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    Solid-state drive with passive heat transfer
    35.
    发明授权
    Solid-state drive with passive heat transfer 有权
    具有被动热传递的固态驱动器

    公开(公告)号：US09408328B2

    公开(公告)日：2016-08-02

    申请号：US13683955

    申请日：2012-11-21

    Applicant: Apple Inc.

    Inventor： Jay S. Nigen ,  Ron A. Hopkinson ,  Derek J. Yap ,  Eric A. Knopf ,  William F. Leggett ,  Richard H. Tan

    IPC: H05K7/20 ,  F28F21/00 ,  G06F1/20 ,  H05K1/02 ,  H01L23/373 ,  H05K1/14 ,  H05K3/00

    CPC classification number: H01L23/3735 ,  F28F21/00 ,  G06F1/20 ,  H01L21/4882 ,  H01L23/3737 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K1/141 ,  H05K3/0061 ,  H05K7/20436 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/10159 ,  H01L2924/00

    Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.

    Abstract translation: 所公开的实施例涉及一种促进系统中的热传导的系统，该系统包括具有诸如固态驱动器的集成电路的电路板的模块。 使用电路板一侧和相邻基板之间的热耦合材料来增加电路板和基板之间的热传导。 此外，模块可以包括在基板和壳体之间的另外的热耦合材料，其至少部分地围绕电路板，从而增加基板和壳体之间的热传导。 以这些方式，底板和/或壳体可以用作传热表面或散热器，其减少与集成电路的操作相关联的热点。

    CONFIGURABLE FORCE-SENSITIVE INPUT STRUCTURE FOR ELECTRONIC DEVICES
    36.
    发明申请
    CONFIGURABLE FORCE-SENSITIVE INPUT STRUCTURE FOR ELECTRONIC DEVICES 审中-公开
    用于电子设备的可配置的敏感输入结构

    公开(公告)号：US20160098107A1

    公开(公告)日：2016-04-07

    申请号：US14867407

    申请日：2015-09-28

    Applicant: Apple Inc.

    Inventor： John B. Morrell ,  Ron A. Hopkinson ,  Peter M. Arnold ,  Mikael M. Silvanto ,  William F. Leggett

    IPC: G06F3/0354 ,  G06F3/041

    Abstract: A configurable, force-sensitive input structure for an electronic device is disclosed. The input structure has a metal contact layer, a sense layer positioned below the metal contact layer, and a drive layer capacitively coupled to the sense layer. The input structure may also have a compliant layer positioned between and coupled to the sense layer and the drive layer, a rigid base layer positioned below the drive layer, and a set of supports positioned between the metal contact layer and the rigid base layer.

    Abstract translation: 公开了一种用于电子设备的可配置的强力敏感输入结构。 输入结构具有金属接触层，位于金属接触层下方的感测层和与感应层电容耦合的驱动层。 输入结构还可以具有位于感测层和驱动层之间并且耦合到感测层和驱动层之间的柔顺层，位于驱动层下方的刚性基层以及位于金属接触层和刚性基层之间的一组支撑。

    EXTERNAL BATTERY-MANAGEMENT MODULE
    38.
    发明申请
    EXTERNAL BATTERY-MANAGEMENT MODULE 审中-公开
    外部电池管理模块

    公开(公告)号：US20130328521A1

    公开(公告)日：2013-12-12

    申请号：US13627919

    申请日：2012-09-26

    Applicant: APPLE INC

    Inventor： Christiaan A. Ligtenberg ,  Ron A. Hopkinson ,  Robert S. Murphy ,  Brett W. Degner ,  Eugene Kim ,  Peter M. Arnold ,  Jim Hwang

    IPC: H02J7/00 ,  H01M2/00

    CPC classification number: H01M2/1027 ,  H01M2/1033 ,  H01M2/204 ,  H01M2010/4271

    Abstract: A power supply for use in a portable electronic device is described. This power supply includes battery cells in separate locations that are electrically coupled by a power bus to a battery-management circuit board, which includes an integrated circuit with control logic that monitors the battery cells and that regulates charging and discharging of the battery cells. The battery cells are not enclosed in a common battery-pack housing so that the battery cells are mechanically separate from each other. Moreover, the battery-management circuit board is external to the battery cells and is not enclosed in the battery-pack housing. By excluding the battery-pack housing from the power supply, there may be more space available to expand the sizes, and thus the total capacities, of the battery cells.

    Abstract translation: 描述了用于便携式电子设备的电源。 该电源包括在电源总线电耦合到电池管理电路板的独立位置的电池单元，其包括具有监控电池单元并且调节电池单元的充电和放电的控制逻辑的集成电路。 电池单元未被封装在公共电池组壳体中，使得电池单元彼此机械分离。 此外，电池管理电路板在电池单元的外部，并未封装在电池组壳体中。 通过从电源中排除电池组外壳，可能会有更多的空间来扩大电池单元的尺寸，从而扩大总容量。

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