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公开(公告)号：US08352061B2
公开(公告)日：2013-01-08
申请号：US12271674
申请日：2008-11-14
IPC分类号： G06F19/00
CPC分类号： H01L22/12 , B24B37/013 , B24B49/12 , H01L22/26
摘要： While a substrate is polished, it is also irradiated with light from a light source. A current spectrum of the light reflected from the surface of the substrate is measured. A selected peak, having a first parameter value, is identified in the current spectrum. A value of a second parameter associated with the first parameter is determined from a lookup table using a processor. Depending on the value of the second parameter, the polishing of the substrate is changed. An initial spectrum of light reflected from the substrate before the polishing of the substrate can be measured and a wavelength corresponding to a selected peak of the initial spectrum can be determined.
摘要翻译： 当抛光衬底时，也照射来自光源的光。 测量从基板的表面反射的光的当前光谱。 在当前光谱中识别具有第一参数值的选定峰。 使用处理器从查找表确定与第一参数相关联的第二参数的值。 根据第二参数的值，改变衬底的抛光。 可以测量在衬底的抛光之前从衬底反射的光的初始光谱，并且可以确定与初始光谱的选定峰对应的波长。
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公开(公告)号：US20110275167A1
公开(公告)日：2011-11-10
申请号：US13090934
申请日：2011-04-20
IPC分类号： H01L21/66
CPC分类号： B24B37/013 , H01L22/12 , H01L22/26
摘要： A method of optically monitoring a substrate during polishing includes receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a first spectrum from the substrate during polishing, the first spectrum measured within an initial time following initiation of polishing, measuring a sequence of second spectra from the substrate during polishing, the sequence of second spectra measured after the initial time, for each second spectrum in the sequence of second spectra, removing the first spectrum from the second spectrum to generate a sequence of modified third spectra, determining a value of a characteristic of the selected spectral feature for each third spectrum in the sequence of third spectra to generate a sequence of values for the characteristic, and determining a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.
摘要翻译： 在抛光期间光学监测基底的方法包括接收所选择的光谱特征的标识和所选择的光谱特征的特征以在抛光期间监测，在抛光期间测量来自基底的第一光谱，在初始时间之后测量的第一光谱 开始抛光，在抛光期间测量来自衬底的第二光谱序列，在初始时间之后测量的第二光谱序列，对于第二光谱序列中的每个第二光谱，从第二光谱去除第一光谱以产生序列 修改的第三光谱，确定第三光谱序列中的每个第三光谱的所选光谱特征的特征值，以产生该特征值的序列，并且基于以下步骤确定抛光终点或抛光速率的调整： 值序列。
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公开(公告)号：US20110256805A1
公开(公告)日：2011-10-20
申请号：US13090972
申请日：2011-04-20
CPC分类号： B24B49/12 , B24B37/013 , H01L22/12 , H01L22/26
摘要： A method of controlling polishing includes polishing a substrate, monitoring a substrate during polishing with an in-situ monitoring system, generating a sequence of values from measurements from the in-situ monitoring system, fitting a non-linear function to the sequence of values, determining a projected time at which the non-linear function reaches a target value; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the projected time.
摘要翻译： 控制抛光的方法包括抛光衬底，用原位监测系统在抛光过程中监测衬底，从原位监测系统的测量产生一系列值，将非线性函数拟合到值序列， 确定非线性函数达到目标值的预计时间; 以及基于所述预计时间确定抛光终点或抛光速率的调整中的至少一个。
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公开(公告)号：US08014004B2
公开(公告)日：2011-09-06
申请号：US12822096
申请日：2010-06-23
申请人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
发明人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
IPC分类号： G01B11/28
CPC分类号： G01B11/0683 , G01B11/0625 , Y10S707/99936
摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
摘要翻译： 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。
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公开(公告)号：US20110046918A1
公开(公告)日：2011-02-24
申请号：US12938307
申请日：2010-11-02
申请人： Abraham Ravid , Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David , Jun Qian , Sidney P. Huey , Ingemar Carlsson , Lakshmanan Karuppiah , Harry Q. Lee
发明人： Abraham Ravid , Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David , Jun Qian , Sidney P. Huey , Ingemar Carlsson , Lakshmanan Karuppiah , Harry Q. Lee
CPC分类号： G01N21/31 , G01N21/253 , H01L21/67161 , H01L21/67207 , H01L21/67253 , H01L21/67766
摘要： A method of generating a library from a reference substrate for use in processing product wafers is described. The method includes measuring substrate characteristics at a plurality of well-defined points of a reference substrate, measuring spectra at plurality of measurement points of the reference substrate, there being more measurement points than well-defined points, and associating measured spectra with measured substrate characteristics.
摘要翻译： 描述了从用于处理产品晶片的参考基板产生库的方法。 该方法包括在参考基板的多个明确定义的点处测量衬底特性，测量参考衬底的多个测量点处的光谱，存在比明确定义的点多的测量点，以及将测量的光谱与测量的衬底特性相关联 。
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公开(公告)号：US07444198B2
公开(公告)日：2008-10-28
申请号：US11611640
申请日：2006-12-15
申请人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
发明人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
CPC分类号： G01B11/0683 , G01B11/0625 , Y10S707/99936
摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
摘要翻译： 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。
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公开(公告)号：US20080206993A1
公开(公告)日：2008-08-28
申请号：US12036174
申请日：2008-02-22
IPC分类号： H01L21/461 , G06F19/00 , B24B49/00
CPC分类号： H01L22/12 , B24B37/013 , B24B49/12 , H01L21/30625 , H01L2924/0002 , H01L2924/00
摘要： Methods of determining a polishing endpoint are described using spectra obtained during a polishing sequence. In particular, techniques for using only desired spectra, faster searching methods and more robust rate determination methods are described.
摘要翻译： 使用在抛光顺序期间获得的光谱来描述确定抛光终点的方法。 特别地，描述了仅使用期望的光谱，更快的搜索方法和更稳定的速率确定方法的技术。
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公开(公告)号：US20080138988A1
公开(公告)日：2008-06-12
申请号：US11952777
申请日：2007-12-07
申请人： Jeffrey Drue David , Jun Qian , Garrett Sin , Daxin Mao , Chris Heung-Gyun Lee , Sivakumar Dhandapani , Boguslaw A. Swedek , Dominic J. Benvegnu , Lakshmanan Karuppiah
发明人： Jeffrey Drue David , Jun Qian , Garrett Sin , Daxin Mao , Chris Heung-Gyun Lee , Sivakumar Dhandapani , Boguslaw A. Swedek , Dominic J. Benvegnu , Lakshmanan Karuppiah
IPC分类号： H01L21/302
CPC分类号： H01L21/3212 , H01L22/26
摘要： During polishing of a substrate, polysilicon can be removed from a surface of the substrate. Detecting an endpoint during polishing of polysilicon can include polishing the substrate having a polysilicon residue on an area of oxide area and optically detecting clearance of the polysilicon residue.
摘要翻译： 在抛光衬底期间，可以从衬底的表面去除多晶硅。 在研磨多晶硅期间检测端点可以包括在氧化物区域的区域上抛光具有多晶硅残渣的基板，并光学地检测多晶硅残渣的间隙。
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39.发明授权公开(公告)号：US08977379B2
公开(公告)日：2015-03-10
申请号：US12938240
申请日：2010-11-02
IPC分类号： G06F19/00 , B24B37/04 , B24B37/013 , B24B37/20 , B24B49/12
CPC分类号： G05B19/418 , B24B37/013 , B24B37/042 , B24B37/205 , B24B49/12 , G05B2219/45232
摘要： In one aspect, a method of polishing includes polishing a substrate, and receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing. The method includes measuring a sequence of spectra of light reflected from the substrate while the substrate is being polished, where at least some of the spectra of the sequence differ due to material being removed during the polishing. The method of polishing includes determining a value of a characteristic of the selected spectral feature for each of the spectra in the sequence of spectra to generate a sequence of values for the characteristic, fitting a function to the sequence of values, and determining either a polishing endpoint or an adjustment for a polishing rate based on the function.
摘要翻译： 在一个方面，抛光方法包括抛光衬底，以及接收所选择的光谱特征的识别和所选择的光谱特征的特征以在抛光期间进行监测。 该方法包括测量在衬底被抛光时从衬底反射的光的光谱序列，其中序列的至少一些光谱由于在抛光期间被去除的材料而不同。 抛光方法包括确定光谱序列中的每个光谱的所选光谱特征的特征值，以产生特征值的序列，将功能拟合到值序列，以及确定抛光 端点或基于该功能的抛光速率的调整。
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公开(公告)号：US08751033B2
公开(公告)日：2014-06-10
申请号：US13090972
申请日：2011-04-20
IPC分类号： G06F19/00
CPC分类号： B24B49/12 , B24B37/013 , H01L22/12 , H01L22/26
摘要： A method of controlling polishing includes polishing a substrate, monitoring a substrate during polishing with an in-situ monitoring system, generating a sequence of values from measurements from the in-situ monitoring system, fitting a non-linear function to the sequence of values, determining a projected time at which the non-linear function reaches a target value; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the projected time.
摘要翻译： 控制抛光的方法包括抛光衬底，用原位监测系统在抛光过程中监测衬底，从原位监测系统的测量产生一系列值，将非线性函数拟合到值序列， 确定非线性函数达到目标值的预计时间; 以及基于所述预计时间确定抛光终点或抛光速率的调整中的至少一个。
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