公开(公告)号：US20230161260A1

公开(公告)日：2023-05-25

申请号：US17960798

申请日：2022-10-05

Applicant: Applied Materials, Inc.

Inventor： Dmitry LUBOMIRSKY ,  Douglas A. BUCHBERGER, Jr. ,  Hyunjun KIM ,  Alan L. TSO ,  Shekhar ATHANI ,  Qiwei LIANG ,  Ellie Y. YIEH

IPC: G03F7/20 ,  G03F7/16 ,  H01L21/67

CPC classification number: G03F7/2041 ,  G03F7/168 ,  H01L21/67115 ,  H01L21/67109

Abstract: A method and apparatus for performing post-exposure bake cooling operations is described herein. The method begins by post exposure baking a substrate disposed on heated substrate support in a process chamber, the process chamber having a showerhead. The heated substrate support is moved to increase a distance between the heated substrate support and a cooled plate of the showerhead. The substrate is separated from the heated substrate support using a substrate lifting device. The substrate is moved into a close proximity to the cooled showerhead. The substrate is cooled until the substrate is less than about 70 degrees Celsius. The substrate is spaced away from the cooled showerhead using the substrate lifting device and aligning the substrate with a substrate transfer passage of the processing chamber for removal by a robot.

公开(公告)号：US20220341042A1

公开(公告)日：2022-10-27

申请号：US17861750

申请日：2022-07-11

Applicant: Applied Materials, Inc.

Inventor： Adib KHAN ,  Shankar VENKATARAMAN ,  Jay D. PINSON, II ,  Jang-Gyoo YANG ,  Nitin K. INGLE ,  Qiwei LIANG

IPC: C23C16/56 ,  C23C16/44 ,  C23C16/455 ,  C23C16/46 ,  H01L21/02 ,  H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: Embodiments of the present disclosure generally relate to a batch processing chamber that is adapted to simultaneously cure multiple substrates at one time. The batch processing chamber includes multiple processing sub-regions that are each independently temperature controlled. The batch processing chamber may include a first and a second sub-processing region that are each serviced by a substrate transport device external to the batch processing chamber. In addition, a slotted cover mounted on the loading opening of the batch curing chamber reduces the effect of ambient air entering the chamber during loading and unloading.

公开(公告)号：US20200343103A1

公开(公告)日：2020-10-29

申请号：US16926422

申请日：2020-07-10

Applicant: Applied Materials, Inc.

Inventor： Adib M. KHAN ,  Qiwei LIANG ,  Sultan MALIK ,  Srinivas D. NEMANI

IPC: H01L21/447 ,  C23C16/452 ,  H01L21/67

Abstract: The present disclosure relates to high pressure processing apparatus for semiconductor processing. The apparatus described herein include a high pressure process chamber and a containment chamber surrounding the process chamber. A high pressure fluid delivery module is in fluid communication with the high pressure process chamber and is configured to deliver a high pressure fluid to the process chamber.

公开(公告)号：US20200185260A1

公开(公告)日：2020-06-11

申请号：US16706115

申请日：2019-12-06

Applicant: Applied Materials, Inc.

Inventor： Sultan MALIK ,  Srinivas D. NEMANI ,  Qiwei LIANG ,  Adib M. KHAN

IPC: H01L21/687 ,  H01L21/673

Abstract: Embodiments of the disclosure relate to an apparatus and method for processing semiconductor substrates. In one embodiment, a processing system is disclosed. The processing system includes an outer chamber that surrounds an inner chamber. The inner chamber includes a substrate support upon which a substrate is positioned during processing. The inner chamber is configured to have an internal volume that, when isolated from an internal volume of the outer chamber, is changeable such that the pressure within the internal volume of the inner chamber may be varied.

公开(公告)号：US20200149166A1

公开(公告)日：2020-05-14

申请号：US16745141

申请日：2020-01-16

Applicant: Applied Materials, Inc.

Inventor： Kien N. CHUC ,  Qiwei LIANG ,  Hanh D. NGUYEN ,  Xinglong CHEN ,  Matthew MILLER ,  Soonam PARK ,  Toan Q. TRAN ,  Adib M. KHAN ,  Jang-Gyoo YANG ,  Dmitry LUBOMIRSKY ,  Shankar VENKATARAMAN

IPC: C23C16/455 ,  H01J37/32 ,  C23C16/452

Abstract: Apparatus and methods for gas distribution assemblies are provided. In one aspect, a gas distribution assembly is provided comprising an annular body comprising an annular ring having an inner annular wall, an outer wall, an upper surface, and a bottom surface, an upper recess formed into the upper surface, and a seat formed into the inner annular wall, an upper plate positioned in the upper recess, comprising a disk-shaped body having a plurality of first apertures formed therethrough, and a bottom plate positioned on the seat, comprising a disk-shaped body having a plurality of second apertures formed therethrough which align with the first apertures, and a plurality of third apertures formed between the second apertures and through the bottom plate, the bottom plate sealingly coupled to the upper plate to fluidly isolate the plurality of first and second apertures from the plurality of third apertures.

公开(公告)号：US20190187563A1

公开(公告)日：2019-06-20

申请号：US16272962

申请日：2019-02-11

Applicant: Applied Materials, Inc.

Inventor： Viachslav BABAYAN ,  Douglas A. BUCHBERGER, JR. ,  Qiwei LIANG ,  Ludovic GODET ,  Srinivas D. NEMANI ,  Daniel J. WOODRUFF ,  Randy HARRIS ,  Robert B. MOORE

IPC: G03F7/20 ,  G03F7/38 ,  H01L21/687 ,  G03F7/16 ,  G03F7/26

CPC classification number: G03F7/2035 ,  G03F7/168 ,  G03F7/26 ,  G03F7/38 ,  H01L21/68764

Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.

公开(公告)号：US20150329970A1

公开(公告)日：2015-11-19

申请号：US14577828

申请日：2014-12-19

Applicant: Applied Materials, Inc.

Inventor： Adib KHAN ,  Shankar VENKATARAMAN ,  Jay D. PINSON, II ,  Jang-Gyoo YANG ,  Nitin Krishnarao INGLE ,  Qiwei LIANG

IPC: C23C16/56 ,  H01L21/677 ,  C23C16/46 ,  H01L21/02 ,  C23C16/44 ,  C23C16/455

CPC classification number: C23C16/56 ,  C23C16/44 ,  C23C16/45565 ,  C23C16/46 ,  H01L21/02282 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67778 ,  H01L21/68742 ,  H01L21/68785

Abstract: Embodiments of the present disclosure generally relate to a batch processing chamber that is adapted to simultaneously cure multiple substrates at one time. The batch processing chamber includes multiple processing sub-regions that are each independently temperature controlled. The batch processing chamber may include a first and a second sub-processing region that are each serviced by a substrate transport device external to the batch processing chamber. In addition, a slotted cover mounted on the loading opening of the batch curing chamber reduces the effect of ambient air entering the chamber during loading and unloading.

Abstract translation: 本公开的实施例一般涉及一次批处理室，其适于一次同时固化多个基板。 批处理室包括各自独立温度控制的多个处理子区域。 批处理室可以包括第一和第二子处理区域，每个子处理区域由批处理室外部的基板输送装置维护。 此外，安装在分批固化室的装载开口上的开槽盖减少了在装载和卸载期间进入室的环境空气的影响。

公开(公告)号：US20150279623A1

公开(公告)日：2015-10-01

申请号：US14224951

申请日：2014-03-25

Applicant: Applied Materials, Inc.

Inventor： Qiwei LIANG

IPC: H01J37/32

CPC classification number: H01J37/32091 ,  H01J37/321 ,  H01J37/3266

Abstract: A chamber for processing a substrate is provided. The chamber includes a chamber body having one or more sidewalls and a bottom with a substrate support disposed inside the chamber body. The chamber also includes a showerhead disposed above the substrate support. The showerhead includes a showerhead faceplate that faces the substrate support and is electrically coupled to a capacitive RF power source. A space between the substrate support and the showerhead faceplate defines a processing volume. The chamber further includes one or more coils disposed outside the processing volume at a vertical location between the substrate support and the showerhead. The one or more coils are electrically coupled to one or more inductive RF power sources.

Abstract translation: 提供了一种用于处理衬底的腔室。 该室包括具有一个或多个侧壁的室主体和设置在室主体内部的具有基板支撑件的底部。 该室还包括设置在基板支撑件上方的喷头。 淋浴头包括面向基板支撑件并与电容式RF电源电耦合的喷头面板。 衬底支撑件和喷头面板之间的空间限定了处理量。 腔室还包括一个或多个线圈，其设置在处理容积的外侧，位于衬底支撑件和喷头之间的垂直位置处。 一个或多个线圈电耦合到一个或多个感应RF电源。

公开(公告)号：US20150013793A1

公开(公告)日：2015-01-15

申请号：US14481774

申请日：2014-09-09

Applicant: Applied Materials, Inc.

Inventor： Kien N. CHUC ,  Qiwei LIANG ,  Hanh D. NGUYEN ,  Xinglong CHEN ,  Matthew MILLER ,  Soonam PARK ,  Toan Q. TRAN ,  Adib KHAN ,  Jang-Gyoo YANG ,  Dmitry LUBOMIRSKY ,  Shankar VENKATARAMAN

IPC: C23C16/455

CPC classification number: C23C16/45565 ,  C23C16/452 ,  C23C16/45574 ,  H01J37/3244 ,  H01J37/32449 ,  Y10T137/85938

Abstract: Apparatus and methods for gas distribution assemblies are provided. In one aspect, a gas distribution assembly is provided comprising an annular body comprising an annular ring having an inner annular wall, an outer wall, an upper surface, and a bottom surface, an upper recess formed into the upper surface, and a seat formed into the inner annular wall, an upper plate positioned in the upper recess, comprising a disk-shaped body having a plurality of first apertures formed therethrough, and a bottom plate positioned on the seat, comprising a disk-shaped body having a plurality of second apertures formed therethrough which align with the first apertures, and a plurality of third apertures formed between the second apertures and through the bottom plate, the bottom plate sealingly coupled to the upper plate to fluidly isolate the plurality of first and second apertures from the plurality of third apertures.

Abstract translation: 提供了用于气体分配组件的装置和方法。 一方面，提供了一种气体分配组件，包括环形体，该环形体包括具有内环形壁，外壁，上表面和底表面的环形环，形成在上表面中的上凹部，以及形成 位于所述内部环形壁中的位于所述上部凹部中的上板，包括具有穿过其形成的多个第一孔的盘状体和位于所述座上的底板，所述底板包括具有多个第二孔的盘状体 通过其形成的孔与第一孔对准，以及形成在第二孔之间并穿过底板的多个第三孔，底板密封地联接到上板，以将多个第一和第二孔与多个 第三孔。