公开(公告)号：US20190030678A1

公开(公告)日：2019-01-31

申请号：US16042016

申请日：2018-07-23

Applicant: Applied Materials, Inc.

Inventor： Ashavani KUMAR ,  Ashwin CHOCKALINGAM ,  Sivapackia GANAPATHIAPPAN ,  Rajeev BAJAJ ,  Boyi FU ,  Daniel REDFIELD ,  Nag B. PATIBANDLA ,  Mario Dagio CORNEJO ,  Amritanshu SINHA ,  Yan ZHAO ,  Ranga Rao ARNEPALLI ,  Fred C. REDEKER

IPC: B24B37/24 ,  B29C64/112

Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

公开(公告)号：US20180161954A1

公开(公告)日：2018-06-14

申请号：US15876436

申请日：2018-01-22

Applicant: Applied Materials, Inc.

Inventor： Rajeev BAJAJ ,  Kasiraman KRISHNAN ,  Mahendra C. ORILALL ,  Daniel REDFIELD ,  Fred C. REDEKER ,  Nag B. PATIBANDLA ,  Gregory E. MENK ,  Jason G. FUNG ,  Russell Edward PERRY ,  Robert E. DAVENPORT

IPC: B24B37/26 ,  B29C64/112 ,  B24D18/00 ,  B24B37/24 ,  B24B37/20 ,  B33Y80/00 ,  B24B37/22

Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

公开(公告)号：US20160107290A1

公开(公告)日：2016-04-21

申请号：US14695299

申请日：2015-04-24

Applicant: Applied Materials, Inc.

Inventor： Rajeev BAJAJ ,  Kasiraman KRISHNAN ,  Mahendra C. ORILALL ,  Daniel REDFIELD ,  Fred C. REDEKER ,  Nag B. PATIBANDLA ,  Gregory E. MENK ,  Jason G. FUNG ,  Russell Edward PERRY ,  Robert E. DAVENPORT

IPC: B24B37/26 ,  B24B37/22 ,  B24D18/00 ,  B24B37/20

CPC classification number: B24B37/26 ,  B24B37/205 ,  B24B37/22 ,  B24B37/24 ,  B24D18/0045 ,  B29C64/112 ,  B33Y80/00

Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

Abstract translation: 本公开的实施例通常提供抛光垫，其包括复合衬垫本体和用于形成抛光垫的方法。 一个实施例提供了一种包括复合衬垫本体的抛光垫。 复合衬垫本体包括由第一材料或第一组合材料形成的一个或多个第一特征以及由第二材料或第二材料组合物形成的一个或多个第二特征，其中所述一个或多个第一特征和一个 或更多的第二特征通过沉积多个层而形成，所述多个层包括第一材料或第一材料组合物和第二材料或第二材料组合物。

公开(公告)号：US20160107288A1

公开(公告)日：2016-04-21

申请号：US14885955

申请日：2015-10-16

Applicant: Applied Materials, Inc.

Inventor： Mahendra Christopher ORILALL ,  Timothy MICHAELSON ,  Kasiraman KRISHNAN ,  Rajeev BAJAJ ,  Nag B. PATIBANDLA ,  Daniel REDFIELD ,  Fred C. REDEKER ,  Gregory E. MENK

IPC: B24B37/24 ,  B24B37/26 ,  B24D18/00 ,  B24B37/22

CPC classification number: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B24D18/0045 ,  B33Y10/00 ,  B33Y80/00

Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.

Abstract translation: 制造抛光垫的抛光层的方法包括用3D打印机连续沉积多个层，通过从第一喷嘴喷射基材并从第二喷嘴排出添加剂材料沉积多个抛光层的每一层，以及 固化基材和添加剂材料以形成固化的垫材料。

公开(公告)号：US20150348773A1

公开(公告)日：2015-12-03

申请号：US14410790

申请日：2013-07-01

Applicant: Applied Materials, Inc.

Inventor： Mingwei ZHU ,  Nag B. PATIBANDLA ,  Rongjun WANG ,  Vivek AGRAWAL ,  Anantha SUBRAMANI ,  Daniel Lee DIEHL ,  Xianmin TANG

IPC: H01L21/02 ,  H01L21/322 ,  H01J37/34 ,  H01L21/3065

CPC classification number: H01L21/0254 ,  C23C14/0036 ,  C23C14/0641 ,  H01J37/3426 ,  H01J37/3467 ,  H01L21/02458 ,  H01L21/02631 ,  H01L21/3065 ,  H01L21/3228

Abstract: Embodiments of the invention described herein generally relate to an apparatus and methods for forming high quality buffer layers and Group III-V layers that are used to form a useful semiconductor device, such as a power device, light emitting diode (LED), laser diode (LD) or other useful device. Embodiments of the invention may also include an apparatus and methods for forming high quality buffer layers, Group III-V layers and electrode layers that are used to form a useful semiconductor device. In some embodiments, an apparatus and method includes the use of one or more cluster tools having one or more physical vapor deposition (PVD) chambers that are adapted to deposit a high quality aluminum nitride (AlN) buffer layer that has a high crystalline orientation on a surface of a plurality of substrates at the same time.

Abstract translation: 本文描述的本发明的实施例一般涉及用于形成高质量缓冲层的装置和方法，以及用于形成有用的半导体器件的III-V层，例如功率器件，发光二极管（LED），激光二极管 （LD）或其他有用的装置。 本发明的实施例还可以包括用于形成用于形成有用的半导体器件的高质量缓冲层，III-V族层和电极层的装置和方法。 在一些实施例中，装置和方法包括使用具有一个或多个物理气相沉积（PVD）室的一个或多个簇工具，其适于将具有高结晶取向的高质量氮化铝（AlN）缓冲层沉积在 同时是多个基板的表面。