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31.发明授权公开(公告)号：US08899200B2
公开(公告)日：2014-12-02
申请号：US13265125
申请日：2010-04-27
Applicant: Takayuki Aoki , Takeshi Sassa
Inventor： Takayuki Aoki , Takeshi Sassa
CPC classification number: F01L1/462 , F01L3/10 , F01L2101/00 , F16F1/126
Abstract: Oxide film formed on a spring-retaining flange by heat treatment gets unlikely to peel off, thereby improving wear resistance of a contact surface of the spring-retaining flange with a valve spring. The oxide film 15 of the part of the spring-retaining flange 3 with the valve spring 7 is at least partially removed to make thickness of the oxide film to 0.00 to 0.02 μm.
Abstract translation: 通过热处理在弹簧保持法兰上形成的氧化膜不可能剥离，从而改善弹簧保持凸缘与阀弹簧的接触表面的耐磨性。 至少部分去除弹簧保持凸缘3的与气门弹簧7的部分的氧化膜15，使氧化膜的厚度为0.00〜0.02μm。
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32.发明申请公开(公告)号：US20140021707A1
公开(公告)日：2014-01-23
申请号：US14004943
申请日：2011-03-28
Applicant: Takayuki Aoki
Inventor： Takayuki Aoki
IPC: B60R21/205
CPC classification number: B60R21/205 , B62D21/15 , B62D25/145
Abstract: Vehicle instrument panel reinforcement and a passenger seat airbag device attachment structure employing the vehicle instrument panel reinforcement are provided that are capable of securing the strength and rigidity to support for example a reaction force imparted during deployment of a passenger seat airbag device, and are also capable of achieving a reduction in both cost and weight. Instrument panel reinforcement formed with a quadrilateral shaped closed cross-section profile from an upper member and a lower member is disposed along the vehicle width direction inside a vehicle instrument panel. A circular cylinder shaped collar is disposed inside a closed cross-section portion of the upper member. A passenger seat airbag device is fastened and fixed to the instrument panel reinforcement by a bolt and weld nut, employing the collar.
Abstract translation: 提供车辆仪表板加强件和使用车辆仪表板加强件的乘客座椅安全气囊装置安装结构，其能够确保强度和刚性以支撑例如乘客座椅安全气囊装置展开期间施加的反作用力，并且还能够 实现成本和重量的降低。 沿着车辆宽度方向在车辆仪表板内配置从上部构件和下部构件形成有四边形封闭截面轮廓的仪表板加强件。 圆柱形套环设置在上部构件的封闭横截面部分的内部。 乘客座椅安全气囊装置通过使用轴环的螺栓和焊接螺母紧固固定在仪表板加强件上。
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公开(公告)号：US20140001792A1
公开(公告)日：2014-01-02
申请号：US14004807
申请日：2011-03-22
Applicant: Takayuki Aoki , Masayuki Azuma
Inventor： Takayuki Aoki , Masayuki Azuma
IPC: B62D25/14
CPC classification number: B62D25/145 , B62D21/15 , B62D21/152 , B62D25/088 , B62D25/14 , B62D25/163 , B62D25/2018
Abstract: A vehicle instrument panel reinforcement capable of raising ease of vehicle installation is provided. The instrument panel reinforcement is formed with a cross-section profile of square shaped closed cross-section profile from an upper member and a lower member, is disposed along a vehicle width direction at the inside of a vehicle instrument panel. Plural first protruding portions are formed to one end portion of the upper member, and plural first projection portions are formed to another end portion thereof. Similarly, plural second protruding portions are formed to one end portion of the lower member and plural second projection portions are formed to another end portion thereof. The first protruding portions and the second projection portions, and the first projection portions and the second protruding portions, are projection welded together at plural points simultaneously.
Abstract translation: 提供了能够提高车辆安装容易性的车载仪表板加强件。 仪表板加强件形成有从上部构件和下部构件的具有方形的截面轮廓的横截面轮廓，沿车辆宽度方向设置在车辆仪表板的内部。 多个第一突出部形成在上部构件的一个端部，并且多个第一突出部形成在其另一端部。 类似地，在下部构件的一个端部形成有多个第二突出部分，并且多个第二突出部分形成在另一个端部。 第一突出部分和第二突出部分以及第一突出部分和第二突出部分在多个点同时投影焊接在一起。
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34.发明授权公开(公告)号：US08324286B2
公开(公告)日：2012-12-04
申请号：US12089600
申请日：2006-11-16
Applicant: Toshiaki Masuda , Ichiro Takahara , Kenichi Kitano , Katsushi Miki , Takeshi Inohara , Takeyoshi Fukuda , Takayuki Aoki , Satoshi Kawanami
Inventor： Toshiaki Masuda , Ichiro Takahara , Kenichi Kitano , Katsushi Miki , Takeshi Inohara , Takeyoshi Fukuda , Takayuki Aoki , Satoshi Kawanami
CPC classification number: B01J13/14 , C08F220/14 , C08F220/44 , C08F220/48 , C08F222/1006 , Y10T428/2984
Abstract: Heat-expandable microspheres include a shell of thermoplastic resin and a blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin, have a maximum expanding ratio not lower than 50 times, and are thermally expanded into hollow particulates having a repeated-compression durability not lower than 75 percent. The method of producing the heat-expandable microspheres includes the steps of dispersing an oily mixture containing a polymerizable component and the blowing agent in an aqueous dispersing medium containing a specific water-soluble compound and polymerizing the polymerizable component contained in the oily mixture.
Abstract translation: 热膨胀性微球包括热塑性树脂的壳和其中包含沸点不高于热塑性树脂的软化点的发泡剂，其最大膨胀比不低于50倍，并且被热膨胀成具有 重复压缩耐久性不低于75％。 制造热膨胀性微球的方法包括以下步骤：将含有可聚合组分和发泡剂的油性混合物分散在含有特定水溶性化合物的水性分散介质中，并使包含在油性混合物中的可聚合组分聚合。
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35.发明申请公开(公告)号：US20120132841A1
公开(公告)日：2012-05-31
申请号：US13265125
申请日：2010-04-27
Applicant: Takayuki Aoki , Takeshi Sassa
Inventor： Takayuki Aoki , Takeshi Sassa
CPC classification number: F01L1/462 , F01L3/10 , F01L2101/00 , F16F1/126
Abstract: Oxide film formed on a spring-retaining flange by heat treatment gets unlikely to peel off, thereby improving wear resistance of a contact surface of the spring-retaining flange with a valve spring. The oxide film 15 of the part of the spring-retaining flange 3 with the valve spring 7 is at least partially removed to make thickness of the oxide film to 0.00 to 0.02 μm.
Abstract translation: 通过热处理在弹簧保持法兰上形成的氧化膜不可能剥离，从而改善弹簧保持凸缘与阀弹簧的接触表面的耐磨性。 至少部分去除弹簧保持凸缘3的与气门弹簧7的部分的氧化膜15，使氧化膜的厚度为0.00〜0.02μm。
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Patent Agency Ranking
公开(公告)号：US20090176098A1
公开(公告)日：2009-07-09
申请号：US12067771
申请日：2006-10-04
Applicant: Toshiaki Masuda , Kenichi Kitano , Katsushi Miki , Takeshi Inohara , Takayuki Aoki
Inventor： Toshiaki Masuda , Kenichi Kitano , Katsushi Miki , Takeshi Inohara , Takayuki Aoki
CPC classification number: B01J13/14 , Y10T428/2982 , Y10T428/2984 , Y10T428/2985 , Y10T428/2987 , Y10T428/2998
Abstract: A method that heat-expandable microspheres includes the use of a shell of thermoplastic resin and a non-fluorine blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin. The method includes a step of dispersing an oily mixture containing a polymerizable component, the blowing agent, and a polymerization initiator containing a peroxydicarbonate in an aqueous dispersing medium to polymerize the polymerizable component contained in the oily mixture. The resultant heat-expandable microspheres have a shell which is less apt to become thinner than its theoretical value, contain minimum amount of resin particle inside their shell, and have excellent heat-expanding performance.
Abstract translation: 热膨胀性微球的方法包括使用热塑性树脂的壳和封入其中的沸点不高于热塑性树脂的软化点的非氟发泡剂。 该方法包括将含有可聚合组分的油性混合物，发泡剂和含有过氧化二碳酸酯的聚合引发剂分散在水性分散介质中以使包含在油性混合物中的可聚合组分聚合的步骤。 所得到的热膨胀性微球体的外壳不易于其理论值变薄，在其壳内含有最少量的树脂颗粒，并且具有优异的热膨胀性能。
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公开(公告)号：US20070029682A1
公开(公告)日：2007-02-08
申请号：US11498179
申请日：2006-08-03
Applicant: Takayuki Aoki , Toshio Shiobara
Inventor： Takayuki Aoki , Toshio Shiobara
IPC: H01L23/29
CPC classification number: H01L23/293 , C08G59/621 , C08K5/54 , H01L2924/0002 , H01L2924/00
Abstract: An epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, (D) a cure accelerator, (E) an adhesion promoter, and (F) a metal oxide. The metal oxide (F) is a combination of a magnesium/aluminum ion exchanger, a hydrotalcite ion exchanger, and a rare earth oxide in a ratio of 0.5-20:0.5-20:0.01-10 pbw, relative to 100 pbw of epoxy resin (A) and curing agent (B) combined.
Abstract translation: 提供一种环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）无机填料，（D）固化促进剂，（E）粘合促进剂和（F）金属 氧化物。 金属氧化物（F）是镁/铝离子交换剂，水滑石离子交换剂和稀土氧化物的组合，相对于100pbw的环氧树脂，其比例为0.5-20:0.5-20:0.01-10pbw 树脂（A）和固化剂（B）组合。
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公开(公告)号：USD528573S1
公开(公告)日：2006-09-19
申请号：US29238142
申请日：2005-09-13
Applicant: Takayuki Aoki , Takeo Imanaka , Hitoshi Mizuno
Designer： Takayuki Aoki , Takeo Imanaka , Hitoshi Mizuno
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公开(公告)号：US07095125B2
公开(公告)日：2006-08-22
申请号：US10617827
申请日：2003-07-14
Applicant: Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
Inventor： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
IPC: H01L23/29
CPC classification number: H01L23/293 , C08L63/00 , H01L2924/0002 , Y10T428/12528 , Y10T428/31511 , C08L83/00 , H01L2924/00
Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
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40.发明授权公开(公告)号：US06894091B2
公开(公告)日：2005-05-17
申请号：US09883276
申请日：2001-06-19
Applicant: Shoichi Osada , Toshio Shiobara , Eiichi Asano , Kazutoshi Tomiyoshi , Takayuki Aoki , Shigeki Ino
Inventor： Shoichi Osada , Toshio Shiobara , Eiichi Asano , Kazutoshi Tomiyoshi , Takayuki Aoki , Shigeki Ino
CPC classification number: H01L23/293 , C08L63/00 , H01L2924/0002 , C08L61/04 , H01L2924/00
Abstract: A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler contains nitrogen atoms in an amount of 1.5-20% by weight based on the weight of components (A) and (B) combined. Cured parts of the composition exhibit high-temperature capabilities and flame retardance despite the absence of halogenated epoxy resins and antimony trioxide.
Abstract translation: 一种半导体封装环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）钼化合物和（D）每100重量份组分（A）300-900重量份， 和（B）组合的无机填料含有以组分（A）和（B）的重量计为1.5-20重量％的氮原子。 尽管没有卤化环氧树脂和三氧化锑，组合物的固化部分表现出高温能力和阻燃性。
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