SOLID STATE LIGHTING APPARATUSES AND RELATED METHODS
    33.
    发明申请
    SOLID STATE LIGHTING APPARATUSES AND RELATED METHODS 审中-公开
    固态照明设备及相关方法

    公开(公告)号:US20150257211A1

    公开(公告)日:2015-09-10

    申请号:US14221839

    申请日:2014-03-21

    Applicant: Cree, Inc.

    Abstract: Solid state lighting apparatuses and related methods are disclosed. In one aspect, a solid state lighting apparatus is provided. The apparatus includes a substrate, one or more surge protection components supported by the substrate, and at least one solid state light emitter supported by the substrate. The surge protection components are adapted to receive alternating current (AC) directly from an AC power source. The at least one solid state light emitter electrically coupled to the one or more surge protection components. An overall height of the apparatus is approximately 4.5 millimeters (mm) or less. In some aspects, an overall surface area of the one or more surge protection components is approximately 168 square millimeters (mm2) or less. Surge protection circuitry described herein offers a compact form factor, compact surface area, is thin, and meets or exceeds surge compatibility standards.

    Abstract translation: 公开了固态照明装置及相关方法。 一方面,提供固态照明装置。 该装置包括基板,由基板支撑的一个或多个浪涌保护部件以及由基板支撑的至少一个固态光发射器。 浪涌保护元件适于直接从AC电源接收交流电(AC)。 所述至少一个固态光发射器电耦合到所述一个或多个浪涌保护部件。 设备的整体高度约为4.5毫米(mm)或更小。 在一些方面,一个或多个浪涌保护元件的总体表面面积约为168平方毫米(mm 2)或更小。 本文描述的浪涌保护电路提供紧凑的外形尺寸,紧凑的表面积,薄而且满足或超过浪涌兼容性标准。

    LED LAMP WITH LED BOARD HEAT SINK
    34.
    发明申请
    LED LAMP WITH LED BOARD HEAT SINK 有权
    LED灯泡与LED板散热

    公开(公告)号:US20140292176A1

    公开(公告)日:2014-10-02

    申请号:US13852040

    申请日:2013-03-28

    Applicant: CREE, INC.

    Inventor: Praneet Athalye

    Abstract: A LED lamp includes an optically transmissive enclosure and a base connected to the enclosure. LEDs are mounted on a substrate for emitting light when energized though an electrical path from the base. The mounting substrate for the LEDs has a surface that is exposed to the exterior of the enclosure for transmitting heat from the plurality of LEDs and dissipating heat to the ambient environment.

    Abstract translation: LED灯包括光学透射外壳和连接到外壳的基座。 当通过从基座的电路通电时,LED安装在基板上用于发光。 用于LED的安装基板具有暴露于外壳外部的表面,用于传输来自多个LED的热量并将热量散发到周围环境。

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