公开(公告)号：US20120252207A1

公开(公告)日：2012-10-04

申请号：US13174692

申请日：2011-06-30

Applicant: Yu Lei ,  Xinyu Fu ,  Anantha Subramani ,  Seshadri Ganguli ,  Srinivas Gandikota

Inventor： Yu Lei ,  Xinyu Fu ,  Anantha Subramani ,  Seshadri Ganguli ,  Srinivas Gandikota

IPC: H01L21/283 ,  B82Y40/00

CPC classification number: H01L21/02697 ,  B82Y40/00 ,  H01L21/28556 ,  H01L21/28562 ,  H01L21/7681 ,  H01L21/76834 ,  H01L21/76846 ,  H01L21/7685 ,  H01L21/76856 ,  H01L21/76858 ,  H01L21/76862 ,  H01L21/76864 ,  H01L21/76873 ,  H01L21/76877 ,  H01L21/76885 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53266 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Embodiments of the invention provide methods for forming materials on a substrate used for metal gate and other applications. In one embodiment, a method includes forming a cobalt stack over a barrier layer disposed on a substrate by depositing a cobalt layer during a deposition process, exposing the cobalt layer to a plasma to form a plasma-treated cobalt layer during a plasma process, and repeating the cobalt deposition process and the plasma process to form the cobalt stack containing a plurality of plasma-treated cobalt layers. The method further includes exposing the cobalt stack to an oxygen source gas to form a cobalt oxide layer from an upper portion of the cobalt stack during a surface oxidation process and heating the remaining portion of the cobalt stack to a temperature within a range from about 300° C. to about 500° C. to form a crystalline cobalt film during a thermal annealing crystallization process.

Abstract translation: 本发明的实施例提供了在用于金属栅极和其它应用的基板上形成材料的方法。 在一个实施例中，一种方法包括通过在沉积工艺期间沉积钴层而在设置在衬底上的势垒层上形成钴堆叠，在等离子体工艺期间将钴层暴露于等离子体以形成等离子体处理的钴层，以及 重复钴沉积工艺和等离子体工艺以形成含有多个等离子体处理的钴层的钴堆。 该方法还包括将钴堆叠暴露于氧源气体，以在表面氧化过程期间从钴堆叠的上部形成钴氧化物层，并将钴堆叠的剩余部分加热至约300 约500℃，以在热退火结晶过程中形成结晶钴膜。

公开(公告)号：US20110298062A1

公开(公告)日：2011-12-08

申请号：US13116794

申请日：2011-05-26

Applicant: SESHADRI GANGULI ,  SANG Ho YU ,  SANG-HYEOB LEE ,  HYOUNG-CHAN HA ,  WEI TI LEE ,  HOON KIM ,  SRINIVAS GANDIKOTA ,  YU LEI ,  KEVIN MORAES ,  XIANMIN TANG

Inventor： SESHADRI GANGULI ,  SANG Ho YU ,  SANG-HYEOB LEE ,  HYOUNG-CHAN HA ,  WEI TI LEE ,  HOON KIM ,  SRINIVAS GANDIKOTA ,  YU LEI ,  KEVIN MORAES ,  XIANMIN TANG

IPC: H01L21/28 ,  H01L29/78 ,  B82Y40/00 ,  B82Y99/00

CPC classification number: H01L21/28079 ,  H01L21/28088 ,  H01L21/32051 ,  H01L29/49

Abstract: Metal gate structures and methods for forming thereof are provided herein. In some embodiments, a method for forming a metal gate structure on a substrate having a feature formed in a high k dielectric layer may include depositing a first layer within the feature atop the dielectric layer; depositing a second layer comprising cobalt or nickel within the feature atop the first layer; and depositing a third layer comprising a metal within the feature atop the second layer to fill the feature, wherein at least one of the first or second layers forms a wetting layer to form a nucleation layer for a subsequently deposited layer, wherein one of the first, second, or third layers forms a work function layer, and wherein the third layer forms a gate electrode.

Abstract translation: 本文提供了金属门结构及其形成方法。 在一些实施例中，在具有形成在高k电介质层中的特征的衬底上形成金属栅极结构的方法可以包括在电介质层顶部的特征内沉积第一层; 在所述特征内在所述第一层顶部沉积包含钴或镍的第二层; 以及在第二层顶部沉积包括特征内的金属的第三层以填充该特征，其中第一层或第二层中的至少一层形成润湿层以形成后续沉积层的成核层，其中第一层 第二层或第三层形成功函数层，并且其中第三层形成栅电极。

公开(公告)号：US07959413B2

公开(公告)日：2011-06-14

申请号：US11655198

申请日：2007-01-19

Applicant: Shihhua Ho ,  Shihying Huang ,  Tsung Yu Lei ,  Chung-kai Lan ,  Huan-Chi Chen ,  Wen-Shi Huang

Inventor： Shihhua Ho ,  Shihying Huang ,  Tsung Yu Lei ,  Chung-kai Lan ,  Huan-Chi Chen ,  Wen-Shi Huang

IPC: F04D29/38

CPC classification number: F04D29/329

Abstract: A fan includes an impeller and a motor. The impeller includes a hub and a plurality of blades. The hub has a top portion, a connection portion, and at least one airflow-guiding portion. The top portion is connected to the connection portion. The blades are disposed around the connection portion. The motor is disposed corresponding to the impeller and used to drive the impeller to rotate. The airflow-guiding portion is disposed between two adjacent blades.

Abstract translation: 风扇包括叶轮和电动机。 叶轮包括轮毂和多个叶片。 轮毂具有顶部，连接部分和至少一个气流引导部分。 顶部连接到连接部分。 叶片围绕连接部分设置。 电动机对应于叶轮设置并用于驱动叶轮旋转。 气流引导部分设置在两个相邻的叶片之间。

公开(公告)号：US20100085711A1

公开(公告)日：2010-04-08

申请号：US12634049

申请日：2009-12-09

Applicant: Hao-Wen Ko ,  Tsung-Yu Lei ,  Wen-Shi Huang

Inventor： Hao-Wen Ko ,  Tsung-Yu Lei ,  Wen-Shi Huang

IPC: H05K7/20

CPC classification number: H01L23/467 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipation module assembled with a circuit board is disclosed. The heat dissipation module assembled comprises a fan and at least a heat sink. The fan comprises a frame and an impeller. The frame comprises a body and at least an extension, wherein the extension protrudes from at least a side of the body. The impeller is disposed in the body. The heat sink is coupled to the extension for dissipating heat produced from an electronic element disposed on the circuit board, wherein the heat sink is received in the extension and disposed on the electronic element.

Abstract translation: 公开了一种与电路板组装的散热模块。 组装的散热模块包括风扇和至少一个散热器。 风扇包括框架和叶轮。 框架包括主体和至少一个延伸部，其中延伸部从主体的至少一侧突出。 叶轮设置在体内。 散热器耦合到延伸部，用于散发由设置在电路板上的电子元件产生的热量，其中散热器被接收在延伸部分中并且设置在电子元件上。

公开(公告)号：US07688588B2

公开(公告)日：2010-03-30

申请号：US11902902

申请日：2007-09-26

Applicant: Hao-Wen Ko ,  Tsung-Yu Lei ,  Wen-Shi Huang

Inventor： Hao-Wen Ko ,  Tsung-Yu Lei ,  Wen-Shi Huang

IPC: H05K7/20 ,  F28F3/02 ,  H01L23/34

CPC classification number: H01L23/467 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipation module is disclosed. The heat dissipation module includes fan and at least a heat sink. The fan includes a frame and an impeller. The frame includes a body and at least an extension. The extension protrudes from at least a side of the body. The extension or the body is connected with the circuit board. The impeller is disposed in the body. The heat sink is connected with the extension for dissipating heat produced from the electronic element.

Abstract translation: 公开了散热模块。 散热模块包括风扇和至少一个散热器。 风扇包括框架和叶轮。 该框架包括主体和至少一个延伸部。 延伸部从身体的至少一侧突出。 延长线或主体与电路板连接。 叶轮设置在体内。 散热器与延长部连接，用于散发从电子元件产生的热量。

公开(公告)号：US20080305153A1

公开(公告)日：2008-12-11

申请号：US12097123

申请日：2005-12-12

Applicant: De-xian Wang ,  Zhen-yu Lei

Inventor： De-xian Wang ,  Zhen-yu Lei

IPC: A61K9/70 ,  A61K9/08 ,  A61K33/38 ,  A61K33/34 ,  A61P31/04

CPC classification number: C09D1/00 ,  A01N59/16 ,  C03C17/007 ,  C03C17/25 ,  C03C17/256 ,  C03C2204/02 ,  C03C2217/212 ,  C03C2217/213 ,  C03C2217/475 ,  C03C2217/477 ,  C03C2218/113 ,  C09D5/14 ,  A01N25/00 ,  A01N25/02 ,  A01N25/04 ,  A01N25/24 ,  A01N2300/00

Abstract: The invention relates to an antibacterial sol-gel coating solution, a process for preparing the antibacterial sol-gel coating solution, an antibacterial article, and a process and an apparatus for producing the antibacterial article. Said antibacterial sol-gel coating solution comprises a. at least one substance selected from the group consisting of Ti or Si-containing compounds capable of hydrolyzing to form a base film; b. a regulating agent capable of regulating the hydrolysis rate of the Ti or Si-containing compounds; c. an organic solvent; d. water; and e. at least one soluble compound of antibacterial metal selected from the group consisting of Ag, Cu, Mg, Zn, Sn, Fe, Co, Ni, and Ce; wherein a, b and a portion of c are first mixed to form a solution I, d and the rest of c are then mixed and added into solution I to form a dispersion II, and then e is added into dispersion II to form the antibacterial sol-gel coating solution.

Abstract translation: 本发明涉及一种抗菌溶胶 - 凝胶涂层溶液，一种制备抗菌溶胶 - 凝胶涂层溶液的方法，一种抗菌制品，以及一种生产该抗菌制品的方法和装置。 所述抗菌溶胶 - 凝胶涂层溶液包含a。 选自由能够水解形成基膜的Ti或含Si化合物组成的组中的至少一种物质; b。 能调节含Ti或Si化合物的水解速率的调节剂; C。 有机溶剂; d。 水; 和e。 至少一种选自Ag，Cu，Mg，Zn，Sn，Fe，Co，Ni和Ce的抗菌金属的可溶性化合物; 其中a，b和c的一部分首先混合以形成溶液I，然后将C的其余部分混合并加入到溶液I中以形成分散体II，然后将e加入到分散体II中以形成抗菌剂 溶胶 - 凝胶涂层溶液。

公开(公告)号：US20070286727A1

公开(公告)日：2007-12-13

申请号：US11709165

申请日：2007-02-22

Applicant: Shun-Chen Chang ,  Chia-Ming Hsu ,  Tsung-Yu Lei ,  Chin-Sheng Liu ,  Peng-Chu Tao ,  Chia-Ching Lin ,  Shih-Wei Huang ,  Ching-Chuang Mai ,  Wen-Shi Huang ,  Hsiou-Chen Chang

Inventor： Shun-Chen Chang ,  Chia-Ming Hsu ,  Tsung-Yu Lei ,  Chin-Sheng Liu ,  Peng-Chu Tao ,  Chia-Ching Lin ,  Shih-Wei Huang ,  Ching-Chuang Mai ,  Wen-Shi Huang ,  Hsiou-Chen Chang

IPC: F01D1/06

CPC classification number: F04D19/007 ,  F04D25/082 ,  F04D29/544

Abstract: A heat dissipation fan includes a housing, a first rotor, a second rotor, a base and a plurality of static blades. The first rotor has a shaft and a plurality of rotor blades. The second rotor is coupled to the first rotor and has a plurality of rotor blades. The base is disposed in the housing for supporting the first and second rotors. The static blades are disposed between the housing and the base, wherein a rear portion of each static blade extends along an axial line of the heat dissipation fan for improving the working efficiency of the second rotor.

Abstract translation: 散热风扇包括壳体，第一转子，第二转子，基座和多个静态叶片。 第一转子具有轴和多个转子叶片。 第二转子联接到第一转子并且具有多个转子叶片。 基座设置在壳体中用于支撑第一和第二转子。 静态叶片设置在壳体和基座之间，其中每个静态叶片的后部沿着散热风扇的轴线延伸，以提高第二转子的工作效率。

公开(公告)号：US20070122278A1

公开(公告)日：2007-05-31

申请号：US11699009

申请日：2007-01-29

Applicant: Shih-Hua Ho ,  Hao-Ming Chen ,  Tsung-Yu Lei ,  Wen-Shi Huang

Inventor： Shih-Hua Ho ,  Hao-Ming Chen ,  Tsung-Yu Lei ,  Wen-Shi Huang

IPC: F04D19/00

CPC classification number: F04D29/526 ,  F04D25/0613 ,  F04D29/545

Abstract: A heat dissipation apparatus. A fan frame includes an air inlet, an air outlet, a passage, and a curved expansion portion. The air inlet is opposite the air outlet. The passage is between the air inlet and the air outlet, guiding airflow from the air inlet to the air outlet. The curved expansion portion is radially and outwardly extended from an inner peripheral wall of the passage at the air inlet or air outlet. An impeller is disposed in the fan frame and includes a plurality of blades. Each blade is disposed in the passage and includes an extension end extending to the curved expansion portion.

Abstract translation: 散热装置。 风扇框架包括空气入口，空气出口，通道和弯曲的膨胀部分。 进气口与出风口相对。 通道位于进气口和出气口之间，引导气流从空气入口到出风口。 弯曲的膨胀部分在空气入口或空气出口处从通道的内周壁径向向外延伸。 叶轮设置在风扇框架中并且包括多个叶片。 每个叶片设置在通道中并且包括延伸到弯曲膨胀部分的延伸端。

公开(公告)号：US20060257254A1

公开(公告)日：2006-11-16

申请号：US11230450

申请日：2005-09-21

Applicant: Shih-Hua Ho ,  Hao-Ming Chen ,  Tsung-Yu Lei ,  Wen-Shi Huang

Inventor： Shih-Hua Ho ,  Hao-Ming Chen ,  Tsung-Yu Lei ,  Wen-Shi Huang

IPC: F04D19/00

CPC classification number: F04D29/545 ,  F04D25/0613 ,  F04D29/667

Abstract: A heat dissipation apparatus. A fan frame accommodates an impeller therein and includes an air inlet, an air outlet, and a passage for guiding airflow from the air inlet to the air outlet. An inner peripheral wall of the passage radially and outwardly extends a smooth curved expansion portion at the air outlet. The curved expansion portion includes a recess in which the airflow forms an airflow layer, stopping subsequent airflow from directly contacting the inner peripheral wall of the passage.

Abstract translation: 散热装置。 风扇框架在其中容纳叶轮，并且包括空气入口，空气出口和用于将气流从空气入口引导到空气出口的通道。 通道的内周壁径向向外延伸出空气出口处的光滑弯曲膨胀部分。 弯曲的膨胀部分包括凹陷，气流形成气流层，阻止随后的气流直接接触通道的内周壁。

公开(公告)号：US07083387B2

公开(公告)日：2006-08-01

申请号：US10857899

申请日：2004-06-02

Applicant: Te-Fu Chen ,  Tsung-Yu Lei ,  Kuo-Cheng Lin ,  Wen-Shi Huang

Inventor： Te-Fu Chen ,  Tsung-Yu Lei ,  Kuo-Cheng Lin ,  Wen-Shi Huang

IPC: F01D5/22

CPC classification number: F04D29/325 ,  F04D29/326 ,  F04D29/34

Abstract: An axial flow fan. The axial flow fan includes an impeller, an annular structure, and a plurality of connecting elements. The impeller has a plurality of blades, arranged radially. Each blade has an outer periphery. The outer periphery has a top portion. The annular structure is attached to the top portion of the outer periphery of each blade. Each connecting element respectively connects each blade to the annular structure.

Abstract translation: 轴流风机。 轴流风扇包括叶轮，环形结构和多个连接元件。 叶轮具有径向布置的多个叶片。 每个叶片具有外周边。 外周具有顶部。 环形结构附接到每个叶片的外周的顶部。 每个连接元件分别将每个叶片连接到环形结构。