公开(公告)号：US09106484B2

公开(公告)日：2015-08-11

申请号：US13539691

申请日：2012-07-02

申请人： Liang Ping Peng ,  Norman Tang ,  David Lai ,  Anthony Nguyen

发明人： Liang Ping Peng ,  Norman Tang ,  David Lai ,  Anthony Nguyen

IPC分类号： H04J3/00 ,  H04L29/10 ,  H04L12/24

CPC分类号： H04L29/10 ,  H04L41/083

摘要： A system, method and apparatus is provided for optimizing network data communications. At an extender device, a data signal is received at a host link port across a data cable that is interfaced with the host link port. The host link port is configured to receive the data signal. The data cable is configured to carry management communications and data communications between a switch host device and the extender unit device. The data signal is split into data signal components. Each of the data signal components comprises a ten gigabit per second portion of the data signal. The data signal components are sent to one or more network devices via one or more corresponding data transmission ports.

摘要翻译： 提供了一种用于优化网络数据通信的系统，方法和装置。 在扩展器装置上，数据信号通过与主机链路端口连接的数据电缆在主机链路端口处被接收。 主机链路端口被配置为接收数据信号。 数据电缆被配置为在交换主机设备和扩展器单元设备之间承载管理通信和数据通信。 数据信号分为数据信号分量。 每个数据信号分量包括数据信号的每秒十千兆位。 数据信号分量通过一个或多个对应的数据传输端口发送到一个或多个网络设备。

公开(公告)号：US20140003448A1

公开(公告)日：2014-01-02

申请号：US13539691

申请日：2012-07-02

申请人： Liang Ping Peng ,  Norman Tang ,  David Lai ,  Anthony Nguyen

发明人： Liang Ping Peng ,  Norman Tang ,  David Lai ,  Anthony Nguyen

IPC分类号： H04L29/10

CPC分类号： H04L29/10 ,  H04L41/083

摘要： A system, method and apparatus is provided for optimizing network data communications. At an extender device, a data signal is received at a host link port across a data cable that is interfaced with the host link port. The host link port is configured to receive the data signal. The data cable is configured to carry management communications and data communications between a switch host device and the extender unit device. The data signal is split into data signal components. Each of the data signal components comprises a ten gigabit per second portion of the data signal. The data signal components are sent to one or more network devices via one or more corresponding data transmission ports.

摘要翻译： 提供了一种用于优化网络数据通信的系统，方法和装置。 在扩展器装置上，数据信号通过与主机链路端口连接的数据电缆在主机链路端口处被接收。 主机链路端口被配置为接收数据信号。 数据电缆被配置为在交换主机设备和扩展器单元设备之间承载管理通信和数据通信。 数据信号分为数据信号分量。 每个数据信号分量包括数据信号的每秒十千兆位。 数据信号分量通过一个或多个对应的数据传输端口发送到一个或多个网络设备。

公开(公告)号：US20120250735A1

公开(公告)日：2012-10-04

申请号：US13074613

申请日：2011-03-29

申请人： Norman Tang ,  Liang Ping Peng ,  David Lai ,  Anthony Nguyen

发明人： Norman Tang ,  Liang Ping Peng ,  David Lai ,  Anthony Nguyen

IPC分类号： H04B1/38

CPC分类号： G06F13/409 ,  Y02D10/14 ,  Y02D10/151

摘要： An apparatus includes a transceiver device mounted on a printed circuit board and configured to transmit and receive signals that comply with a 10GBASE-T standard. A pluggable connector is disposed at one end of the printed circuit board and is coupled to the transceiver device. The pluggable connector is configured to plug into an X2 system port to convey signals that comply with the 10GBASE-T standard between the transceiver device and a system device. A port device is disposed at an opposing end of the printed circuit board and is coupled to the transceiver device. The port device is configured to receive a transmission cable to convey signals that comply with the 10GBASE-T standard between the transceiver device and a network device.

摘要翻译： 一种装置包括安装在印刷电路板上并被配置为发送和接收符合10GBASE-T标准的信号的收发器装置。 可插拔连接器设置在印刷电路板的一端并耦合到收发器装置。 可插拔连接器配置为插入X2系统端口，以在收发器设备和系统设备之间传送符合10GBASE-T标准的信号。 端口装置设置在印刷电路板的相对端并耦合到收发器装置。 端口设备被配置为接收传输电缆以在收发器设备和网络设备之间传送符合10GBASE-T标准的信号。

公开(公告)号：US08252633B2

公开(公告)日：2012-08-28

申请号：US13031658

申请日：2011-02-22

申请人： Wan-Lan Chiang ,  Kuang Hann Lin ,  Chih-Ping Peng

发明人： Wan-Lan Chiang ,  Kuang Hann Lin ,  Chih-Ping Peng

IPC分类号： H01L21/00

CPC分类号： H01L23/367 ,  H01L23/4093 ,  H01L23/4334 ,  H01L23/49562 ,  H01L2924/0002 ,  H01L2924/00

摘要： The semiconductor assembly includes a first subassembly having a heat sink. Solder material is disposed on the exposed portion of a first surface of heat sink. A power semiconductor die is located on the first surface of the heat sink and is thermally coupled thereto by the solder material. A packaging patterned polymer layer is disposed on a second surface of the heat sink opposing the first surface and defines an interior surface portion of the heat sink. A semiconductor package is provided in which the first subassembly, solder material and die are located such that the interior surface portion of the second surface of the heat sink is not enclosed by the semiconductor package.

摘要翻译： 半导体组件包括具有散热器的第一子组件。 焊料设置在散热片的第一表面的暴露部分上。 功率半导体管芯位于散热器的第一表面上并且通过焊料材料热耦合到其上。 封装图案化聚合物层设置在散热器的与第一表面相对的第二表面上并且限定散热器的内表面部分。 提供了半导体封装，其中第一子组件，焊料材料和管芯被定位成使得散热器的第二表面的内表面部分不被半导体封装封闭。

公开(公告)号：US20120087675A1

公开(公告)日：2012-04-12

申请号：US12925096

申请日：2010-10-12

申请人： Liang-Ping Peng ,  Norman Tang ,  David Lai

发明人： Liang-Ping Peng ,  Norman Tang ,  David Lai

IPC分类号： H04B10/12 ,  H01R24/00 ,  H01R13/66

CPC分类号： H04B10/2581 ,  H04B10/40

摘要： An apparatus, in accordance with particular embodiments, includes an interface configured to establish connections within a copper network. The apparatus also includes a receptacle configured to receive a conventional small form-factor pluggable (SFP) module or a compact SFP module and to direct the SFP modules to a first connector. The first connector connects either of the SFP modules to the node. A pin of the first connector is configured to receive a module detection signal and to transmit data to the compact SFP module. The apparatus also includes a low pass filter coupled to the pin of the first connector that passes the module detection signal to the node. The apparatus is further configured to establish two duplex connections with an optical fiber network if the compact SFP module is connected and to establish one duplex connection with the optical fiber network if the conventional SFP module is connected.

摘要翻译： 根据特定实施例的装置包括被配置为在铜网络内建立连接的接口。 所述设备还包括被配置为接收传统的小型可插拔（SFP）模块或紧凑的SFP模块并将SFP模块引导到第一连接器的插座。 第一个连接器将SFP模块中的任一个连接到节点。 第一个连接器的引脚配置为接收模块检测信号并将数据传输到紧凑型SFP模块。 该装置还包括耦合到第一连接器的引脚的低通滤波器，其将模块检测信号传递到节点。 如果连接了紧凑的SFP模块，该装置还被配置为与光纤网络建立两个双工连接，并且如果传统的SFP模块被连接，则与光纤网络建立一个双工连接。

公开(公告)号：US07811853B1

公开(公告)日：2010-10-12

申请号：US12273402

申请日：2008-11-18

申请人： Hsui-Ping Peng

发明人： Hsui-Ping Peng

IPC分类号： H01L21/44

CPC分类号： H01L21/78

摘要： Methods directed to avoiding die cracking resulting from die separation are described herein. A method may include providing a substrate including a plurality of dies separated from each other by at least a dielectric material, removing the dielectric material substantially down to the substrate to form gaps between the plurality of dies, and singulating the plurality of dies along the gaps between the plurality of dies.

摘要翻译： 本文描述了旨在避免由模具分离产生的模头破裂的方法。 一种方法可以包括提供包括通过至少介电材料彼此分离的多个管芯的衬底，将电介质材料基本上向下移动到衬底以在多个管芯之间形成间隙，并且沿着间隙分离多个管芯 在多个管芯之间。

公开(公告)号：US20090014863A1

公开(公告)日：2009-01-15

申请号：US11827593

申请日：2007-07-12

申请人： Wan-Lan Chiang ,  Kuang Hann Lin ,  Chih-Ping Peng

发明人： Wan-Lan Chiang ,  Kuang Hann Lin ,  Chih-Ping Peng

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L23/367 ,  H01L23/4093 ,  H01L23/4334 ,  H01L23/49562 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2924/014

摘要： A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first surface. The exposed portion of the first surface extends radially inward along the heat sink surface from the first layer. The subassembly also includes a second patterned polymer layer disposed on a radially outer portion of the first patterned polymer layer. The first and second layers define a cell for accommodating a power semiconductor die. Solder material is disposed on the exposed portion of the heat sink surface and in the cell. A power semiconductor die is located within the cell on a radially inward portion of the first layer and thermally coupled to the heat sink by the solder material.

摘要翻译： 半导体组件包括第一子组件，其包括散热器和设置在散热器的表面上以限定第一表面的暴露部分的第一图案化聚合物层。 第一表面的暴露部分沿着散热表面从第一层径向向内延伸。 子组件还包括设置在第一图案化聚合物层的径向外部部分上的第二图案化聚合物层。 第一和第二层限定用于容纳功率半导体管芯的电池。 焊料设置在散热器表面的暴露部分和电池中。 功率半导体管芯位于第一层的径向向内部分内的单元内，并通过焊料材料热耦合到散热器。

公开(公告)号：US20080308257A1

公开(公告)日：2008-12-18

申请号：US11808661

申请日：2007-06-12

申请人： Ji-Ping Peng ,  Yi-Shen Chien

发明人： Ji-Ping Peng ,  Yi-Shen Chien

IPC分类号： F28D15/04

CPC分类号： F28D15/0266 ,  F28D15/0275 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipating assembly for dissipating heat of a heat source is provided. The heat dissipating assembly includes a body, at least one circulation pipe, and a working fluid. The body has a chamber defined therein and least one pipeline formed in a wall of the body. The body further has at least one first orifice in communication with the chamber of the body, and at least one second orifice in communication with the pipeline. The circulation pipe has two end portions respectively connected to the first orifice and the second orifice. The working fluid is accommodated in the chamber of the body, wherein the working fluid flows into the circulation pipe through the first orifice, and flows into the pipeline through the second orifice to flow back to the chamber of the body, thereby forming a two phase circulation loop.

摘要翻译： 提供了一种用于耗散热源的散热组件。 散热组件包括主体，至少一个循环管和工作流体。 本体具有限定在其中的腔室和形成在身体的壁中的至少一个管道。 主体还具有至少一个与主体的腔室连通的第一孔口以及与管道连通的至少一个第二孔口。 循环管具有分别连接到第一孔和第二孔的两个端部。 工作流体容纳在主体的腔室中，其中工作流体通过第一孔口流入循环管道，并通过第二孔口流入管道，以流回到体内的腔室，从而形成两相 循环回路。

公开(公告)号：US20060105498A1

公开(公告)日：2006-05-18

申请号：US10917444

申请日：2004-08-13

申请人： Cheng-Chung Huang ,  Tzu-Yen Lin ,  Hui-Ping Peng

发明人： Cheng-Chung Huang ,  Tzu-Yen Lin ,  Hui-Ping Peng

IPC分类号： H01L25/10

CPC分类号： H01L21/67369 ,  H01L21/67383

摘要： An integrated circuit wafer container and separator combination. The separator comprises a substantially flat main area and a plurality of elevated projections in the periphery thereof. The elevated projections sustain the weight of the wafer stacks, avoid vacuum adhesion, and minimize contact with wafers.

摘要翻译： 集成电路晶片容器和分离器组合。 分离器包括基本上平坦的主区域和在其周边的多个升高的​​突起。 升高的投影维持晶片堆叠的重量，避免真空附着，并最小化与晶片的接触。

公开(公告)号：US20050146467A1

公开(公告)日：2005-07-07

申请号：US10749197

申请日：2003-12-30

申请人： Ziming He ,  Ping Peng ,  Jim Zhao ,  Chiu-Yu Tang ,  Tien-Lu Kao

发明人： Ziming He ,  Ping Peng ,  Jim Zhao ,  Chiu-Yu Tang ,  Tien-Lu Kao

IPC分类号： H01Q1/38 ,  H01Q9/04

CPC分类号： H01Q9/0407 ,  H01Q9/0442

摘要： A high gain and omni-directive dual-patch antenna (1) for wireless communication under IEEE 802.11b/g standard includes a top and a bottom radiating patches (10) and (20) which have the same dimension, each of which in effect being a ground portion of the other, an air parch dielectric substrate between the two radiating patches, a feeding cable (30) inserted between the two radiating patches, and a support potion (40). A plurality of matching holes (202) is defined in both radiating patches and is provided for fast impedance match tuning and heat dissipation.