公开(公告)号：USD668250S1

公开(公告)日：2012-10-02

申请号：US29393449

申请日：2011-06-03

申请人： Caroline Flagiello ,  Martin Zabaleta ,  James Yurchenco ,  Francis James Canova, Jr. ,  Carl Hayton ,  Kenneth Ralph Venegas

设计人： Caroline Flagiello ,  Martin Zabaleta ,  James Yurchenco ,  Francis James Canova, Jr. ,  Carl Hayton ,  Kenneth Ralph Venegas

公开(公告)号：US20100090221A1

公开(公告)日：2010-04-15

申请号：US12444152

申请日：2007-10-01

申请人： Carl Hayton ,  Paul Cain

发明人： Carl Hayton ,  Paul Cain

IPC分类号： H01L33/00 ,  H01L21/28 ,  H01L21/30 ,  G03B27/68

CPC分类号： H01L27/283 ,  G03F7/70791 ,  H01L27/124 ,  H01L51/0018 ,  H01L51/0021 ,  H01L51/0097 ,  H01L51/0541 ,  Y02E10/549 ,  Y02P70/521

摘要： A method of manufacturing an integrated circuit (IC) for driving a flexible display includes depositing a pattern of spatially non-repetitive features in a first layer on a flexible substrate, said pattern of spatially non-repetitive features not substantially regularly repeating in both of two orthogonal directions (x,y) in the plane of the substrate; depositing a pattern of spatially repetitive features in a second layer on said first layer; aligning said second layer and said first layer so as to allow electrical coupling between said non-repetitive features and said repetitive features, wherein distortion compensation is applied during deposition of said repetitive features to enable said alignment.

摘要翻译： 制造用于驱动柔性显示器的集成电路（IC）的方法包括在柔性基板上的第一层中沉积空间上不重复特征的图案，所述空间上不重复特征的图案基本上不规则地在两者中重复 正交方向（x，y）; 在所述第一层上的第二层中沉积空间重复特征的图案; 对准所述第二层和所述第一层以允许所述非重复特征和所述重复特征之间的电耦合，其中在沉积所述重复特征期间施加失真补偿以使得能够进行对准。

公开(公告)号：US20090232969A1

公开(公告)日：2009-09-17

申请号：US11720979

申请日：2005-12-06

申请人： Carl Hayton ,  Henning Sirringhaus ,  Timothy Von Werne ,  Shane Norval

发明人： Carl Hayton ,  Henning Sirringhaus ,  Timothy Von Werne ,  Shane Norval

IPC分类号： B05D5/12

CPC分类号： H01L51/0021 ,  H01L21/288 ,  H01L21/76802 ,  H01L21/76804 ,  H01L51/0017 ,  H01L51/0541

摘要： A method of producing an electronic device including the steps of: (i) providing a body including a first, conductive element separated from a first surface of said body by a portion of said body; (ii) removing a selected portion of said body to define a recess in said body extending from said first surface and via which a portion of said first element is exposed; and (iii) putting into said recess a liquid medium carrying a first material; wherein said first material is preferentially deposited on the exposed inner surface of said body defining said recess, and wherein the deposited first material is used to provide a connection between said first element and a second conductive element located within said body or later deposited over said first surface of said body.

摘要翻译： 一种电子设备的制造方法，包括以下步骤：（i）提供主体，其包括通过所述主体的一部分与所述主体的第一表面分离的第一导电元件; （ii）去除所述主体的选定部分以限定在所述主体中从所述第一表面延伸的凹部，并且所述第一元件的一部分暴露在所述凹部中; 和（iii）将具有第一材料的液体介质放入所述凹部中; 其中所述第一材料优选沉积在限定所述凹部的所述主体的暴露的内表面上，并且其中所沉积的第一材料用于在所述第一元件和位于所述主体内的第二导电元件之间提供连接，或稍后沉积在所述第一元件上 身体的表面。

公开(公告)号：US20090212292A1

公开(公告)日：2009-08-27

申请号：US11915731

申请日：2006-05-30

申请人： Carl Hayton ,  Thomas Meredith Brown ,  Paul A. Cain

发明人： Carl Hayton ,  Thomas Meredith Brown ,  Paul A. Cain

IPC分类号： H01L29/786 ,  H01L29/06 ,  B23K26/36

CPC分类号： H01L51/102 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/172 ,  B23K2103/50 ,  H01L21/02675 ,  H01L21/268 ,  H01L21/76894 ,  H01L27/1214 ,  H01L27/1259 ,  H01L29/78681 ,  H01L51/0017 ,  H01L51/0021 ,  H01L51/0023 ,  H01L51/0545 ,  H01L51/055

摘要： A method of fabricating an organic electronic device is provided. The organic electronic device has a structure including an upper conductive layer and an underlying layer immediately beneath said upper conducting layer and having at least one solution process able semiconducting layer. The upper conducting layer preferably has a thickness of between 10 nm and 200 nm. The method includes patterning said upper conductive layer of said structure by: laser ablating said upper conductive layer using a pulsed laser to remove regions of upper conductive layer from said underlying layer for said patterning; and wherein said laser ablating uses a single pulse of said laser to substantially completely remove a said region of said upper conductive layer to expose said underlying layer beneath

摘要翻译： 提供一种制造有机电子器件的方法。 有机电子器件具有包括在上导电层正下方的上导电层和下层的结构，并具有至少一个溶液加工半导体层。 上导电层的厚度优选为10nm〜200nm。 该方法包括：通过以下步骤对所述结构的所述上导电层进行图案化：使用脉冲激光激光烧蚀所述上导电层，以从所述下层移除用于所述图案化的上导电层的区域; 并且其中所述激光烧蚀使用所述激光器的单个脉冲基本上完全去除所述上导电层的所述区域，以暴露下面的下层

公开(公告)号：US20080252210A1

公开(公告)日：2008-10-16

申请号：US11720429

申请日：2005-12-02

申请人： Michael Banach ,  Thomas Meredith Brown ,  Carl Hayton

发明人： Michael Banach ,  Thomas Meredith Brown ,  Carl Hayton

IPC分类号： H01J1/62 ,  H01L21/00 ,  H01L33/00

CPC分类号： H01L51/0023 ,  H01L51/0037 ,  H01L51/052 ,  H01L51/0541 ,  H01L51/055

摘要： A method is provided to isolated conductive pads on top of a multi-layer polymer device structure. The method utilizes laser radiation to ablate conductive material and create a non-conductive path, electrically isolating the conductive pads. The process is self-limiting and incorporates at least one layer within the stack that absorbs the radiation at the required wavelength. The prevention of radiation degradation of the underlying layers is achieved, as absorption of radiation occurs primarily on the surface of the structure, but not in any of the radiation sensitive underlying layers of the electronic device. The method preferably uses low energy infrared radiation which has been shown to produce little debris and no device degradation.

摘要翻译： 在多层聚合物器件结构的顶部提供隔离导电焊盘的方法。 该方法利用激光辐射来消融导电材料并产生非导电路径，电绝缘导电焊盘。 该过程是自限制的，并且在堆叠内并入吸收所需波长的辐射的至少一层。 实现了防止下层的辐射降解，因为辐射的吸收主要发生在结构的表面上，而不是在电子器件的任何辐射敏感的下层中。 该方法优选使用低能量红外辐射，其已经显示产生很少的碎片，并且没有器件劣化。