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    Image sensor chip package
    31.
    发明申请
    Image sensor chip package 审中-公开
    图像传感器芯片封装

    公开(公告)号：US20070034772A1

    公开(公告)日：2007-02-15

    申请号：US11448314

    申请日：2006-06-07

    Applicant: Steven Webster ,  Ying-Cheng Wu

    Inventor： Steven Webster ,  Ying-Cheng Wu

    IPC: C12Q1/68

    CPC classification number: H04N5/2253 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/16195 ,  H01L2924/00014

    Abstract: A digital camera module includes a barrel (10), a seat (20) and an image sensor chip package (30) in accordance with a preferred embodiment is shown. The image sensor chip package includes a carrier (32), a chip (34), a number of bonding wires (36) and a cover (38). The carrier includes a base (24). The chip is mounted on the base and has an active area. The second conductive means electronically connects the chip and the conductive means. An adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover adheres to the carrier with the adhesive means and defines a sealing space (37) for sealing the active area of the chip therein. The active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.

    Abstract translation: 示出了根据优选实施例的数字照相机模块，包括镜筒（10），座（20）和图像传感器芯片封装（30）。 图像传感器芯片封装包括载体（32），芯片（34），多个接合线（36）和盖（38）。 载体包括基部（24）。 芯片安装在基座上并具有有效区域。 第二导电装置电连接芯片和导电装置。 在芯片的有效区域周围施加粘合剂。 透明盖安装在托架的底座上。 盖子用粘合剂粘合到载体上并且限定用于密封芯片的有效区域的密封空间（37）。 芯片的有效面积被充分保护，免受小体积密封空间的污染。

    Image sensor chip package
    32.
    发明申请
    Image sensor chip package 失效
    图像传感器芯片封装

    公开(公告)号：US20070023608A1

    公开(公告)日：2007-02-01

    申请号：US11448570

    申请日：2006-06-07

    Applicant: Steven Webster ,  Ying-Cheng Wu

    Inventor： Steven Webster ,  Ying-Cheng Wu

    IPC: C12Q1/68

    CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/16195 ,  H01L2924/00014

    Abstract: A chip package (200) includes a carrier (20), a chip (22), a second conductive means (26) and a transparent cover (28). The carrier (20) includes a base (24). The chip is mounted on the base and has an active area (222). The second conductive means electronically connects the chip with the conductive means. The first adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover is adhered with the first adhesive means so as to define a sealing space (32) for sealing the active area of the chip therein. It can be seen that the active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.

    Abstract translation: 芯片封装（200）包括载体（20），芯片（22），第二导电装置（26）和透明盖（28）。 载体（20）包括基座（24）。 芯片安装在基座上并具有有效区域（222）。 第二导电装置将芯片与导电装置电连接。 第一粘合装置被施加在芯片的有效区域周围。 透明盖安装在托架的底座上。 该盖用第一粘合装置粘合以便限定用于密封芯片的有效区域的密封空间（32）。 可以看出，芯片的有效面积被充分保护，免受小体积密封空间的污染。

    Miniaturization image capturing module and method of manufacturing the same
    34.
    发明授权
    Miniaturization image capturing module and method of manufacturing the same 有权
    小型化图像捕获模块及其制造方法

    公开(公告)号：US08760559B2

    公开(公告)日：2014-06-24

    申请号：US13195901

    申请日：2011-08-02

    Applicant: Ti-Lun Liu ,  Ying-Cheng Wu

    Inventor： Ti-Lun Liu ,  Ying-Cheng Wu

    IPC: H04N5/225 ,  H01L21/00

    CPC classification number: B29C65/5057 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: A miniaturization image capturing module includes a substrate unit, an image capturing unit, a fixing glue unit, and a lens unit. The substrate unit includes a hollow substrate body, a plurality of top conductive pads, a plurality of bottom conductive pads, a plurality of embedded conductive traces. The hollow substrate body has at least one receiving space, and each embedded conductive trace is electrically connected between at least one of the top conductive pads and at least one of the bottom conductive pads. The image capturing unit includes at least one image capturing chip received in the receiving space and electrically connected to the substrate unit. The fixing glue unit includes a fixing glue disposed in the receiving space and fixed between the hollow substrate body and the image capturing chip. The lens unit is disposed on the top side of the hollow substrate body.

    Abstract translation: 小型化图像拍摄模块包括基板单元，图像捕获单元，固定胶单元和透镜单元。 基板单元包括中空基板主体，多个顶部导电焊盘，多个底部导电焊盘，多个嵌入式导电迹线。 中空基板主体具有至少一个接收空间，并且每个嵌入的导电迹线电连接在至少一个顶部导电焊盘和至少一个底部导电焊盘之间。 图像拍摄单元包括容纳在接收空间中并电连接到基板单元的至少一个图像捕获芯片。 固定胶单元包括设置在容纳空间中并固定在中空基板主体和图像捕获芯片之间的固定胶。 透镜单元设置在中空基板主体的顶侧。

    MINIATURIZATION IMAGE CAPTURING MODULE AND METHOD OF MANUFACTURING THE SAME
    35.
    发明申请
    MINIATURIZATION IMAGE CAPTURING MODULE AND METHOD OF MANUFACTURING THE SAME 有权
    微型图像捕获模块及其制造方法

    公开(公告)号：US20120314126A1

    公开(公告)日：2012-12-13

    申请号：US13195901

    申请日：2011-08-02

    Applicant: TI-LUN LIU ,  YING-CHENG WU

    Inventor： TI-LUN LIU ,  YING-CHENG WU

    IPC: H04N5/225 ,  B29C65/48

    CPC classification number: B29C65/5057 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: A miniaturization image capturing module includes a substrate unit, an image capturing unit, a fixing glue unit, and a lens unit. The substrate unit includes a hollow substrate body, a plurality of top conductive pads, a plurality of bottom conductive pads, a plurality of embedded conductive traces. The hollow substrate body has at least one receiving space, and each embedded conductive trace is electrically connected between at least one of the top conductive pads and at least one of the bottom conductive pads. The image capturing unit includes at least one image capturing chip received in the receiving space and electrically connected to the substrate unit. The fixing glue unit includes a fixing glue disposed in the receiving space and fixed between the hollow substrate body and the image capturing chip. The lens unit is disposed on the top side of the hollow substrate body.

    Abstract translation: 小型化图像拍摄模块包括基板单元，图像捕获单元，固定胶单元和透镜单元。 基板单元包括中空基板主体，多个顶部导电焊盘，多个底部导电焊盘，多个嵌入式导电迹线。 中空基板主体具有至少一个接收空间，并且每个嵌入的导电迹线电连接在至少一个顶部导电焊盘和至少一个底部导电焊盘之间。 图像拍摄单元包括容纳在接收空间中并电连接到基板单元的至少一个图像捕获芯片。 固定胶单元包括设置在容纳空间中并固定在中空基板主体和图像捕获芯片之间的固定胶。 透镜单元设置在中空基板主体的顶侧。

    Electronic elements carrier
    36.
    发明授权
    Electronic elements carrier 有权
    电子元件载体

    公开(公告)号：US08085547B2

    公开(公告)日：2011-12-27

    申请号：US11948526

    申请日：2007-11-30

    Applicant: Ying-Cheng Wu ,  Kun-Hsiao Liu

    Inventor： Ying-Cheng Wu ,  Kun-Hsiao Liu

    IPC: H05K1/18

    CPC classification number: H05K1/183 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/4611 ,  H05K3/4697 ,  H05K2201/043 ,  Y10T29/49128 ,  Y10T29/4913

    Abstract: An electronic elements carrier includes a body, at least an electronic element and a filler. The body includes a substrate having a plate and a dam formed on the peripheral of plate, a conductive layer mounted on a surface of the dam, and at least a cavity defined by the plate and the dam of the substrate. The electronic element is disposed in the cavity of the body. The filler is received in the cavity of the substrate for encapsulating, sealing and protecting the electronic element.

    Abstract translation: 电子元件载体包括主体，至少电子元件和填充物。 主体包括具有板和形成在板的周边上的坝的基板，安装在坝的表面上的导电层和至少由板和基板的坝限定的空腔。 电子元件设置在身体的空腔中。 填料被接收在衬底的空腔中，用于封装，密封和保护电子元件。

    Digital camera module packaging method
    37.
    发明授权
    Digital camera module packaging method 有权
    数码相机模块包装方式

    公开(公告)号：US07646429B2

    公开(公告)日：2010-01-12

    申请号：US11595297

    申请日：2006-11-10

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    IPC: H04N5/225

    CPC classification number: H04N5/2253 ,  H04N5/2254

    Abstract: A digital camera module packaging method includes: first, providing a carrier (20) including a base (21) defining a chamber (214) and a lead frame (23). The lead frame has a plurality of conduction pieces (233) embedded in the base. One end of each conduction piece is exposed at one surface of the base, and another end of the conduction piece is exposed at another surface of the base. An image sensor chip (30) with a photosensitive area (301) and a plurality of chip pads (302) is then mounted in the chamber. A plurality of wires (40) is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one exposed end of a corresponding conduction piece of the carrier. A holder (50) is then provided. The carrier is mounted to the holder. Finally, a lens module (70) is mounted on the holder.

    Abstract translation: 一种数字照相机模块封装方法，包括：首先，提供一个载体（20），其包括限定腔室（214）和引线框架（23）的底座（21）。 引线框具有嵌入基座中的多个导电片（233）。 每个导电件的一端在基座的一个表面露出，并且导电件的另一端暴露在基座的另一个表面。 然后将具有感光区域（301）和多个芯片焊盘（302）的图像传感器芯片（30）安装在室中。 然后提供多根电线（40）。 每条导线将图像传感器芯片的相应芯片焊盘和载体的相应导电片的一个暴露端部电连接。 然后提供支架（50）。 承载件安装在支架上。 最后，镜头模块（70）安装在支架上。

    COMBINATION OF CHIP PACKAGE UNITS
    39.
    发明申请
    COMBINATION OF CHIP PACKAGE UNITS 有权
    芯片包装单元的组合

    公开(公告)号：US20090166837A1

    公开(公告)日：2009-07-02

    申请号：US12060106

    申请日：2008-03-31

    Applicant: STEVEN WEBSTER ,  YING-CHENG WU ,  CHAO-YUAN CHAN ,  SHIH-MIN LO

    Inventor： STEVEN WEBSTER ,  YING-CHENG WU ,  CHAO-YUAN CHAN ,  SHIH-MIN LO

    IPC: H01L23/488

    CPC classification number: H01L25/105 ,  H01L23/13 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1052 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: A combination includes a first chip package unit and a second chip package unit on which the first chip package unit is placed. Each of the first and second chip package units includes a substrate having a first surface, a second surface, a chip package electrically connected to the first surface, and a plurality of bonding pads formed on the first and second surfaces. The bonding pads on the first surface of the first chip package unit are respectively electrically connected with the bonding pads on the surface of the second chip package unit. The chip packages electrically connected to the first surfaces are enclosed by the substrates, and the bonding pads on the second surfaces are configured as interface terminals of the combination.

    Abstract translation: 组合包括第一芯片封装单元和放置第一芯片封装单元的第二芯片封装单元。 第一和第二芯片封装单元中的每一个包括具有第一表面，第二表面，电连接到第一表面的芯片封装的衬底和形成在第一表面和第二表面上的多个焊盘。 第一芯片封装单元的第一表面上的焊盘分别与第二芯片封装单元的表面上的焊盘电连接。 电连接到第一表面的芯片封装被基板封闭，并且第二表面上的焊盘被配置为该组合的接口端子。

    IMAGING MODULE PACKAGE
    40.
    发明申请
    IMAGING MODULE PACKAGE 审中-公开
    成像模块包装

    公开(公告)号：US20090135296A1

    公开(公告)日：2009-05-28

    申请号：US12013929

    申请日：2008-01-14

    Applicant: YING-CHENG WU ,  PANG-JUNG LIU ,  CHIEN-CHENG YAO ,  SHIH-MIN LO

    Inventor： YING-CHENG WU ,  PANG-JUNG LIU ,  CHIEN-CHENG YAO ,  SHIH-MIN LO

    IPC: H04N5/225

    CPC classification number: H05K1/183 ,  H01L24/14 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/16 ,  H05K1/023 ,  H05K2201/10121 ,  H05K2201/10515

    Abstract: An exemplary imaging module package includes a housing, an imaging sensor module, and a lens module. The housing includes a first chamber and a second chamber coaxially aligned with the first chamber. The imaging sensor module is positioned within the first chamber and includes a substrate, an imaging sensor, a plurality of passive components and a plurality of soldering pads. The soldering pads connect the imaging sensor to the substrate. The passive components are mounted to the substrate and wholly disposed below the imaging sensor. The lens module is positioned within the second chamber of the housing.

    Abstract translation: 示例性成像模块包括壳体，成像传感器模块和透镜模块。 壳体包括与第一腔室同轴对准的第一腔室和第二腔室。 成像传感器模块位于第一腔室内，并且包括基底，成像传感器，多个无源部件和多个焊盘。 焊盘将成像传感器连接到基板。 无源部件安装到基板上，并且整体设置在成像传感器下方。 透镜模块定位在壳体的第二腔室内。

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