公开(公告)号：US11342256B2

公开(公告)日：2022-05-24

申请号：US16256809

申请日：2019-01-24

Applicant: Applied Materials, Inc.

Inventor： Han-Wen Chen ,  Steven Verhaverbeke ,  Kyuil Cho ,  Prayudi Lianto ,  Guan Huei See ,  Vincent Dicaprio

IPC: H01L23/498 ,  H01L23/14 ,  H01L21/48

Abstract: A method for producing an electrical component is disclosed using a molybdenum adhesion layer, connecting a polyimide substrate to a copper seed layer and copper plated attachment.

公开(公告)号：US11281094B2

公开(公告)日：2022-03-22

申请号：US16192546

申请日：2018-11-15

Applicant: Applied Materials, Inc.

Inventor： Roman Gouk ,  Giback Park ,  Kyuil Cho ,  Han-Wen Chen ,  Chintan Buch ,  Steven Verhaverbeke ,  Vincent Dicaprio

IPC: G03F7/038 ,  G03F7/00 ,  H01L21/768 ,  G03F7/20

Abstract: A method and apparatus for forming a plurality of vias in panels for advanced packaging applications is disclosed, according to one embodiment. A redistribution layer is deposited on a substrate layer. The redistribution layer may be deposited using a spin coating process, a spray coating process, a drop coating process, or lamination. The redistribution layer is then micro-imprinted using a stamp inside a chamber. The redistribution layer and the stamp are then baked inside the chamber. The stamp is removed from the redistribution layer to form a plurality of vias in the redistribution layer. Excess residue built-up on the redistribution layer may be removed using a descumming process. A residual thickness layer disposed between the bottom of each of the plurality of vias and the top of the substrate layer may have thickness of less than about 1 μm.

公开(公告)号：US11211439B2

公开(公告)日：2021-12-28

申请号：US16698805

申请日：2019-11-27

Applicant: Applied Materials, Inc.

Inventor： Kyuil Cho ,  Byung Sung Kwak ,  Robert Jan Visser

IPC: H01L27/32

Abstract: A display device includes a display layer having a plurality of organic light-emitting diodes (OLEDs) and an encapsulation layer covering a light-emitting side of the display layer. The encapsulation layer includes a plurality of first polymer projections on display layer, the plurality of first polymer projections having spaces therebetween, and a first dielectric layer conformally covering the plurality of first polymer projections and any exposed underlying surface in the spaces between the first polymer projections, the dielectric layer forming side walls along sides of the first polymer projections and defining wells in spaces between the side walls.

公开(公告)号：US20210159458A1

公开(公告)日：2021-05-27

申请号：US16698824

申请日：2019-11-27

Applicant: Applied Materials, Inc.

Inventor： Kyuil Cho ,  Byung Sung Kwak ,  Robert Jan Visser

IPC: H01L51/52 ,  H01L27/32

Abstract: A display device includes a display layer having a plurality of organic light-emitting diodes (OLEDs) separated by gaps, and an encapsulation layer covering a light-emitting side of the display layer. The encapsulation layer includes a bilayer having a plurality of polymer projections on the display layer, the plurality of polymer projections having spaces therebetween, and a first dielectric layer conformally covering the plurality of polymer projections and an underlying surface in the spaces between the polymer projections, the dielectric layer forming side walls along sides of the polymer projections. The side walls are aligned with the gaps between the OLEDS, and/or the encapsulation layer has multiple bilayers.

公开(公告)号：US20210159457A1

公开(公告)日：2021-05-27

申请号：US16698805

申请日：2019-11-27

Applicant: Applied Materials, Inc.

Inventor： Kyuil Cho ,  Byung Sung Kwak ,  Robert Jan Visser

IPC: H01L51/52 ,  H01L51/56

Abstract: A display device includes a display layer having a plurality of organic light-emitting diodes (OLEDs) and an encapsulation layer covering a light-emitting side of the display layer. The encapsulation layer includes a plurality of first polymer projections on display layer, the plurality of first polymer projections having spaces therebetween, and a first dielectric layer conformally covering the plurality of first polymer projections and any exposed underlying surface in the spaces between the first polymer projections, the dielectric layer forming side walls along sides of the first polymer projections and defining wells in spaces between the side walls.

公开(公告)号：US10547040B2

公开(公告)日：2020-01-28

申请号：US15339187

申请日：2016-10-31

Applicant: Applied Materials, Inc.

Inventor： Giback Park ,  Byung-Sung Kwak ,  Lizhong Sun ,  Dimitrios Argyris ,  Kyuil Cho ,  Miaojun Wang

IPC: H01M10/0585 ,  H01M2/08 ,  H01M2/02 ,  H01M10/04 ,  H01M10/0525 ,  H01M2/10 ,  H01M4/38 ,  H01M4/525 ,  B23K26/142 ,  B23K26/00 ,  B23K26/362 ,  B29C59/16 ,  H01M6/00 ,  H01M6/18 ,  H01M6/40 ,  C23C14/34 ,  C23C14/50 ,  H01J37/32 ,  H01J37/34 ,  B23K101/34 ,  B23K101/36 ,  B23K103/16 ,  B29L31/34

Abstract: Approaches herein provide a device, such as a battery protection device, including a cathode current collector and an anode current collector provided atop a substrate, a cathode provided atop the cathode current collector, and an electrolyte layer provided over the cathode. An interlayer, such as one or more layers of silicon, antimony, magnesium, titanium, magnesium lithium, and/or silver lithium, is formed over the electrolyte layer. An anode contact layer, such as an anode or anode current collector, is then provided over the interlayer. By providing the interlayer atop the electrolyte layer prior to anode contact layer deposition, lithium from the cathode side alloys with the interlayer, thus providing a more isotropic or uniaxial detachment of the anode contact layer.

公开(公告)号：US10211072B2

公开(公告)日：2019-02-19

申请号：US15840900

申请日：2017-12-13

Applicant: Applied Materials, Inc.

Inventor： Han-Wen Chen ,  Steven Verhaverbeke ,  Roman Gouk ,  Guan Huei See ,  Yu Gu ,  Arvind Sundarrajan ,  Kyuil Cho ,  Colin Costano Neikirk ,  Boyi Fu

IPC: H01L21/50 ,  H01L21/56 ,  H01L23/31

Abstract: Embodiments of the present disclosure generally describe methods for minimizing the occurrence and the extent of die shift during the formation of a reconstituted substrate in fan-out wafer level packaging processes. Die shift is a process defect that occurs when a die (device) moves from its intended position within a reconstituted substrate during the formation thereof. Generally, the methods disclosed herein include depositing a device immobilization layer and/or a plurality of device immobilization beads over and/or adjacent to a plurality of singular devices (individual dies), and the carrier substrate they are positioned on, before forming a reconstituted substrate with an epoxy molding compound. The device immobilization layer and/or the plurality of device immobilization beads immobilize the plurality of singular devices and prevents them from shifting on the carrier substrate during the molding process.

公开(公告)号：US20170301957A1

公开(公告)日：2017-10-19

申请号：US15339187

申请日：2016-10-31

Applicant: Applied Materials, Inc.

Inventor： Giback Park ,  Byung-Sung Kwak ,  Lizhong Sun ,  Dimitrios Argyris ,  Kyuil Cho ,  Miaojun Wang

IPC: H01M10/0585 ,  H01M2/08 ,  H01M2/02 ,  H01M10/04 ,  H01M10/0525

Abstract: Approaches herein provide a device, such as a battery protection device, including a cathode current collector and an anode current collector provided atop a substrate, a cathode provided atop the cathode current collector, and an electrolyte layer provided over the cathode. An interlayer, such as one or more layers of silicon, antimony, magnesium, titanium, magnesium lithium, and/or silver lithium, is formed over the electrolyte layer. An anode contact layer, such as an anode or anode current collector, is then provided over the interlayer. By providing the interlayer atop the electrolyte layer prior to anode contact layer deposition, lithium from the cathode side alloys with the interlayer, thus providing a more isotropic or uniaxial detachment of the anode contact layer.