Abstract:
SU-8 photoresist compositions are modified to improve their adhesion properties by adding 1% to 6% of an adhesion promoter selected from the group consisting of glycidoxypropanetrimethoxysilane, mercaptopropyltrimethoxysilane, and aminopropyltrimethoxysilane. SU-8 photoresist compositions are modified to improve their resistance to cracking and film stress by adding 0.5% to 3% of a plasticizer selected from the group consisting of dialkylphthalates, dialkylmalonates, dialkylsebacates, dialkyladipates, and diglycidyl hexahydrophthalates. The improvements can be obtained simultaneously by adding both the adhesion promoter and the plasticizer to SU-8 photoresist compositions.
Abstract:
A solder flux composition (19) is provided which comprises active ingredients and a carrier. The solder flux composition undergoes a phase separation during solder reflow to form at least a first phase (21) and a second phase (23), such that the active ingredients are disposed primarily in the first phase and the carrier is disposed primarily in the second phase. The use of this solder flux composition is found to reduce solder migration, during solder reflow, that can result in bridging in ball grid arrays and other such devices.
Abstract:
A conductive paste composition is described which comprises an alloy of tin and a flux composition. The flux composition comprises an aromatic carboxylic acid fluxing agent and a polymeric solvent.
Abstract:
An optical semiconductor component includes a semiconductor substrate (120) and a packaging material (140) located over the semiconductor substrate. The packaging material includes an optically transparent cycloaliphatic polymer (142, 242, 400, 600). A method of manufacturing the component includes nixing a monomer (300, 500) of the polymer with a catalyst to form the packaging material, filtering the packaging material, applying the packaging material, and curing the packaging material.
Abstract:
The solubility of tetramethylammonium hydroxide pentahydrate in dimethyl sulfoxide is significantly increased by adding to the solution a quantity of dipropyleneglycol monomethylether. This permits up to twelve percent of the tetramethylammonium hydroxide pentahydrate to be dissolved in dimethyl sulfoxide, rather than the maximum of two percent that would otherwise be the case, which enhances the capacity of the solution to strip photoresist. Particularly, if the concentration of dipropyleneglycol monomethylether is in the range of ten to thirty percent, one can obtain both a high stripping rate and a much higher stripping capacity. For example, stripping capacity may be increased from one hundred forty substrates per gallon to six hundred substrates per gallon.
Abstract:
A bath (19) for stripping a cured electrophoretic resist coating (13) consists of a mixture comprising 0.2-50% of a fluoro-containing acetic acid, less than one percent corrosion inhibitors, and 50-99.8% of an amide solvent, preferably a cyclic amide. The amide solvent is preferably N-methylpyrrolidone, and the acid is preferably trifluoroacetic acid.
Abstract:
Optically nonlinear device elements such as directional couplers, switches, frequency stabilizers, optical parameters devices and modulators use as an optically nonlinear element a cross-linked triazine polymer containing a covalently bonded optically nonlinear dye moiety. A specific cross-linked triazine with this dye moiety may be made by cyclotrimerizing a p-(N,N-bis(4'-cyanatobenzyl)amino-p'-(2,2-dicyanovinyl)azobenzene monomer. During polycyclotrimerization or cure, the element is subjected to a poling voltage which aligns the dipoles of the dye moiety to give a large useful nonlinear susceptibility.