Method of fabrication SOI devices with accurately defined monocrystalline source/drain extensions
    31.
    发明授权
    Method of fabrication SOI devices with accurately defined monocrystalline source/drain extensions 失效
    制造具有精确定义的单晶源极/漏极延伸的SOI器件的方法

    公开(公告)号:US06743689B1

    公开(公告)日:2004-06-01

    申请号:US10341427

    申请日:2003-01-14

    IPC分类号: H01L21336

    摘要: Semiconductor devices comprising fully and partially depleted SOI transistors with accurately defined monocrystalline or substantially completely monocrystalline silicon source/drain extensions are fabricated by selectively pre-amorphizing intended source/drain extensions, ion implanting dopants into the pre-amorphized regions and laser thermal annealing to effect crystallization and activation of the source/drain extensions. Embodiments include forming a gate electrode over an SOI substrate with a gate dielectric layer therebetween, forming silicon nitride sidewall spacers on the side surfaces of the gate electrode, forming source/drain regions, forming a thermal oxide layer on the gate electrode and on the source/drain regions, removing the silicon nitride sidewall spacers, pre-amorphizing the intended source/drain extension regions, ion implanting impurities into the pre-amorphized regions and laser thermal annealing to crystallize the pre-amorphized regions and to activate the source/drain extensions.

    摘要翻译: 包括具有精确定义的单晶或基本上完全单晶硅源极/漏极延伸的完全和部分耗尽的SOI晶体管的半导体器件通过将预期的源/漏延伸,离子注入掺杂剂预先非晶化以进行预非晶化区域和激光热退火来制造 源/漏扩展的结晶和激活。 实施例包括在SOI衬底之上形成栅极电介质层,在栅电极之间形成氮化硅侧壁间隔物,形成源/漏区,在栅电极和源极上形成热氧化层 漏极区域,去除氮化硅侧壁间隔物,使预期的源极/漏极延伸区域预非晶化,离子注入杂质到预非晶化区域和激光热退火以使预非晶化区域结晶并激活源极/漏极延伸部分 。

    Double-gate semiconductor device with gate contacts formed adjacent sidewalls of a fin
    32.
    发明授权
    Double-gate semiconductor device with gate contacts formed adjacent sidewalls of a fin 有权
    双栅半导体器件,其栅极触点形成在翅片的相邻侧壁处

    公开(公告)号:US08217450B1

    公开(公告)日:2012-07-10

    申请号:US10770011

    申请日:2004-02-03

    IPC分类号: H01L29/94

    摘要: A double-gate semiconductor device includes a substrate, an insulating layer, a fin and two gates. The insulating layer is formed on the substrate and the fin is formed on the insulating layer. A first gate is formed on the insulating layer and is adjacent a first sidewall of the fin. The second gate is formed on the insulating layer and is adjacent a second sidewall of the fin opposite the first sidewall. The first and second gates both include a conductive material and are electrically separated by the fin.

    摘要翻译: 双栅半导体器件包括衬底,绝缘层,鳍和两个栅极。 绝缘层形成在基板上,并且鳍形成在绝缘层上。 第一栅极形成在绝缘层上并与鳍片的第一侧壁相邻。 第二栅极形成在绝缘层上并且与第一侧壁相对的翅片的第二侧壁相邻。 第一和第二栅极都包括导电材料并且被散热片电隔离。

    Method for forming a tri-gate MOSFET
    33.
    发明授权
    Method for forming a tri-gate MOSFET 失效
    形成三栅极MOSFET的方法

    公开(公告)号:US06998301B1

    公开(公告)日:2006-02-14

    申请号:US10653225

    申请日:2003-09-03

    IPC分类号: H01L21/00 H01L21/84

    摘要: A method for forming a tri-gate semiconductor device that includes a substrate and a dielectric layer formed on the substrate includes depositing a first dielectric layer on the dielectric layer and etching the first dielectric layer to form a structure. The method further includes depositing a second dielectric layer over the structure, depositing an amorphous silicon layer over the second dielectric layer, etching the amorphous silicon layer to form amorphous silicon spacers, where the amorphous silicon spacers are disposed on opposite sides of the structure, depositing a metal layer on at least an upper surface of each of the amorphous silicon spacers, annealing the metal layer to convert the amorphous silicon spacers to crystalline silicon fin structures, removing a portion of the second dielectric layer, depositing a gate material, and etching the gate material to form three gates.

    摘要翻译: 一种形成三栅极半导体器件的方法,包括在衬底上形成的衬底和电介质层,包括在电介质层上沉积第一介电层并蚀刻第一介电层以形成结构。 该方法还包括在结构上沉积第二介电层,在第二介电层上沉积非晶硅层,蚀刻非晶硅层以形成非晶硅间隔物,其中非晶硅间隔物设置在结构的相对侧上,沉积 在每个非晶硅间隔物的至少上表面上的金属层,退火金属层以将非晶硅间隔物转化为晶体硅鳍结构,去除第二电介质层的一部分,沉积栅极材料,并蚀刻 门材料形成三门。

    Non-volatile memory device
    34.
    发明授权
    Non-volatile memory device 失效
    非易失性存储器件

    公开(公告)号:US06958512B1

    公开(公告)日:2005-10-25

    申请号:US10770010

    申请日:2004-02-03

    摘要: A non-volatile memory device includes a substrate, an insulating layer, a fin, a conductive structure and a control gate. The insulating layer may be formed on the substrate and the fin may be formed on the insulating layer. The conductive structure may be formed near a side of the fin and the control gate may be formed over the fin. The conductive structure may act as a floating gate electrode for the non-volatile memory device.

    摘要翻译: 非易失性存储器件包括衬底,绝缘层,鳍,导电结构和控制栅。 绝缘层可以形成在基板上,并且鳍可以形成在绝缘层上。 导电结构可以形成在鳍的一侧附近,并且控制栅可以形成在翅片上。 导电结构可以用作非易失性存储器件的浮栅电极。

    Narrow fins by oxidation in double-gate finfet
    35.
    发明授权
    Narrow fins by oxidation in double-gate finfet 有权
    狭窄的翅片通过氧化在双门finfet

    公开(公告)号:US06812119B1

    公开(公告)日:2004-11-02

    申请号:US10614052

    申请日:2003-07-08

    IPC分类号: H01L213205

    摘要: A method of forming fins for a double-gate fin field effect transistor (FinFET) includes forming a second layer of semi-conducting material over a first layer of semi-conducting material and forming double caps in the second layer of semi-conducting material. The method further includes forming spacers adjacent sides of each of the double caps and forming double fins in the first layer of semi-conducting material beneath the double caps. The method also includes thinning the double fins to produce narrow double fins.

    摘要翻译: 一种形成双栅极鳍效应晶体管(FinFET)的鳍片的方法包括在第一半导体材料层上形成第二半导电材料层,并在第二半导体材料层中形成双重盖子。 该方法还包括在每个双盖的侧面上形成间隔物,并在双重帽下面的第一半导体材料层中形成双翅片。 该方法还包括使双翅片变薄以产生窄的双翅片。