公开(公告)号：US20220276559A1

公开(公告)日：2022-09-01

申请号：US17680360

申请日：2022-02-25

Applicant: eChem Solutions Corp.

Inventor： Kuan-Ming Chen ,  Chi-Yu Lai ,  Chi-sung Chen

IPC: G03F7/039 ,  G03F7/38 ,  G03F7/40 ,  G03F7/32 ,  G03F7/16 ,  G03F7/20

Abstract: A positive photosensitive resin composition for a low-temperature process includes an alkali-soluble phenolic resin, a compound with quinonediazide group, a mixed solvent and at least one additive. The mixed solvent includes a first solvent and a second solvent. The first solvent has a volatilization rate of more than 50 relative to a volatilization rate of butyl acetate of 100, and the second solvent has a boiling point between 150° C. and 200° C. The at least one additive has a molecular weight of 500-5000 and a structural unit as Formula (I), wherein R1 is selected from a group consisting of hydrogen, hydroxyl group, C1-C5 alkyl group, phenyl group, halogen atoms and cyano group, R2 is selected from a group consisting of hydrogen, acid radical, benzene and derivatives thereof, phenols, benzoic acid and derivatives thereof and aromatic heterocycles, and n is 10-80. It is also provided a method for preparing a photoresist film

公开(公告)号：US20210382389A1

公开(公告)日：2021-12-09

申请号：US17308055

申请日：2021-05-05

Applicant: eChem Solutions Corp.

Inventor： Ya-Qian Chen ,  Yu-Chun Chen

IPC: G03F7/029 ,  G03F7/031 ,  G02F1/1335

Abstract: A photosensitive resin composition for a development process, a spacer, a light conversion layer, and a light-emitting device are provided. The photosensitive resin composition includes an alkali-soluble resin (A), an ethylenically-unsaturated monomer (B), a photopolymerization initiator (C), a solvent (D), and a pigment (E). The alkali-soluble resin (A) includes an alkali-soluble resin (A-1), wherein the alkali-soluble resin (A-1) includes a structural unit represented by formula (I-1) and a structural unit represented by formula (I-2). The photopolymerization initiator (C) includes an acylphosphine oxide compound represented by formula (III-1).

公开(公告)号：US20200225581A1

公开(公告)日：2020-07-16

申请号：US16741682

申请日：2020-01-13

Applicant: eChem Solutions Corp.

Inventor： Jui-Yu Hsu ,  Chia-Hao Lou ,  Chen-Wen Chiu

IPC: G03F7/038 ,  G03F7/16 ,  G03F7/004 ,  C08F20/30 ,  C08F20/32 ,  G02B1/04

Abstract: A photosensitive resin composition, an optical film, and a method of producing an optical film are provided. The photosensitive resin composition includes an ethylenically unsaturated group-containing compound (A) having one or two aromatic rings; a bisphenol fluorene oligomer (B) having one or two (meth)acryloyl groups; and a photoinitiator (C), wherein the weight ratio of the ethylenically unsaturated group-containing compound (A) to the bisphenol fluorene oligomer (B) is from 0.50 to 0.95.

公开(公告)号：US20200019055A1

公开(公告)日：2020-01-16

申请号：US16431752

申请日：2019-06-05

Applicant: eChem Solutions Corp.

Inventor： Yi-Sheng Wu ,  Hsin-Chieh Yang ,  Ping-Sung Tsai

IPC: G03F7/00 ,  G03F7/031 ,  G03F7/033 ,  G02B1/04

Abstract: A photosensitive composition, a color filter prepared by using the photosensitive composition and a method for preparing the color filter. The photosensitive composition includes an alkali-soluble resin (A); an ethylenically unsaturated monomer (B); a photopolymerization initiator (C); a solvent (D); and a colorant (E), wherein the content of the photopolymerization initiator (C) is from 32 parts by weight to 70 parts by weight based on 100 parts by weight of the ethylenically unsaturated monomer(B).

公开(公告)号：US20190243241A1

公开(公告)日：2019-08-08

申请号：US16119464

申请日：2018-08-31

Applicant: eChem Solutions Corp.

Inventor： Tz Jin Yang ,  Ming Che Chung

IPC: G03F7/023 ,  G03F7/039 ,  G03F7/004 ,  C08G73/10 ,  G03F7/16 ,  G03F7/20 ,  G03F7/26 ,  G03F7/38

CPC classification number: G03F7/0233 ,  C08G73/1046 ,  G03F7/0045 ,  G03F7/039 ,  G03F7/16 ,  G03F7/168 ,  G03F7/20 ,  G03F7/26 ,  G03F7/38

Abstract: The present invention provides a photosensitive polyimide composition comprising a polyimide resin having a structural unit represented by the formula (1) and a structural unit represented by the formula (2), a quinonediazide sulfonate, a thermal curing agent, and a thermal acid generator. In the formulas (1) and (2), n is an integer of 10 to 600, Ar1 is a tetravalent organic group; Ar2 is a divalent to tetravalent organic group; Ar3 is a divalent aromatic group; and R1 is an OH group or a COOH group. The present invention also provides a photoresist film made of the above-mentioned photosensitive polyimide composition.

公开(公告)号：US11919997B2

公开(公告)日：2024-03-05

申请号：US17329159

申请日：2021-05-25

Applicant: eChem Solutions Corp.

Inventor： Meng-Po Liu ,  Yu-Chun Chen

IPC: C08F2/46 ,  C08F2/06 ,  C08F2/50 ,  C08G61/04 ,  C08G63/688 ,  C08K3/22 ,  F21V9/40 ,  H01L33/50

CPC classification number: C08G63/688 ,  C08F2/06 ,  C08F2/50 ,  C08K3/22 ,  C08G2650/24 ,  C08G2650/64 ,  C08K2003/2241 ,  F21V9/40 ,  H01L33/502

Abstract: A white photosensitive resin composition, a white spacer, a light conversion layer, and a light-emitting device are provided. The white photosensitive resin composition includes a polymerizable compound (A), an alkali-soluble resin (B), a photopolymerization initiator (C), a solvent (D), and a white pigment (E). The polymerizable compound (A) includes an ethylenically-unsaturated monomer (A-1) represented by formula (I-1) and a thiol compound (A-2) having two or more thiol groups in one molecule, wherein based on 100 mass % of the polymerizable compound (A), a total content of the ethylenically-unsaturated monomer (A-1) and the thiol compound (A-2) is 10 mass % to 98 mass %.

公开(公告)号：US20230295366A1

公开(公告)日：2023-09-21

申请号：US18181581

申请日：2023-03-10

Applicant: eChem Solutions Corp.

Inventor： Wei-Chung Liang ,  Kuo-Chu Yeh

IPC: C08F283/04 ,  C08G73/10 ,  C08G73/12 ,  C08F220/20 ,  C08F222/10 ,  C08J3/28

CPC classification number: C08F283/04 ,  C08G73/1007 ,  C08G73/1078 ,  C08G73/12 ,  C08F220/20 ,  C08F222/102 ,  C08J3/28 ,  C08J2379/08

Abstract: A polyimide precursor, a preparation method thereof, a photosensitive resin composition and a cured product are provided. The polyimide precursor is obtained from a tetracarboxylic dianhydride (A), a diamine (B), and a hydroxyl-containing alkyl (meth)acrylate (C) through ring-opening substitution, and polymerization. The polyimide precursor does not include fluorine. The tetracarboxylic dianhydride (A) and the diamine (B) form a main chain. The hydroxyl-containing alkyl (meth)acrylate (C) is grafted to the main chain to form a branch. A molar ratio of the tetracarboxylic dianhydride (A) to the diamine (B) if from 1:0.95 to 1:1.10.

公开(公告)号：US11609496B2

公开(公告)日：2023-03-21

申请号：US16909936

申请日：2020-06-23

Applicant: ECHEM SOLUTIONS CORP.

Inventor： Ting-Wei Chang ,  Ming-Che Chung

IPC: G03F7/039 ,  G03F7/004 ,  G03F7/16 ,  G03F7/20 ,  G03F7/42 ,  G03F7/32 ,  G03F7/38

Abstract: The present invention provides a method for forming a patterned polyimide layer with the use of a positive photoresist composition. The composition comprises a cresol-type novolac resin, a diazonaphthoquinone-based sensitizer and an organic solvent; based on the cresol-type novolac resin with a total amount of 100 parts by weight, the amount of the diazonaphthoquinone-based sensitizer ranges from 40 parts to 60 parts by weight, the amount of the free cresol in the cresol-type novolac resin is lower than 2 parts by weight, and the alkaline dissolution rate (ADR) of the cresol-type novolac resin in an aqueous solution of 3.5 wt % to 7 wt % tetramethylammonium hydroxide is lower than 285 Å/s. The positive photoresist composition has excellent chemical resistance to the polyimide stripper, and can specifically improve the protective ability of the photoresist layer to the low-dielectric polyimide layer, thereby optimizing the manufacturing process and quality of the patterned polyimide layer.

公开(公告)号：US20220276556A1

公开(公告)日：2022-09-01

申请号：US17680358

申请日：2022-02-25

Applicant: eChem Solutions Corp.

Inventor： Hao Lun Huang ,  Yi Sheng Wu

IPC: G03F7/033 ,  G03F7/00

Abstract: The present disclosure provides a photoresist composition comprising an alkali soluble resin, a photopolymerizable compound, a photoinitiator, a thermal initiator, a black colorant, and a solvent, wherein the photopolymerizable compound contains at least one ethylenically unsaturated monomer and at least one epoxy compound. The present disclosure also provides an optical film and a preparing method of the optical film.

公开(公告)号：US20220098398A1

公开(公告)日：2022-03-31

申请号：US17412286

申请日：2021-08-26

Applicant: eChem Solutions Corp.

Inventor： Chin-Chen Huang ,  Yu-Wen Chen ,  Yu-Lun Li ,  Chen-Wen Chiu

IPC: C08L35/02 ,  C08J5/18 ,  G02B5/00 ,  G02B1/04

Abstract: A black resin composition, a cured film, and a black filter are provided. The black resin composition includes: a black coloring agent (A), an ethylenically-unsaturated monomer (B), a solvent (C), a resin (D), a photoinitiator (E), a UV absorber (F), and a surfactant (G). The resin (D) includes a first resin having a weight-average molecular weight of 2,000 to 20,000. The first resin includes a structural unit having a fluorene ring and two or more ethylenically-polymerizable groups. The UV absorber (F) includes a benzylidene-based derivative.