公开(公告)号：US20100138671A1

公开(公告)日：2010-06-03

申请号：US12630646

申请日：2009-12-03

Applicant: Jong Kim ,  Sangho Lee ,  Heejin Park

Inventor： Jong Kim ,  Sangho Lee ,  Heejin Park

IPC: G06F21/24

CPC classification number: G06F21/10 ,  G06F2221/0728

Abstract: Methods and apparatuses for providing DRM interoperability are provided. Proxy re-encryption technique using bilinear map is used, and the same content can be used in different devices. According to the method of providing DRM interoperability includes in proxy agent with respect to digital rights management (DRM) service providers and device which supports predetermined DRM, first DRM service provider, second DRM service provider, the proxy agent, and the device identify each other, and proxy re-encrypt an interoperable content (IC) and provide the IC to the device. The IC is second-level encrypted by using a key of the first DRM service provider, and the proxy re-encryption is performed by using a proxy key generated from proxy key information provided from the first DRM service provider and the second DRM service provider. Therefore, a problem in which interoperability cannot be guaranteed since a DRM technique depends on a service provider is resolved.

Abstract translation: 提供了提供DRM互操作性的方法和设备。 使用双线性映射的代理重新加密技术，相同的内容可以在不同的设备中使用。 根据提供DRM互操作性的方法，其包括关于数字权限管理（DRM）服务提供商的代理代理和支持预定DRM的设备，第一DRM服务提供商，第二DRM服务提供商，代理代理和设备彼此识别 ，并且代理重新加密可互操作的内容（IC）并将IC提供给设备。 IC通过使用第一DRM服务提供商的密钥进行二级加密，并且通过使用从第一DRM服务提供商和第二DRM服务提供商提供的代理密钥信息生成的代理密钥来执行代理重新加密。 因此，解决了DRM技术取决于服务提供商的互操作性不能保证的问题。

公开(公告)号：US07061120B2

公开(公告)日：2006-06-13

申请号：US10803333

申请日：2004-03-17

Applicant: WonSun Shin ,  DoSung Chun ,  SangHo Lee ,  SeonGoo Lee ,  Vincent DiCaprio

Inventor： WonSun Shin ,  DoSung Chun ,  SangHo Lee ,  SeonGoo Lee ,  Vincent DiCaprio

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/02 ,  H01L23/29

CPC classification number: H01L21/568 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L2223/54473 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/81005 ,  H01L2224/85001 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00012

Abstract: A stackable semiconductor package includes a substrate having a first surface, an opposite second surface, and through hole. Circuit patterns on the first and second surfaces of the substrate include lands, and the circuit patterns of the second surface also include bond fingers. A semiconductor chip is in the throughhole. The semiconductor chip has bond pads, which are oriented in a same direction as the second surface of the substrate. Wires electrically connect the bond pads to the bond fingers. An encapsulant fills the through hole and covers the semiconductor chip, the wires and the bond fingers, without covering the lands. Conductive balls are fused to the lands of the first surface of the substrate. A second semiconductor package may be stacked on the second surface of the substrate, and conductive balls of the second semiconductor package may be fused to the lands of the second surface.

Abstract translation: 可堆叠半导体封装包括具有第一表面，相对的第二表面和通孔的基板。 衬底的第一和第二表面上的电路图案包括焊盘，并且第二表面的电路图案也包括粘结指状物。 半导体芯片在通孔中。 半导体芯片具有接合焊盘，其接合方向与基板的第二表面相同。 电线将接合焊盘电连接到接合指状物。 密封剂填充通孔并覆盖半导体芯片，导线和粘合指状物，而不覆盖焊盘。 导电球熔合到衬底的第一表面的焊盘上。 第二半导体封装可以堆叠在衬底的第二表面上，并且第二半导体封装的导电球可以熔合到第二表面的焊盘。

公开(公告)号：US06991888B2

公开(公告)日：2006-01-31

申请号：US10439472

申请日：2003-05-16

Applicant: Munirathna Padmanaban ,  Takanori Kudo ,  Sangho Lee ,  Ralph R. Dammel ,  M. Dalil Rahman

Inventor： Munirathna Padmanaban ,  Takanori Kudo ,  Sangho Lee ,  Ralph R. Dammel ,  M. Dalil Rahman

IPC: G03F7/004 ,  C08F2/46 ,  C07C53/00 ,  G03C5/00

CPC classification number: G03F7/0392 ,  G03F7/0045 ,  Y10S430/115

Abstract: The present invention relates to a novel photoresist composition that can be developed with an aqueous alkaline solution, and is capable of being imaged at exposure wavelengths in the deep ultraviolet. The invention also relates to a process for imaging the novel photoresist as well as novel photoacid generators.The novel photoresist comprises a) a polymer containing an acid labile group, and b) a novel mixture of photoactive compounds, where the mixture comprises a lower absorbing compound selected from structure 1 and 2, and a higher absorbing compound selected from structure 4 and 5, where, R1 and R2 R5, R6, R7, R8, and R9 are defined herein; m=1–5; X− is an anion, and Ar is selected from naphthyl, anthracyl, and structure 3, where R30, R31, R32, R33, and R34 are defined herein.

Abstract translation: 本发明涉及一种可用碱性水溶液显影的新型光刻胶组合物，能够在深紫外线的曝光波长下成像。 本发明还涉及用于对新型光致抗蚀剂以及新型光酸产生剂进行成像的方法。 新型光致抗蚀剂包含a）含有酸不稳定基团的聚合物，和b）光活性化合物的新混合物，其中该混合物包含选自结构1和2的较低吸收化合物和选自结构4和5的较高吸收化合物 ，其中R 1和R 2 R 5，R 6，R 7，或N R 8，R 9和R 9在本文中定义; m = 1-5; X - 是阴离子，Ar选自萘基，蒽基和结构3，其中R 30，R 31，R SUB > 32，R 33和R 34在本文中定义。

公开(公告)号：US20050271974A1

公开(公告)日：2005-12-08

申请号：US10863042

申请日：2004-06-08

Applicant: M. Rahman ,  Woo-Kyu Kim ,  Munirathna Padmanaban ,  Sangho Lee

Inventor： M. Rahman ,  Woo-Kyu Kim ,  Munirathna Padmanaban ,  Sangho Lee

IPC: C07C381/12 ,  G03C1/492 ,  G03F7/00 ,  G03F7/004

CPC classification number: G03F7/0045 ,  C07C381/12 ,  G03F7/0046

Abstract: The present invention relates to novel photoacid generators.

Abstract translation: 本发明涉及新型光致酸发生剂。

公开(公告)号：US06830955B2

公开(公告)日：2004-12-14

申请号：US10162953

申请日：2002-06-04

Applicant: WonSun Shin ,  DoSung Chun ,  SeonGoo Lee ,  SangHo Lee ,  Vincent DiCaprio

Inventor： WonSun Shin ,  DoSung Chun ,  SeonGoo Lee ,  SangHo Lee ,  Vincent DiCaprio

IPC: H01L2148

CPC classification number: H01L21/568 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L2223/54473 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor package and method for manufacturing the same is disclosed. The semiconductor package comprises a semiconductor chip, a circuit board, an electrical connection means, an encapsulation material and a plurality of conductive balls. The semiconductor chip has a first surface and a second surface. A plurality of input and output pads are formed on one of the first and second surfaces. The circuit board comprises a thin film having a first surface and a second surface and being provided with a center hole in which the semiconductor chip is positioned, a plurality of circuit patterns being formed on the first surface of the thin film and including a plurality of bond fingers and ball lands, and a cover coat covering the circuit board except for the bond fingers and the ball lands. The electric connection means electrically connects the input and output pads of the semiconductor chip with the bond fingers of the circuit board. The encapsulation material covers the semiconductor, the electric connection means and a portion of the circuit board. The conductive balls are fusion-welded on the ball lands of the circuit board.

Abstract translation: 公开了一种半导体封装及其制造方法。 半导体封装包括半导体芯片，电路板，电连接装置，封装材料和多个导电球。 半导体芯片具有第一表面和第二表面。 在第一和第二表面之一上形成多个输入和输出焊盘。 电路板包括具有第一表面和第二表面的薄膜，并且设置有半导体芯片所在的中心孔，多个电路图形形成在薄膜的第一表面上，并且包括多个 粘结指状物和球形土地，以及覆盖电路板的覆盖层，除了粘结指状物和球状物之外。 电连接装置将半导体芯片的输入和输出焊盘与电路板的接合指电连接。 封装材料覆盖半导体，电连接装置和电路板的一部分。 导电球熔接在电路板的焊盘上。

公开(公告)号：US06501184B1

公开(公告)日：2002-12-31

申请号：US09574006

申请日：2000-05-19

Applicant: WonSun Shin ,  DoSung Chun ,  SeonGoo Lee ,  SangHo Lee ,  Vincent DiCaprio

Inventor： WonSun Shin ,  DoSung Chun ,  SeonGoo Lee ,  SangHo Lee ,  Vincent DiCaprio

IPC: H01L2348

CPC classification number: H01L21/568 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L2223/54473 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor package and method for manufacturing the same is disclosed. The semiconductor package comprises a semiconductor chip, a circuit board, an electrical connection means, an encapsulation material and a plurality of conductive balls. The semiconductor chip has a first surface and a second surface. A plurality of input and output pads are formed on one of the first and second surfaces. The circuit board comprises a thin film having a first surface and a second surface and being provided with a center hole in which the semiconductor chip is positioned, a plurality of circuit patterns being formed on the first surface of the thin film and including a plurality of bond fingers and ball lands, and a cover coat covering the circuit board except for the bond fingers and the ball lands. The electric connection means electrically connects the input and output pads of the semiconductor chip with the bond fingers of the circuit board. The encapsulation material covers the semiconductor, the electric connection means and a portion of the circuit board. The conductive balls are fusion-welded on the ball lands of the circuit board.

Abstract translation: 公开了一种半导体封装及其制造方法。 半导体封装包括半导体芯片，电路板，电连接装置，封装材料和多个导电球。 半导体芯片具有第一表面和第二表面。 在第一和第二表面之一上形成多个输入和输出焊盘。 电路板包括具有第一表面和第二表面的薄膜，并且设置有半导体芯片所在的中心孔，多个电路图案形成在薄膜的第一表面上，并且包括多个 粘结指状物和球形土地，以及覆盖电路板的覆盖层，除了粘结指状物和球状物之外。 电连接装置将半导体芯片的输入和输出焊盘与电路板的接合指电连接。 封装材料覆盖半导体，电连接装置和电路板的一部分。 导电球熔接在电路板的焊盘上。