摘要:
The invention is directed to a method for clock distribution and VLSI circuits include a clock distribution network. In a method of the invention, a transmission lines are patterned as to connect a clock tree and a periodic waveform clock, preferably a sine waveform, is used to control clock skew, even at frequencies extending into the gigahertz range. In an exemplary embodiment of the invention, an overlay includes differential pairs of transmission lines that connect the drivers of a clock distribution tree. In preferred embodiments of the invention, an H-tree clock distribution scheme is overlayed with a spiral of transmission lines, each realized by a differential conductors and driven using a sinusoidal standing wave to distribute global clock signals into local regions of the chip. Each transmission line connects drivers in the H-tree that are at the same level of the H-tree. In a VLSI chip according to an embodiment of the invention, the transmission line overlay delivers sinusoidal clock signals to local areas that are locally converted into digital clock signals. The invention thus presents a passive technique for clock distribution.
摘要:
Improved microlayer structures and methods typically employing at least 4 stacked layers of polymers (e.g., including alternating layers of components A and B), such as that obtained by coextrusion. The layers each have a thickness of less than about 50 microns. One optional approach involves forming an intermediate form that includes at least one elongated member made from the plurality of layers, from which a shaped composite article may be made.
摘要:
Fiber and fabric compositions of a continuous scouring process and/or capable of being heat set have now been discovered that often have a balanced combination of desirable properties. Said compositions comprise olefin block interpolymers.
摘要:
In one embodiment, a method includes accessing a description of a chip including multiple sequential elements and a clock mesh, information for modeling the sequential elements and interconnections, and a set of parameters of the clock mesh. The method also includes, using the description of the chip, the information for modeling the sequential elements and interconnections, and the set of parameters of the clock mesh, determining multiple window locations covering the clock mesh. Each window location includes one or more of the sequential elements on the chip. The method also includes, for each window location, generating a mesh simulation model including a detailed model inside the window location and an approximate model outside the window location, simulating the mesh simulation model, and measuring clock timing for the sequential elements in the window location based on the mesh simulation model. The method also includes collecting timing information on the sequential elements on the chip based on the measured clock timing for the sequential elements in the window locations.
摘要:
Curable polyolefin composition comprising: (A) polyolefin having at least two aliphatic unsaturated bonds per molecule; (B) wax with melting point of 30 to 100° C.; (C) organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (D) catalytic amount of hydrosilylation reaction catalyst, wherein content of component (A) is 20 to 80 mass %, content of component (B) is 10 to 75 mass %, and content of component (C) is 1 to 20 mass %, each based on the total mass of components (A) to (D). The composition can be cured to form a cured product capable of storing and releasing thermal energy, and preventing the wax leaking/pumping out during heat cycling.
摘要:
A nylon composition comprising a blend, wherein the blend includes: (a) at least one polyamide; and (b) at least one modifier, wherein the modifier includes a substantially linear functionalized ethylene/alpha-olefin copolymer having at least one side chain furan moiety crosslinked with at least one maleimide structure; a process for making the composition; and an article made from the composition.
摘要:
Methods and systems that can produce light weight reinforced thermoplastic articles are described. In some embodiments, a method includes heating and pressing a core layer and then cooling and pressing the core layer to maintain the thickness of the core layer during cooling. Automotive articles, building articles and recreational vehicle articles that can be produced using the methods and systems are also described.
摘要:
Described is an epoxy composition containing: (a) an epoxy resin containing at least one epoxy group, (b) an anhydride hardener, (c) a hydroxyl-terminated polysiloxane, and (d) a functional silane having at least one functional group selected from the group consisting of an epoxy-reactive group, an anhydride-reactive group, and an epoxy- and anhydride-reactive group. Also describing a crosslinked epoxy composition and a method for preparing thereof.
摘要:
Various embodiments of systems and methods for unified configuration for cloud integration are described herein. In an aspect, the method includes rendering a unified configuration interface within a cloud application for performing cloud integration. The unified configuration interface includes a first widget to configure an external system for integration with the cloud application and a second widget to configure an integration flow (iflow) between the external system and the cloud application. The iflow defines data flow between the configured external system and the cloud application. Subsequent to receiving a confirmation of the selected iflow, integrating the external system with the cloud application to share data in the cloud.
摘要:
Described is an epoxy composition containing: (a) an epoxy resin containing at least one epoxy group, (b) an anhydride hardener, (c) a hydroxyl-terminated polysiloxane, and (d) a functional silane having at least one functional group selected from the group consisting of an epoxy-reactive group, an anhydride-reactive group, and an epoxy- and anhydride-reactive group. Also describing a crosslinked epoxy composition and a method for preparing thereof.