Abstract:
The present invention provides an inspection apparatus having a high throughput and high sensitivity with respect to a number of various manufacturing processes and defects of interest in inspection of a specimen such as a semiconductor wafer on which a pattern is formed. The apparatus illuminates with light the specimen having the pattern formed thereon, forms an image of the specimen on an image sensor through a reflective optics, and determines the existence/nonexistence of a defect. The reflective optics has a conjugate pair of Fourier transform optics. An aberration of the reflective optics is corrected off-axis. The reflective optics has a field of view in non-straight-line slit form on the specimen surface. Also, the optics is of a reflection type, includes a conjugate pair of Fourier transform optics and has a field of view in non-straight-line slit form. An optimum wavelength band is selected according to the specimen (FIG. 1).
Abstract:
An appearance inspection apparatus analyzes a difference in detection characteristics of detection signals obtained by detectors to flexibly meet various inspection purposes without changing a circuit or software. The apparatus includes a signal synthesizing section that synthesizes detection signals from the detectors in accordance with a set condition. An input operating section sets a synthesizing condition of the detection signal by the signal synthesizing section, and an information display section displays a synthesizing map structured based on a synthesized signal which is synthesized by the signal synthesizing section in accordance with a condition set by the input operating section.
Abstract:
In the conventional methods for enhancing defect detection sensitivity by improving the resolving power, if a microscopic pattern, which is a high spatial-frequency structure as is the case with a microscopic defect, has become the brightest portion, the gray-scale contrast of the microscopic defect will be enhanced. At the same time, however, the gray-scale contrast of the microscopic pattern will also be enhanced simultaneously. Consequently, there has existed a problem that it is impossible to enhance the microscopic-defect detection sensitivity further than that. In the present invention, an aperture stop which is divided into a plurality of small apertures is located on an illumination pupil plane. Then, light-shield/light-transmission for each small aperture is controlled independently of each other. This control allows an inspection-target object to be illuminated at only an incident angle at which the gray-scale contrast of the microscopic defect will be emphasized more sharply.
Abstract:
The pattern defect inspection apparatus is operable to detect defects by comparing a detection image, which is obtained through scanning by an image sensor those patterns that have the identical shape and are continuously disposed on the object under tested at equal intervals in row and column directions, with a reference image obtained by scanning neighboring identical shape patterns in the row and column directions. This apparatus has a unit for generating an average reference image by statistical computation processing from the images of identical shape patterns lying next to the detection image including at least eight nearest chips on the up-and-down and right-and-left sides and at diagonal positions with the detection image being intermediately situated. The apparatus also includes a unit that detects a defect by comparing the detection image to the average reference image thus generated.
Abstract:
A method and equipment which includes an illustrated-spot illumination-distribution data table for storing an illumination distribution within an illustrated spot and which calculates a coordinate position for a particle or a defect and the diameter of the particle on the basis of detection light intensity data about the particle or defect and the illustrated-spot illumination-distribution data table. Thus, even when the illumination distribution within the illustrated spot based on an actual illumination optical system is not a Gaussian distribution, the calculation of the particle diameter of the detected particle or defect and the calculation of a coordinate position on the surface of an object to be inspected can be attained with an increased accuracy.
Abstract:
The pattern defect inspection apparatus is operable to detect defects by comparing a detection image, which is obtained through scanning by an image sensor those patterns that have the identical shape and are continuously disposed on the object under tested at equal intervals in row and column directions, with a reference image obtained by scanning neighboring identical shape patterns in the row and column directions. This apparatus has a unit for generating an average reference image by statistical computation processing from the images of identical shape patterns lying next to the detection image including at least eight nearest chips on the up-and-down and right-and-left sides and at diagonal positions with the detection image being intermediately situated. The apparatus also includes a unit that detects a defect by comparing the detection image to the average reference image thus generated.
Abstract:
An inspection device of an object, comprising: a laser beam source for oscillating a laser beam and irradiating the laser beam onto a surface of an object to be inspected, a rotary table for loading and rotating the object, a moving mechanism for moving the rotary table in a transfer direction of the object, a plurality of light receptors disposed above the object for receiving a scattering light scattered from the surface of the object when the laser beam irradiated from the laser beam source onto the surface of the object loaded on the rotary table, and a data processor for performing operations on the basis of received signals of the scattering light received by the plurality of light receptors and discriminating a boundary position between a flat plane area of the surface of the object which is irradiated with the laser beam and a predetermined area corresponding to an edge portion outside the plane area.
Abstract:
Provided are a surface inspection method and a surface inspection apparatus that are capable of detecting scattered light from a contaminant particle and a defect at a good S/N even when the relative ratio of background scattered light to the total quantity of scattered light and the anisotropy of background scattered light in angular directions are not relatively large in a case where background scattered light deriving from the surface roughness of a semiconductor wafer has directivity in a direction of an elevation angle or an azimuthal angle and in a case where the directivity of background scattered light changes depending on positions on a wafer to be inspected. In surface inspection according to the present invention, by use of a plurality of photodetectors arranged in a plurality of directions, light scattered, diffracted or reflected on a surface of an object to be inspected or in the vicinity of the surface is detected and a plurality of signals obtained by this are subjected to weighted addition processing or weighted averaging processing by linear combination, whereby a contaminant particle and a defect on a surface of an object to be inspected and the like are detected. The size of a contaminant particle and a defect is calculated from results of the weighted addition processing or weighted averaging processing.
Abstract:
An optical inspection apparatus irradiates a light beam onto the outer surface of an object to be inspected, in the form of an illumination spot having an illumination intensity which is higher in the outer peripheral part of the object to be inspected than in the inner peripheral part thereof while uniformly maintains a temperature rise caused by the irradiation of the light beam, over the outer surface of the object to be inspected, in order to prevent the effective entire signal value of a scattered light signal from lowering, without lowering the linear speed of a movable stage for the object to be inspected in the outer peripheral part of the object to be inspected, thereby it is possible to prevent lowering of the detectability for a foreign matter or a defect, for preventing lowering of inspection throughput.
Abstract:
A device according to the present invention includes an interferometer which produces interference fringes from light received from a light source. The interference fringes are imaged onto a photo-diode array which transforms the imaged interference fringes into a single set of electric signals. The single set of electric signals is digitized and stored as a group of consecutive data points which represent an interferogram signal containing a DC component. The data points are processed to obtain moving average values representing the DC component of the interferogram signal. The moving average values are subtracted from the data points to obtain a clean interferogram signal which is Fourier-transformed to obtain a spectrogram of the light source.