摘要:
A vehicle instrument panel reinforcement capable of raising ease of vehicle installation is provided. The instrument panel reinforcement is formed with a cross-section profile of square shaped closed cross-section profile from an upper member and a lower member, is disposed along a vehicle width direction at the inside of a vehicle instrument panel. Plural first protruding portions are formed to one end portion of the upper member, and plural first projection portions are formed to another end portion thereof. Similarly, plural second protruding portions are formed to one end portion of the lower member and plural second projection portions are formed to another end portion thereof. The first protruding portions and the second projection portions, and the first projection portions and the second protruding portions, are projection welded together at plural points simultaneously.
摘要:
A vehicle instrument panel reinforcement capable of raising ease of vehicle installation is provided. The instrument panel reinforcement is formed with a cross-section profile of square shaped closed cross-section profile from an upper member and a lower member, is disposed along a vehicle width direction at the inside of a vehicle instrument panel. Plural first protruding portions are formed to one end portion of the upper member, and plural first projection portions are formed to another end portion thereof. Similarly, plural second protruding portions are formed to one end portion of the lower member and plural second projection portions are formed to another end portion thereof. The first protruding portions and the second projection portions, and the first projection portions and the second protruding portions, are projection welded together at plural points simultaneously.
摘要:
When a second detector determines that a character image has a halftone (YES in #1) and a third detector (48) determines that a font size of the character image is equal to or greater than a threshold value β and equal to or smaller than a threshold value α (YES in step #4), a fourth detector determines whether a presently focused pixel constitutes a particular portion of a character (step #5). When the fourth detector determines that the pixel data of the presently focused pixel constitutes the particular portion of the character (YES in step #5), the image processing section sets the pixel data to be subjected to a second screen processing which is performed at a higher gradation level (step #6).
摘要:
An angle detecting head provided with an emitter and a pair of receivers is rocked, and a bent surface of a workpiece bent by a punch and a die of a bending machine is irradiated with a measurement light from the emitter, a reflected light is received by the pair of receivers, and a bending angle of the workpiece is obtained from a peak value of the light received by the respective receivers. The angle detecting head is movable parallel to the die, is movable in a direction close to and away from the workpiece, and is movable in a direction in which the die is raised/lowered. The angle detecting head is positioned in an optimum angle measurement position of the workpiece and the bending angle is measured. Moreover, the bending machine presses the workpiece to the vicinity of a target angle, measures the bending angle of the workpiece during final pressing, removes pressure to bring the workpiece to an unloaded state, measures the bending angle of the workpiece, and obtains and stores a difference between the final pressing angle measured value and the unloaded angle measured value as a spring-back amount.
摘要:
An epoxy resin composition comprising (A) a biphenyl skeleton epoxy resin, (B) a biphenyl skeleton phenolic resin as a curing agent, (C) molybdenum compound, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.
摘要:
A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a microencapsulated flame retardant comprising a red phosphorus-base core coated with a thermoplastic resin and/or thermosetting resin, (D) a molybdenum compound, and (E) an inorganic filler. The composition and its cured product have moisture-proof reliability and high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
摘要:
An epoxy resin composition contains (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a skeleton having a structure in which two benzene rings are conjugable to each other directly or via an aliphatic unsaturated double bond, carbon atoms having an atomic orbital of SP.sup.2 type accounting for at least 50% of the carbon number, (B) a phenolic resin having a hydroxyl equivalent of at least 160, carbon atoms having an atomic orbital of Sp.sup.2 type accounting for at least 85% of the carbon number, (C) a polyimide resin in an amount of 1-20 parts by weight per 100 parts by weight of components (A) and (B) combined, and (D) 70-85% by volume of the entire composition of an inorganic filler. The composition cures into products having flame retardancy and high-temperature reliability even though it is free of bromine compounds and antimony compounds.
摘要:
An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a biphenyl-containing epoxy resin, (C) a specific phenolic resin, and (D) an inorganic filler shows good flow and cures to products having low modulus of elasticity, especially at temperatures above Tg, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.
摘要:
An epoxy resin having a propenyl group conjugated with an aromatic ring is heat resistant and is easily molded and cured into products having high strength and Tg. It is thus useful as a resin component or modifier.