫由表面张力和熔化的材料在下一个脉冲之前冷却至室温，使得没有累积加热，因此不会从底层结构损坏或碎屑。 线的导电材料通过连续重叠的激光脉冲逐渐地被切割到切断路径的每一侧，使得当一系列激光脉冲已经穿过删除焊盘的宽度时，导线已被切断。