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    Methods and apparatus for processing substrates using model-based control
    31.
    发明授权
    Methods and apparatus for processing substrates using model-based control 有权
    使用基于模型的控制处理基板的方法和装置

    公开(公告)号：US08880210B2

    公开(公告)日：2014-11-04

    申请号：US13183520

    申请日：2011-07-15

    申请人： Keith Brian Porthouse ,  John W. Lane ,  Mariusch Gregor ,  Nir Merry ,  Michael R. Rice ,  Alex Minkovich ,  Hongbin Li ,  Dmitry A. Dzilno

    发明人： Keith Brian Porthouse ,  John W. Lane ,  Mariusch Gregor ,  Nir Merry ,  Michael R. Rice ,  Alex Minkovich ,  Hongbin Li ,  Dmitry A. Dzilno

    IPC分类号： G06F19/00 ,  G05B17/02 ,  H01L21/67 ,  G05D16/20

    CPC分类号： G05D16/2046 ,  G05B17/02 ,  H01L21/67017 ,  H01L21/67253

    摘要： Methods and apparatus are disclosed herein. In some embodiments, methods of controlling process chambers may include predetermining a relationship between pressure in a processing volume and a position of an exhaust valve as a function of a process parameter; setting the process chamber to a first state having a first pressure in the processing volume and a first value of the process parameter, wherein the exhaust valve is set to a first position based on the predetermined relationship to produce the first pressure at the first value; determining a pressure control profile to control the pressure as the process chamber is changed to a second state having a second pressure and a second process parameter value from the first state; and applying the pressure control profile to control the pressure by varying the position of the exhaust valve while changing the process chamber to the second state.

    摘要翻译： 本文公开了方法和装置。 在一些实施例中，控制处理室的方法可以包括根据处理参数预先确定处理容积中的压力与排气门的位置之间的关系; 将所述处理室设定为处理容积中具有第一压力的第一状态和所述处理参数的第一值，其中所述排气阀基于所述预定关系设定在第一位置以产生所述第一值的所述第一压力; 当所述处理室改变为具有来自所述第一状态的第二压力和第二过程参数值的第二状态时，确定压力控制曲线以控制所述压力; 以及通过在将处理室改变到第二状态的同时改变排气门的位置来施加压力控制曲线来控制压力。

    Scheduling method for processing equipment
    33.
    发明授权
    Scheduling method for processing equipment 有权
    加工设备调度方法

    公开(公告)号：US08019467B2

    公开(公告)日：2011-09-13

    申请号：US11775355

    申请日：2007-07-10

    申请人： Steve S. Hongkham ,  Eric A. Englhardt ,  Michael R. Rice ,  Helen R. Armer ,  Chongyang Chris Wang

    发明人： Steve S. Hongkham ,  Eric A. Englhardt ,  Michael R. Rice ,  Helen R. Armer ,  Chongyang Chris Wang

    IPC分类号： G06F7/00

    CPC分类号： H01L21/67745 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67276

    摘要： Methods and apparatus for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput and repeatable wafer processing history are provided. In one embodiment a first substrate is transferred from a first position to a second position and then the first substrate is transferred from the second position to a third position using a first robot. A second substrate is transferred from a first position to a second position and then the second substrate is transferred from the second position to a third position using a second robot. The movement of the first and second robots is synchronized so that the movement from the first position to the second position by the first and second robot is performed within a first time interval.

    摘要翻译： 提供了使用具有增加的系统吞吐量和可重复的晶片处理历史的多室处理系统（例如，集群工具）处理衬底的方法和装置。 在一个实施例中，第一衬底从第一位置转移到第二位置，然后使用第一机器人将第一衬底从第二位置转移到第三位置。 第二基底从第一位置转移到第二位置，然后使用第二机器人将第二基底从第二位置转移到第三位置。 第一机器人和第二机器人的移动被同步，使得在第一时间间隔内执行由第一和第二机器人从第一位置到第二位置的移动。

    Systems and methods for transferring small lot size substrate carriers between processing tools
    34.
    发明授权
    Systems and methods for transferring small lot size substrate carriers between processing tools 有权
    在处理工具之间传送小批量衬底载体的系统和方法

    公开(公告)号：US07711445B2

    公开(公告)日：2010-05-04

    申请号：US11555252

    申请日：2006-10-31

    申请人： Michael R. Rice ,  Eric A. Englhardt ,  Vinay Shah ,  Martin R. Elliott ,  Robert B. Lowrance ,  Jeffrey C. Hudgens

    发明人： Michael R. Rice ,  Eric A. Englhardt ,  Vinay Shah ,  Martin R. Elliott ,  Robert B. Lowrance ,  Jeffrey C. Hudgens

    IPC分类号： G06F19/00

    CPC分类号： H01L21/67727 ,  H01L21/67276 ,  H01L21/67769 ,  H01L21/67778 ,  Y02P80/40 ,  Y02P90/86

    摘要： In a first aspect, a method of managing work in progress within a small lot size semiconductor device manufacturing facility is provided. The first method includes providing a small lot size semiconductor device manufacturing facility having (1) a plurality of processing tools; and (2) a high speed transport system adapted to transport small lot size substrate carriers among the processing tools. The method further includes maintaining a predetermined work in progress level within the small lot size semiconductor device manufacturing facility by (1) increasing an average cycle time of low priority substrates within the small lot size semiconductor device manufacturing facility; and (2) decreasing an average cycle time of high priority substrates within the small lot size semiconductor device manufacturing facility so as to approximately maintain the predetermined work in progress level within the small lot size semiconductor device manufacturing facility. Numerous other aspects are provided.

    摘要翻译： 在第一方面，提供了一种在小批量半导体器件制造设施内管理正在进行的工作的方法。 第一种方法包括提供具有（1）多个处理工具的小批量半导体器件制造设备; 和（2）适于在处理工具之间运输小批量衬底载体的高速运输系统。 该方法还包括：（1）增加小批量半导体器件制造设备内的低优先级衬底的平均周期时间，使小批量半导体器件制造设备内的预定工作保持在进行中; 和（2）减小小批量半导体器件制造设备内的高优先级衬底的平均周期时间，以便在小批量半导体器件制造设备内大致维持预定工作进行中的水平。 提供了许多其他方面。

    Scheduling method for processing equipment
    35.
    发明授权
    Scheduling method for processing equipment 有权
    加工设备调度方法

    公开(公告)号：US07522968B2

    公开(公告)日：2009-04-21

    申请号：US11775365

    申请日：2007-07-10

    申请人： Steve S. Hongkham ,  Eric A. Englhardt ,  Michael R. Rice ,  Helen R. Armer ,  Chongyang Chris Wang

    发明人： Steve S. Hongkham ,  Eric A. Englhardt ,  Michael R. Rice ,  Helen R. Armer ,  Chongyang Chris Wang

    IPC分类号： G06F19/00

    CPC分类号： H01L21/67276

    摘要： Methods and apparatus for increasing the processing throughput of multiple lots of semiconductor wafers through a cluster tool while maintaining a constant wafer history for each lot are provided. A first lot of wafers containing one through n-th wafers is introduced into a cluster tool containing one or more processing chambers. The first lot of wafers is processed for a first time period. A second lot of wafers containing one through n-th wafers is introduced into the cluster tool prior to completion of the first time period, wherein the second lot is introduced so as to minimize a time gap between the n-th wafer of the first lot of wafers and the first wafer of the second lot of wafers while maintaining a first constant wafer history for each wafer within the first lot and maintaining a second constant wafer history for each wafer in the second lot.

    摘要翻译： 提供了通过集群工具增加多批半导体晶片的处理能力的方法和装置，同时保持每批的恒定的晶片历史。 包含一个至第n个晶片的第一批晶片被引入到包含一个或多个处理室的簇工具中。 第一批晶圆首次处理。 在第一时间段完成之前，将包含一个至第n个晶片的第二批晶片引入到该簇工具中，其中引入第二批以最小化第一批第n个晶片之间的时间间隔 的晶片和第二批晶片的第一晶片，同时保持第一批内的每个晶片的第一恒定晶片历史，并为第二批中的每个晶片保持第二恒定的晶片历史。

    SMALL LOT LOADPORT CONFIGURATIONS
    38.
    发明申请
    SMALL LOT LOADPORT CONFIGURATIONS 审中-公开
    小载荷配置

    公开(公告)号：US20080219816A1

    公开(公告)日：2008-09-11

    申请号：US12026452

    申请日：2008-02-05

    申请人： Michael R. Rice ,  Jeffrey C. Hudgens ,  Vinay K. Shah

    发明人： Michael R. Rice ,  Jeffrey C. Hudgens ,  Vinay K. Shah

    IPC分类号： H01L21/677

    CPC分类号： H01L21/67126 ,  H01L21/67353 ,  H01L21/67373 ,  H01L21/67379 ,  H01L21/67772 ,  H01L21/67775

    摘要： A substrate handling apparatus and method include a small lot loadport configuration having a plurality of small lot loadports adapted to be coupled to an equipment front end module (EFEM) designed for use with a large lot substrate carrier and having a large lot loadport envelope, where the small lot loadport configuration has a combined envelope substantially similar to the large lot loadport envelope, and where each small lot loadport is adapted to dock with a small lot substrate carrier. A system also is provided that includes (1) the (EFEM) and (2) the small lot loadport configuration. Numerous other aspects are provided.

    摘要翻译： 一种基板处理装置和方法包括小批量载荷端口配置，其具有多个小批量载荷端口，其适于耦合到设计用于大批量基板载体并且具有大批载荷端口封套的设备前端模块（EFEM），其中 小批量装载端口配置具有基本上类似于大批量装载端口封套的组合封套，并且其中每个小批量装载端口适于与小批量衬底载体对准。 还提供了一种系统，其中包括（1）（EFEM）和（2）小批量装载端口配置。 提供了许多其他方面。

    DEPOSITION ANALYSIS FOR ROBOT MOTION CORRECTION
    39.
    发明申请
    DEPOSITION ANALYSIS FOR ROBOT MOTION CORRECTION 审中-公开
    机器人运动校正的沉积分析

    公开(公告)号：US20080101912A1

    公开(公告)日：2008-05-01

    申请号：US11553113

    申请日：2006-10-26

    申请人： Todd W. Martin ,  Steven V. Sansoni ,  Michael R. Rice ,  Eric Ng ,  Jeffrey C. Hudgens ,  Frederick Guckel ,  Russel Kaplan

    发明人： Todd W. Martin ,  Steven V. Sansoni ,  Michael R. Rice ,  Eric Ng ,  Jeffrey C. Hudgens ,  Frederick Guckel ,  Russel Kaplan

    IPC分类号： H01L21/66 ,  G01R31/26

    CPC分类号： H01L21/681 ,  G01R31/2893 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201

    摘要： Methods for correcting motion of a robot are provided in the present invention. In one embodiment, a method for correcting motion of a robot includes transferring a first substrate supported on a robot to a processing position using a robotic motion routine, depositing a material on the first substrate in the processing position, determining an offset between a center of the deposited material and a center of the first substrate, adjusting the robotic motion routine to compensate for the offset. In another embodiment, a processing chamber is provided configured to obtain samples from which motion of a robot operated therein may be corrected to improve substrate placement on a substrate support through analysis of material deposited on the substrate.

    摘要翻译： 在本发明中提供了用于校正机器人运动的方法。 在一个实施例中，一种用于校正机器人运动的方法包括：使用机器人运动程序将支撑在机器人上的第一衬底转移到处理位置，将材料沉积在处理位置的第一衬底上， 沉积材料和第一衬底的中心，调整机器人运动程序以补偿偏移。 在另一个实施例中，提供了一种处理室，其被配置为获得可以通过分析沉积在基板上的材料的方式来校正在其中操作的机器人的运动以便改进衬底支撑件上的衬底放置的样本。