公开(公告)号：US20190077182A1

公开(公告)日：2019-03-14

申请号：US16181294

申请日：2018-11-05

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  Robert R. Rotzoll ,  Christopher Bower ,  Mark Willner

IPC: B42D25/305 ,  B42D25/485 ,  B42D25/30 ,  G07D11/00 ,  B42D25/29

Abstract: A hybrid currency banknote includes a banknote having visible markings. One or more light-controlling elements and a controller are embedded in or on the banknote. The controller is electrically connected to the one or more light-controlling elements to control the one or more light-controlling elements. A power input connection is electrically connected to the controller, or one or more light-controlling elements, or both. A power source can be connected to the power input connection, for example a piezoelectric or photovoltaic power source. In response to applied power, the controller causes the one or more light-controlling elements to emit light. A value can be stored in a memory in the controller and displayed by the light-controlling elements. The value can be assigned or varied by a hybrid currency teller machine.

公开(公告)号：US10217308B2

公开(公告)日：2019-02-26

申请号：US15678981

申请日：2017-08-16

Applicant: X-Celeprint Limited

Inventor： Robert R. Rotzoll ,  Christopher Bower ,  Ronald S. Cok

IPC: G08B25/10 ,  B42D25/485 ,  G07D7/12 ,  H04B5/00 ,  G08B5/36 ,  G06K19/077 ,  G06K19/07

Abstract: A hybrid high-security document includes a document and one or more independent light-emitting modules disposed on or embedded in the document. Each module comprises an antenna with multiple turns, an electronic circuit, and a light emitter mounted and electrically connected on a substrate separate from the document. The electronic circuit is responsive to electrical power provided from the antenna to control the light emitter to emit light. The electronic circuit can include a memory storing information relevant to the hybrid high-security document or its use. The information can be accessed by external readers providing electromagnetic energy to the hybrid high-security document. The hybrid high-security document can be a hybrid banknote.

公开(公告)号：US10198890B2

公开(公告)日：2019-02-05

申请号：US15157838

申请日：2016-05-18

Applicant: X-Celeprint Limited

Inventor： Robert R. Rotzoll ,  Christopher Bower ,  Ronald S. Cok

IPC: G08B25/10 ,  B42D25/485 ,  G07D7/12 ,  H04B5/00 ,  G08B5/36 ,  G06K19/077 ,  G06K19/07

Abstract: A hybrid high-security document includes a document and one or more independent light-emitting modules disposed on or embedded in the document. Each module comprises an antenna with multiple turns, an electronic circuit, and a light emitter mounted and electrically connected on a substrate separate from the document. The electronic circuit is responsive to electrical power provided from the antenna to control the light emitter to emit light. The electronic circuit can include a memory storing information relevant to the hybrid high-security document or its use. The information can be accessed by external readers providing electromagnetic energy to the hybrid high-security document. The hybrid high-security document can be a hybrid banknote.

公开(公告)号：US10193025B2

公开(公告)日：2019-01-29

申请号：US15440843

申请日：2017-02-23

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Ronald S. Cok

IPC: H01L29/20 ,  H01L33/00 ,  H01L33/46 ,  H01L25/075

Abstract: An inorganic light-emitting diode (iLED) pixel structure includes a transparent pixel substrate having an LED surface, an emission surface opposite the LED surface, and one or more sides other than the LED surface and the emission surface that are not parallel to the LED surface or the emission surface. One or more iLEDs are mounted on the pixel substrate and each iLED has an emission side adjacent to the LED surface of the pixel substrate to emit light into the pixel substrate and out of the emission surface. A reflector is disposed on at least a portion of the one or more sides.

公开(公告)号：US10189243B2

公开(公告)日：2019-01-29

申请号：US15195733

申请日：2016-06-28

Applicant: X-Celeprint Limited ,  The Board of Trustees of the University of Illinois

Inventor： Etienne Menard ,  John A. Rogers ,  Seok Kim ,  Andrew Carlson

IPC: B41F16/00 ,  H01L21/683 ,  H01L23/482 ,  H01L25/00 ,  B32B37/00 ,  B32B41/00 ,  H01L21/67 ,  B32B9/00 ,  B32B37/16 ,  H01L21/70

Abstract: In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.

公开(公告)号：US10157880B2

公开(公告)日：2018-12-18

申请号：US15718636

申请日：2017-09-28

Applicant: X-Celeprint Limited

Inventor： Salvatore Bonafede ,  Matthew Meitl ,  Ronald S. Cok

IPC: H01L23/52 ,  H01L23/00 ,  H01L21/683 ,  H01L33/62 ,  H01L33/00 ,  H01L21/67

Abstract: A method of making a micro-transfer printed structure includes providing a destination substrate and a source substrate having one or more micro-transfer printable components. A layer of volatile adhesive is formed over the destination substrate and one or more components are micro-transfer printed from the source substrate onto the volatile adhesive layer at a non-evaporable temperature of the volatile adhesive layer. The volatile adhesive layer is then heated to an evaporation temperature to evaporate at least a portion of the volatile adhesive after micro-transfer printing. In certain embodiments, a micro-transfer printed structure includes a destination substrate having one or more metal contacts and one or more micro-transfer printable components having one or more component contacts disposed on the destination substrate with the metal contact aligned with the component contact. The metal contact can form an intermetallic bond with the component contact.

公开(公告)号：US10153256B2

公开(公告)日：2018-12-11

申请号：US15373865

申请日：2016-12-09

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  Christopher Bower ,  Matthew Meitl ,  Carl Prevatte, Jr.

IPC: H01L25/075 ,  H01L25/16 ,  H01L23/00 ,  H01L33/62 ,  H01L25/00 ,  H01L23/498

Abstract: A micro-transfer printable electronic component includes one or more electronic components, such as integrated circuits or LEDs. Each electronic component has device electrical contacts for providing electrical power to the electronic component and a post side. A plurality of electrical conductors includes at least one electrical conductor electrically connected to each of the device electrical contacts. One or more electrically conductive connection posts protrude beyond the post side. Each connection post is electrically connected to at least one of the electrical conductors. Additional connection posts can form electrical jumpers that electrically connect electrical conductors on a destination substrate to which the printable electronic component is micro-transfer printed. The printable electronic component can be a full-color pixel in a display.

公开(公告)号：US20180340681A1

公开(公告)日：2018-11-29

申请号：US16054830

申请日：2018-08-03

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok

IPC: F21V23/00 ,  H05B33/08 ,  G09G3/34 ,  F21V19/00 ,  G09G3/22 ,  F21Y115/10 ,  F21Y113/10

CPC classification number: F21V23/003 ,  F21V19/0025 ,  F21V23/001 ,  F21Y2113/10 ,  F21Y2115/10 ,  G09G3/22 ,  G09G3/3426 ,  G09G2360/16 ,  H05B33/0821 ,  H05B33/0845 ,  H05B33/0857

Abstract: A backlight system includes a backplane and a plurality of bare die light emitters disposed on the backplane. Each light emitter has a light-emitter substrate and contact pads on the light-emitter substrate through which electrical current is supplied to cause the light emitter to emit light. A plurality of first and second backplane conductors are disposed on the backplane for conducting control signals to control the light emitters through the contact pads. A plurality of light valves is disposed to receive light from the light emitters. The number of light valves is greater than the number of light emitters.

公开(公告)号：US10109764B2

公开(公告)日：2018-10-23

申请号：US15705785

申请日：2017-09-15

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Carl Prevatte ,  Salvatore Bonafede

IPC: H01L33/00 ,  H01L21/00 ,  H01L21/30 ,  H01L21/46 ,  H01L21/683 ,  H01L33/44 ,  H01L33/36 ,  H01L33/62

Abstract: The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.

公开(公告)号：US10074768B2

公开(公告)日：2018-09-11

申请号：US15179380

申请日：2016-06-10

Applicant: X-Celeprint Limited

Inventor： Matthew Meitl ,  Ronald S. Cok

IPC: H01L21/00 ,  H01L33/00 ,  H01L33/20 ,  H01L33/40 ,  H01L33/26 ,  H01L29/78 ,  H01L21/683 ,  H01L33/32 ,  H01L33/62 ,  H01L33/38 ,  H01L33/36 ,  H01L33/44

CPC classification number: H01L33/0079 ,  H01L21/6835 ,  H01L29/7848 ,  H01L33/007 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/26 ,  H01L33/32 ,  H01L33/36 ,  H01L33/38 ,  H01L33/40 ,  H01L33/44 ,  H01L33/62 ,  H01L2221/68318 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033

Abstract: A method of making an inorganic semiconductor structure suitable for micro-transfer printing includes providing a growth substrate and forming one or more semiconductor layers on the growth substrate. A patterned release layer is formed on the conductor layer(s) and bonded to a handle substrate. The growth substrate is removed and the semiconductor layer(s) patterned to form a semiconductor mesa. A dielectric layer is formed and then patterned to expose first and second contacts and an entry portion of the release layer. A conductor layer is formed on the dielectric layer, the first contact, and the second contact and patterned to form a first conductor in electrical contact with the first contact and a second conductor in electrical contact with the second contact but electrically separate from the first conductor. At least a portion of the release layer is removed.