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    GRAPHICS CARD ASSEMBLY
    31.
    发明公开
    GRAPHICS CARD ASSEMBLY 审中-公开

    公开(公告)号：US20230171914A1

    公开(公告)日：2023-06-01

    申请号：US17881632

    申请日：2022-08-05

    Applicant: Acer Incorporated

    Inventor： Yu-Ming Lin ,  Wen-Neng Liao ,  Cheng-Wen Hsieh ,  Shu-Hao Kuo ,  Tsung-Ting Chen

    IPC: H05K7/20 ,  G06F1/20

    CPC classification number: H05K7/20145 ,  H05K7/2039 ,  H05K7/20336 ,  G06F1/206

    Abstract: A graphic card assembly includes a bracket, a graphic card module, a first fin set, a centrifugal fan, a second fin set, a heat pipe set and an axial flow fan. The graphic card module is assembled to the bracket and has at least one heat source. The first fin set and the second fin set are assembled to the bracket and the first fin set thermally contacts the heat source. The centrifugal fan is disposed beside the first fin set to generate a first flow dissipating heat from the first fin set. The heat pipe set contacts the heat source. The axial flow fan is disposed on the second fin set to generate a second flow dissipating heat from the second fin set. The first flow and the second flow are separated from each other, and the second flow passes through the bracket and the graphic card module.

    BLADE AND FAN
    34.
    发明申请
    BLADE AND FAN 审中-公开

    公开(公告)号：US20200182253A1

    公开(公告)日：2020-06-11

    申请号：US16703869

    申请日：2019-12-05

    Applicant: Acer Incorporated

    Inventor： Chun-Chieh Wang ,  Wen-Neng Liao ,  Cheng-Wen Hsieh ,  Yu-Ming Lin

    IPC: F04D27/00 ,  F04D29/32 ,  F04D29/38 ,  F04D29/34 ,  F04D29/02

    Abstract: A fan blade includes an arch-shaped body, a connecting portion, at least one sheet and at least one reinforcement component. The arch-shaped body has a pressure bearing surface and a negative pressure surface opposite to the pressure bearing surface. The connecting portion is connected to a first end portion of the arch-shaped main body. The sheet is connected to the pressure bearing surface or the negative pressure surface. The reinforcement component is connected to the pressure bearing surface. An orthogonal projection of the sheet on the arch-shaped body and an orthogonal projection of the reinforcement component on the arch-shaped body are not overlapped with each other. A fan is also provided.

    FOLDABLE ELECTRONIC DEVICE
    35.
    发明公开
    FOLDABLE ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20240152187A1

    公开(公告)日：2024-05-09

    申请号：US18493776

    申请日：2023-10-24

    Applicant: Acer Incorporated

    Inventor： Chun-Hung Wen ,  Chun-Hsien Chen ,  Hui-Ping Sun ,  Wen-Neng Liao ,  Yu-Ming Lin ,  Kuan-Lin Chen

    IPC: G06F1/16

    CPC classification number: G06F1/1681 ,  G06F1/1618 ,  H05K7/20136

    Abstract: A foldable electronic device including a first body, a second body, a hinge module, and a cover is provided. The hinge module is connected to the first body and the second body, such that the first body and the second body are rotated relatively to be folded or unfolded via the hinge module. The hinge module has a protruding rod eccentric to a rotation center of the hinge module. The cover is pivoted to the second body and located on a moving path of the protruding rod. The hinge module drives the cover to be rotated relative to the second body via the protruding rod.

    ELECTRONIC PACKAGE STRUCTURE
    39.
    发明公开
    ELECTRONIC PACKAGE STRUCTURE 审中-公开

    公开(公告)号：US20240055417A1

    公开(公告)日：2024-02-15

    申请号：US18447333

    申请日：2023-08-10

    Applicant: Acer Incorporated

    Inventor： Yu-Ming Lin ,  Wen-Neng Liao ,  Cheng-Wen Hsieh ,  Kuang-Hua Lin ,  Wei-Chin Chen

    IPC: H01L25/16 ,  H01L23/367 ,  H01L23/24

    CPC classification number: H01L25/165 ,  H01L23/3675 ,  H01L23/24

    Abstract: Provided is an electronic package structure, including a substrate, a first electronic component disposed on the substrate, at least one second electronic component disposed on the substrate, an insulating film disposed on the second electronic component and the substrate, an insulating glue filled onto the second electronic component and the substrate to cover at least part of the insulating film, a liquid metal disposed on the first electronic component, and a heat-dissipating plate disposed on the first electronic component to squeeze the liquid metal. The insulating film and the insulating glue prevent the overflowing liquid metal from contacting the second electronic component and the substrate.

    Electronic device
    40.
    发明授权
    Electronic device 有权

    公开(公告)号：US11899504B2

    公开(公告)日：2024-02-13

    申请号：US17170914

    申请日：2021-02-09

    Applicant: Acer Incorporated

    Inventor： Hung-Chi Chen ,  Ming-Feng Hsieh ,  Ju-Hsien Weng ,  Tzu-Hsiang Chang ,  Zheng-Yan Lee ,  Yu-Ming Lin ,  Huei-Ting Chuang ,  Shun-Bin Chen

    IPC: G06F1/16 ,  H05K5/02

    CPC classification number: G06F1/1679 ,  G06F1/1656 ,  H05K5/0243

    Abstract: An electronic device includes a casing, a driven component, a magnetic component and an electromagnetic component. The casing has an outer surface, an inner surface, and an accommodating groove penetrating through the outer surface and the inner surface. The driven component is movably disposed in the accommodating groove. The magnetic component is connected to the driven component. The electromagnetic component is aligned with the magnetic component, and the magnetic component and the electromagnetic component are located at the same side of the inner surface. When the electromagnetic component isn't powered, the magnetic component and the electromagnetic component are attracted to each other, and the driven component is positioned at a first position. When the electromagnetic component is powered, the magnetic component and the electromagnetic component are repulsed to each other so as to drive the driven component to move from the first position to the second position.

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