公开(公告)号：US07786573B2

公开(公告)日：2010-08-31

申请号：US11481012

申请日：2006-07-06

申请人： Min-seog Choi ,  Kae-dong Back ,  In-sang Song ,  Woon-bae Kim ,  Byung-gil Jeong ,  Kyu-dong Jung

发明人： Min-seog Choi ,  Kae-dong Back ,  In-sang Song ,  Woon-bae Kim ,  Byung-gil Jeong ,  Kyu-dong Jung

IPC分类号： H01L23/34 ,  H01R12/16 ,  H05K1/11

CPC分类号： H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/9202 ,  H01L2225/06513 ,  H01L2225/06541 ,  H03H9/0547

摘要： A packaging chip formed with plural wafers. The packaging chip includes plural wafers stacked in order and plural interconnection electrodes directly connecting the plural wafers from an upper surface of an uppermost wafer of the plural wafers to the other wafers. At least one or more of the plural wafers mounts a predetermined circuit device thereon. Further, at least one or more wafers of the plural wafers have a cavity of a predetermined size. Meanwhile, the packaging chip further includes plural pads independently arranged on the upper surface of the uppermost wafer one another and electrically connected to the plural interconnection electrodes respectively. Accordingly, the present invention can enhance the performance and reliability of a packaging chip and improve fabrication yield.

摘要翻译： 形成有多个晶片的封装芯片。 封装芯片包括依次堆叠的多个晶片和从多个晶片的最上面的晶片的上表面直接连接多个晶片到另一个晶片的多个互连电极。 多个晶片中的至少一个或多个在其上安装预定的电路装置。 此外，多个晶片的至少一个或多个晶片具有预定尺寸的空腔。 同时，封装芯片还包括独立地布置在最上面的晶片的上表面上并分别电连接到多个互连电极的多个焊盘。 因此，本发明可以提高封装芯片的性能和可靠性，并提高制造成品率。

公开(公告)号：US07696104B2

公开(公告)日：2010-04-13

申请号：US11437651

申请日：2006-05-22

申请人： Seung Wan Lee ,  Min Seog Choi ,  Hwa Sun Lee ,  Won Kyoung Choi

发明人： Seung Wan Lee ,  Min Seog Choi ,  Hwa Sun Lee ,  Won Kyoung Choi

IPC分类号： H01L21/302

CPC分类号： G02B26/0833 ,  B81B7/0067 ,  G02B5/005 ,  G02B27/0018

摘要： A mirror package is provided which can reflect a laser to an external screen according to a video signal when the laser enters from outside, and a method of manufacturing the mirror package. The mirror is packaged with a glass to protect from external contamination, an inlet and an outlet are formed by, for example, an anisotropic etching on the glass and blocks a reflected light reflected from the glass. The mirror package is formed as a set, combined on a wafer using a wafer level package and diced to individual chips. Subsequently, a productivity is improved and a ghost image or phenomenon is removed.

摘要翻译： 提供了一种反射镜封装，其可以在激光从外部进入时根据视频信号将激光反射到外部屏幕，以及制造镜子封装的方法。 镜子用玻璃包装以防止外部污染，入口和出口通过例如玻璃上的各向异性蚀刻形成，并阻挡从玻璃反射的反射光。 反射镜封装形成为一组，使用晶片级封装在晶片上组合并切割成单个芯片。 随后，提高生产率并且去除了重影图像或现象。

公开(公告)号：US20100050412A1

公开(公告)日：2010-03-04

申请号：US12488180

申请日：2009-06-19

申请人： Eun-sung Lee ,  Min-seog Choi

发明人： Eun-sung Lee ,  Min-seog Choi

IPC分类号： B23P11/00 ,  B23P19/00

CPC分类号： B23P19/10 ,  G02B7/003 ,  G02B7/02 ,  G02B13/18 ,  Y10T29/49826 ,  Y10T29/53

摘要： A part to be centered during an assembly process includes an effective portion which performs a function and is shaped for insertion into a hole, a reference portion extended from the effective portion and formed substantially perpendicular to a center axis of the effective portion, and an aligning portion extended from the effective portion and formed around the effective portion. When the effective portion of the part is inserted into the hole, a center of the effective portion is automatically aligned with a centerline of the hole.

摘要翻译： 在组装过程中要中心的部件包括执行功能并成形为用于插入孔的有效部分，从有效部分延伸并且基本上垂直于有效部分的中心轴线形成的参考部分，以及对准 部分从有效部分延伸并围绕有效部分形成。 当部件的有效部分插入孔中时，有效部分的中心自动与孔的中心线对准。

公开(公告)号：US07616356B2

公开(公告)日：2009-11-10

申请号：US11369728

申请日：2006-03-08

申请人： Kyu Dong Jung ,  Min Seog Choi ,  Seung Wan Lee ,  Woon Bae Kim

发明人： Kyu Dong Jung ,  Min Seog Choi ,  Seung Wan Lee ,  Woon Bae Kim

IPC分类号： H04N1/04 ,  H01L21/00 ,  H01L21/339

CPC分类号： H01L27/14683 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

摘要： An image sensor and a method of manufacturing the image sensor, wherein the image sensor can electrically connect a light receiving portion and a printed circuit board (PCB) including circuits by forming holes and filling the holes with a conductive material, without using a wire for the electrical connection between the light receiving portion and the PCB. The light receiving portion converts lights into electrical signals and the PCB electrically processes signals. That is, since a distance for a wire between a sealing structure and because a filter is unnecessary, a thickness may be reduced. Also, since a space for wire bonding is unnecessary on the outside of an image sensor, a fill factor may increase. Also, since a process that may cause contaminates is removed, average yield may increase and production cost may decrease. The manufacturing productivity may be improved.

摘要翻译： 一种图像传感器和图像传感器的制造方法，其中图像传感器可以通过形成孔并且用导电材料填充孔来电连接包含电路的光接收部分和印刷电路板（PCB），而不使用用于 光接收部分和PCB之间的电连接。 光接收部分将光转换为电信号，并且PCB电处理信号。 也就是说，由于密封结构和因为过滤器之间的电线的距离是不必要的，所以可以减小厚度。 此外，由于在图像传感器的外部不需要用于引线接合的空间，所以填充因子可能增加。 此外，由于可能导致污染物的过程被去除，所以平均产量可能增加并且生产成本可能降低。 可以提高制造生产率。

公开(公告)号：US07580195B2

公开(公告)日：2009-08-25

申请号：US11723875

申请日：2007-03-22

申请人： Seung Tae Choi ,  Seung Wan Lee ,  Woon Bae Kim ,  Min Seog Choi ,  Eun Sung Lee ,  Kyu Dong Jung

发明人： Seung Tae Choi ,  Seung Wan Lee ,  Woon Bae Kim ,  Min Seog Choi ,  Eun Sung Lee ,  Kyu Dong Jung

IPC分类号： G02B1/06

CPC分类号： G02B3/14 ,  G02B7/026

摘要： An optical lens is provided. The optical lens provides miniaturization and thin size, and reduces the cost and improves productivity by simplifying the structure and manufacturing process. The optical lens includes a light-transmitting substrate with a lens chamber and a fluidic chamber that are connected with each other. The optical lens also includes a light-transmitting elastic film which seals the lens chamber, a buffer elastic film which seals the fluidic chamber, and an actuator on the buffer elastic film which corresponds to the fluidic chamber, and varies the volume of the fluidic chamber to vary a pressure acting on the light-transmitting elastic film.

摘要翻译： 提供了一种光学透镜。 光学透镜提供小型化和薄型化，并且通过简化结构和制造工艺来降低成本并提高生产率。 光学透镜包括具有彼此连接的透镜室和流体室的透光基板。 光学透镜还包括密封透镜室的透光弹性膜，密封流体室的缓冲弹性膜和对应于流体室的缓冲弹性膜上的致动器，并且改变流体室的体积 以改变作用在透光弹性膜上的压力。

公开(公告)号：US20090115875A1

公开(公告)日：2009-05-07

申请号：US12119611

申请日：2008-05-13

申请人： Min-seog CHOI ,  Seung-wan Lee ,  Woon-bae Kim ,  Eun-sung Lee ,  Kyu-dong Jung ,  Che-heung Kim

发明人： Min-seog CHOI ,  Seung-wan Lee ,  Woon-bae Kim ,  Eun-sung Lee ,  Kyu-dong Jung ,  Che-heung Kim

IPC分类号： H04N5/335 ,  H01L31/0232

CPC分类号： H04N5/335 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/16 ,  H01L2924/15788 ,  H01L2924/3511 ,  H04N5/2253 ,  H04N5/2257 ,  H04N5/3696 ,  H01L2924/00

摘要： An image sensor module having a sensor chip closely adhered on a concave surface and a fabrication method thereof are disclosed. The image sensor module includes at least one sensor chip, at least one sensor chip-mounting structure comprising a substrate and a polymer layer formed on the substrate, the polymer layer having an concave surface formed on an upper part thereof by a polymer molding method, so that the sensor chip is bent and bonded on the concave surface, and at least one lens fixed on the at least one sensor chip-mounting structure above the sensor chip.

摘要翻译： 公开了一种具有密封在凹面上的传感器芯片的图像传感器模块及其制造方法。 图像传感器模块包括至少一个传感器芯片，至少一个传感器芯片安装结构，包括基板和形成在基板上的聚合物层，所述聚合物层通过聚合物模塑法在其上部形成有凹形表面， 使得传感器芯片弯曲并接合在凹面上，以及固定在传感器芯片上方的至少一个传感器芯片安装结构上的至少一个透镜。

公开(公告)号：US20080112059A1

公开(公告)日：2008-05-15

申请号：US11723875

申请日：2007-03-22

申请人： Seung Tae Choi ,  Seung Wan Lee ,  Woon Bae Kim ,  Min Seog Choi ,  Eun Sung Lee ,  Kyu Dong Jung

发明人： Seung Tae Choi ,  Seung Wan Lee ,  Woon Bae Kim ,  Min Seog Choi ,  Eun Sung Lee ,  Kyu Dong Jung

IPC分类号： G02B3/14

CPC分类号： G02B3/14 ,  G02B7/026

摘要： An optical lens is provided. The optical lens provides miniaturization and thin size, and reduces the cost and improves productivity by simplifying the structure and manufacturing process. The optical lens includes a light-transmitting substrate with a lens chamber and a fluidic chamber that are connected with each other. The optical lens also includes a light-transmitting elastic film which seals the lens chamber, a buffer elastic film which seals the fluidic chamber, and an actuator on the buffer elastic film which corresponds to the fluidic chamber, and varies the volume of the fluidic chamber to vary a pressure acting on the light-transmitting elastic film.

摘要翻译： 提供了一种光学透镜。 光学透镜提供小型化和薄型化，并且通过简化结构和制造工艺来降低成本并提高生产率。 光学透镜包括具有彼此连接的透镜室和流体室的透光基板。 光学透镜还包括密封透镜室的透光弹性膜，密封流体室的缓冲弹性膜和对应于流体室的缓冲弹性膜上的致动器，并且改变流体室的体积 以改变作用在透光弹性膜上的压力。

公开(公告)号：US20080035948A1

公开(公告)日：2008-02-14

申请号：US11714156

申请日：2007-03-06

申请人： Sang Shin ,  Seog Choi ,  Young Lee ,  Yong Kim

发明人： Sang Shin ,  Seog Choi ,  Young Lee ,  Yong Kim

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/26175 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83805 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/157 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A light emitting diode package for preventing an electric short circuit among semiconductor layers and with excellent bonding strength. The light emitting diode package includes a package substrate, a light emitting diode chip bonded to an upper surface of the package substrate, and a bonding material for bonding the light emitting diode chip to the package substrate. The package substrate has a recess formed in a bonding surface thereof to accommodate the bonding material.

摘要翻译： 一种用于防止半导体层之间的电短路并且具有优异的接合强度的发光二极管封装。 发光二极管封装包括封装衬底，结合到封装衬底的上表面的发光二极管芯片，以及用于将发光二极管芯片接合到封装衬底的接合材料。 封装基板具有形成在其接合表面中的凹部以容纳接合材料。

公开(公告)号：US20070216028A1

公开(公告)日：2007-09-20

申请号：US11523530

申请日：2006-09-20

申请人： Seung Wan Lee ,  Min Seog Choi ,  Kyu Dong Jung ,  Woon Bae Kim

发明人： Seung Wan Lee ,  Min Seog Choi ,  Kyu Dong Jung ,  Woon Bae Kim

IPC分类号： H01L23/48

CPC分类号： H01L27/14618 ,  H01L23/10 ,  H01L24/16 ,  H01L24/94 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/051 ,  H01L2224/0557 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/13025 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2924/16195 ,  H01L2924/00014

摘要： A micro-element package which can reduce manufacturing costs and can be advantageous for mass production due to simplifying its structure and manufacturing process, and also can facilitate miniaturization and promote thinness, and a method of manufacturing the micro-element package. The micro-element package includes: a substrate having a micro-element on its top surface and a comparatively thin surrounding portion provided around the micro-element; and a circuit board that is electrically connected to the micro-element by utilizing the surrounding portion as a medium.

摘要翻译： 微元件封装，其可以降低制造成本，并且由于简化其结构和制造工艺而可以有利于批量生产，并且还可以促进小型化和促进薄度，以及制造微元件封装的方法。 微元件封装包括：在其顶表面上具有微元件的衬底和设置在微元件周围的相对薄的环绕部分; 以及通过利用周围部分作为介质与微元件电连接的电路板。

公开(公告)号：US20070210399A1

公开(公告)日：2007-09-13

申请号：US11584486

申请日：2006-10-23

申请人： Seung Wan Lee ,  Woon Bae Kim ,  Kyu Dong Jung ,  Min Seog Choi

发明人： Seung Wan Lee ,  Woon Bae Kim ,  Kyu Dong Jung ,  Min Seog Choi

IPC分类号： H01L31/0203 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A method of manufacturing a micro-element package which can reduce a manufacturing cost and improve productivity by simplifying its structure and manufacturing process, and also can make contributions to miniaturization and thinness, and the micro-element package are provided. The method of the micro-element package including: providing a substrate having a micro-element on its top surface and a transparent cover having a groove on its bottom surface; attaching the transparent cover on the substrate, wherein the bottom surface of the transparent cover where the groove is formed faces the micro-element; exposing the groove by selectively eliminating the transparent cover; and dicing the substrate along the exposed groove.

摘要翻译： 通过简化其结构和制造工艺，可以降低制造成本和提高生产率的微元件封装的制造方法，并且还可以对微型化和薄型化做出贡献，并且提供微元件封装。 微元件封装的方法包括：在其顶表面上提供具有微元件的衬底和在其底表面上具有凹槽的透明盖; 将透明盖安装在基板上，其中形成凹槽的透明盖的底表面面向微元件; 通过选择性地去除透明盖露出凹槽; 并且沿着暴露的凹槽切割衬底。