公开(公告)号：US20080185179A1

公开(公告)日：2008-08-07

申请号：US12010872

申请日：2008-01-30

申请人： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

发明人： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

IPC分类号： H05K1/11

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/116 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09663 ,  H01L2224/0401

摘要： Disclosed are an electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit. The electromagnetic bandgap structure in which a first metal layer, a first dielectric layer, a second dielectric layer and a second metal layer are stacked can include a first metal plate, formed between the first dielectric layer and the second dielectric layer; a second metal plate, formed on a same planar surface as the first metal plate, accommodated into a hole which is formed in the first metal plate and electrically connected to the first metal plate through a metal line; and a via, connecting the second metal plate to any one of the first metal layer and the second metal layer. With the present invention, the electromagnetic bandgap structure can be not only miniaturized but also have a low bandgap frequency.

摘要翻译： 公开了一种能够解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 层叠有第一金属层，第一电介质层，第二电介质层和第二金属层的电磁带隙结构可以包括形成在第一电介质层和第二电介质层之间的第一金属板; 形成在与第一金属板相同的平面上的第二金属板，容纳在形成在第一金属板中并通过金属线电连接到第一金属板的孔中; 以及将第二金属板连接到第一金属层和第二金属层中的任一个的通孔。 利用本发明，电磁带隙结构不仅可以小型化，而且具有低带隙频率。

公开(公告)号：US08258408B2

公开(公告)日：2012-09-04

申请号：US12654545

申请日：2009-12-22

申请人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

发明人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

摘要： As a multi-layered board, an EMI noise reduction board, having an electromagnetic bandgap structure with band stop frequency properties inserted into an inner portion of the board, includes a first area, in which a ground layer and a power layer are formed, and a second area, placed on a side surface of the first area, in which it has the electromagnetic bandgap structure formed therein so as to shield an EMI noise radiated to the outside through the side surface of the first area. The electromagnetic bandgap structure includes a plurality of first conductive plates, placed along the edge of the board, a plurality of second conductive plates, disposed on a planar surface that is different from the first conductive plates such that the second conductive plates are alternately disposed with the first conductive plates, and a via, which connects the first conductive plates to the second conductive plates.

摘要翻译： 作为多层板，具有插入板的内部的具有带阻频率特性的电磁带隙结构的EMI降噪板包括形成有接地层和功率层的第一区域，以及 第二区域，放置在第一区域的侧表面上，其中形成有电磁带隙结构，以便屏蔽通过第一区域的侧表面辐射到外部的EMI噪声。 电磁带隙结构包括沿着板的边缘放置的多个第一导电板，设置在不同于第一导电板的平面上的多个第二导电板，使得第二导电板交替地布置有 第一导电板和将第一导电板连接到第二导电板的通孔。

公开(公告)号：US08242377B2

公开(公告)日：2012-08-14

申请号：US12654361

申请日：2009-12-17

申请人： Hyo-Jic Jung ,  Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Dae-Hyun Park

发明人： Hyo-Jic Jung ,  Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Dae-Hyun Park

IPC分类号： H05K9/00 ,  H05K1/11

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

摘要： Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductor and a second conductor arranged on different planar surfaces, a third conductor arranged on a same planar surface that is different from a planar surface where the second conductor is arranged, and a first stitching via unit configured to connect the first conductor to the third connector through the planar surface where the second conductor is arranged and being electrically separated from the second conductor. The first conductor can include a first plate, a second plate spaced from the first plate, and a second stitching unit configured to electrically connect the first plate to the second plate through a planar surface that is different from a planar surface where the first plate and the second plate are arranged.

摘要翻译： 公开了一种印刷电路板，其中插入用于阻挡噪声的电磁带隙结构。 电磁带隙结构可以包括布置在不同平面上的第一导体和第二导体，布置在与布置第二导体的平面不同的相同平面上的第三导体，以及第一缝合通孔单元， 通过布置第二导体的平面表面将第一导体连接到第三连接器，并与第二导体电分离。 第一导体可以包括第一板，与第一板间隔开的第二板，以及第二缝合单元，其被配置为通过与第一板和第二板的平坦表面不同的平面表面将第一板电连接到第二板 布置第二板。

公开(公告)号：US20110180312A1

公开(公告)日：2011-07-28

申请号：US13064541

申请日：2011-03-30

申请人： Han Kim ,  Je-Gwang Yoo ,  Mi-Ja Han ,  Dae-Hyun Park

发明人： Han Kim ,  Je-Gwang Yoo ,  Mi-Ja Han ,  Dae-Hyun Park

IPC分类号： H05K1/18

CPC分类号： H05K1/0231 ,  H01L2224/16225 ,  H05K1/0236 ,  H05K1/165 ,  H05K1/185 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09663 ,  H05K2201/10636 ,  H05K2201/10643 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49146

摘要： A printed circuit board having an embedded chip capacitor includes a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, having a first electrode connected to the first conductive layer through being seated in a cavity formed between the first conductive layer and the second conductive layer; a filled material, filled in a space excluding a space occupied by the chip capacitor in the cavity; and a via, penetrating the filled material and connecting the second conductive layer to the second electrode of the chip capacitor.

摘要翻译： 具有嵌入式芯片电容器的印刷电路板包括：第一导电层; 远离所述第一导电层放置的第二导电层; 芯片电容器，其具有通过位于形成在第一导电层和第二导电层之间的空腔中而连接到第一导电层的第一电极; 填充材料，填充在空腔内不包括由片状电容器占据的空间的空间中; 以及通孔，穿透填充材料并将第二导电层连接到片式电容器的第二电极。

公开(公告)号：US20110067915A1

公开(公告)日：2011-03-24

申请号：US12654368

申请日：2009-12-17

申请人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

发明人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

摘要： An EMI noise reduction board is disclosed. The electromagnetic interference (EMI) noise reduction board having an electromagnetic bandgap structure for shielding a noise includes: a first area having a ground layer and a power layer; a second area placed in a side portion of the first area having an electromagnetic bandgap structure therein. The electromagnetic bandgap structure includes: a plurality of first conductive plates and a plurality of second conductive plates placed on a same planar surface along the side portion of the first area; and a stitching via configured to electrically connect the first conductive plate to the second conductive plate through a planar surface that is different from the first conductive plate and the second conductive plate.

摘要翻译： 公开了一种EMI降噪板。 具有用于屏蔽噪声的电磁带隙结构的电磁干扰（EMI）降噪板包括：具有接地层和功率层的第一区域; 放置在其中具有电磁带隙结构的第一区域的侧部的第二区域。 电磁带隙结构包括：多个第一导电板和沿着第一区域的侧面部分放置在同一平面上的多个第二导电板; 以及缝合通孔，其被构造成通过不同于所述第一导电板和所述第二导电板的平坦表面将所述第一导电板电连接到所述第二导电板。

公开(公告)号：US20110031007A1

公开(公告)日：2011-02-10

申请号：US12654545

申请日：2009-12-22

申请人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

发明人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

摘要： As a multi-layered board, an EMI noise reduction board, having an electromagnetic bandgap structure with band stop frequency properties inserted into an inner portion of the board, includes a first area, in which a ground layer and a power layer are formed, and a second area, placed on a side surface of the first area, in which it has the electromagnetic bandgap structure formed therein so as to shield an EMI noise radiated to the outside through the side surface of the first area. The electromagnetic bandgap structure includes a plurality of first conductive plates, placed along the edge of the board, a plurality of second conductive plates, disposed on a planar surface that is different from the first conductive plates such that the second conductive plates are alternately disposed with the first conductive plates, and a via, which connects the first conductive plates to the second conductive plates.

摘要翻译： 作为多层板，具有插入板的内部的具有带阻频率特性的电磁带隙结构的EMI降噪板包括形成有接地层和功率层的第一区域，以及 第二区域，放置在第一区域的侧表面上，其中形成有电磁带隙结构，以便屏蔽通过第一区域的侧表面辐射到外部的EMI噪声。 电磁带隙结构包括沿着板的边缘放置的多个第一导电板，设置在不同于第一导电板的平面上的多个第二导电板，使得第二导电板交替地布置有 第一导电板和将第一导电板连接到第二导电板的通孔。

公开(公告)号：US20090236141A1

公开(公告)日：2009-09-24

申请号：US12285133

申请日：2008-09-29

申请人： Han Kim ,  Mi-Ja Han ,  Hyo-Jic Jung

发明人： Han Kim ,  Mi-Ja Han ,  Hyo-Jic Jung

IPC分类号： H05K1/02

CPC分类号： H01P1/2005 ,  H01L2224/16 ,  H01P1/203 ,  H05K1/0236 ,  H05K1/0237 ,  H05K2201/09309 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/09681

摘要： According to an embodiment of the present invention, an electromagnetic bandgap structure can include: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate. In the electromagnetic bandgap structure of the present invetion, the first stitching via can electrically connect the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above the one conductive plate, and the second stitching via can electrically connect the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface below the one conductive plate.

摘要翻译： 根据本发明的实施例，电磁带隙结构可以包括：至少三个导电板; 第一缝合通孔，被配置为将任一导电板电连接到另一个导电板; 以及第二缝合通孔，其被配置为将所述一个导电板电连接到另一个导电板。 在本发明的电磁带隙结构中，第一缝合通孔可以通过允许第一缝合通孔的一部分通过一个导电板上的平面连接而将一个导电板电连接到另一个导电板， 缝合通孔可以通过允许第二缝合通孔的一部分通过一个导电板下面的平坦表面连接而将一个导电板电连接到另一个导电板。

公开(公告)号：US20090071709A1

公开(公告)日：2009-03-19

申请号：US12076650

申请日：2008-03-20

申请人： Mi-Ja Han ,  Han Kim ,  Ja-Bo Koo

发明人： Mi-Ja Han ,  Han Kim ,  Ja-Bo Koo

IPC分类号： H05K1/02

CPC分类号： H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09663

摘要： An electromagnetic bandgap structure and a printed circuit board that intercepts to transfer a signal having a predetermined frequency band are disclosed. In particularly, the electromagnetic bandgap structure includes a first metal layer and a second metal layer; a metal plate, placed between the first metal layer and a second metal layer; a multi-via, penetrating the first metal layer, passing through the same planar surface as an outer metal layer and turning toward the first metal layer to connect the metal plate and the first metal layer; and a dielectric layer, stacked in between the first metal layer and the metal plate, between the metal plate and the second metal layer and between the first metal layer and the outer metal layer. With the present invention, a bandgap frequency can be decreased without increasing the size of the metal plate.

摘要翻译： 公开了一种电磁带隙结构和用于传送具有预定频带的信号的印刷电路板。 特别地，电磁带隙结构包括第一金属层和第二金属层; 金属板，放置在第一金属层和第二金属层之间; 穿过第一金属层的多通孔，穿过与外部金属层相同的平面，并朝着第一金属层转动以连接金属板和第一金属层; 以及电介质层，层叠在所述第一金属层和所述金属板之间，所述金属板与所述第二金属层之间以及所述第一金属层与所述外部金属层之间。 通过本发明，可以在不增加金属板的尺寸的情况下降低带隙频率。

公开(公告)号：US07563104B2

公开(公告)日：2009-07-21

申请号：US11896298

申请日：2007-08-30

申请人： Han Kim ,  Yang Je Lee ,  Sang Jin Oh ,  Mi Ja Han

发明人： Han Kim ,  Yang Je Lee ,  Sang Jin Oh ,  Mi Ja Han

IPC分类号： H01R12/00

CPC分类号： H01R13/2407 ,  H01R12/58 ,  H05K3/365 ,  H05K2201/10295

摘要： The Printed Circuit Board (PCB) has connectors which each include a terminal part and a connector pin. The terminal part is formed in one end of the PCB and is provided with a terminal hole. The connector pin is configured such that one end thereof is inserted into the terminal hole, and the remaining end thereof extends to protrude outside the terminal hole and is also bent several times, thus forming a contact part that is elastically deformed, and electrically connected to a pad part provided in a target PCB for connection. Thus, a desirable signal transmission characteristic is guaranteed, so that the reliability of electronic devices using the PCB can be improved and the manufacturing cost can also be reduced.

摘要翻译： 印刷电路板（PCB）具有连接器，每个连接器包括端子部分和连接器引脚。 端子部分形成在PCB的一端并设有端子孔。 连接器销被构造成使得其一端插入端子孔中，并且其剩余端延伸到端子孔外部并且也弯曲多次，从而形成弹性变形的接触部，并且电连接到 设置在目标PCB中用于连接的焊盘部分。 因此，保证期望的信号传输特性，从而可以提高使用PCB的电子设备的可靠性，并且还可以降低制造成本。

公开(公告)号：US08598468B2

公开(公告)日：2013-12-03

申请号：US13437254

申请日：2012-04-02

申请人： Han Kim ,  Mi-Ja Han ,  Hyo-Jic Jung

发明人： Han Kim ,  Mi-Ja Han ,  Hyo-Jic Jung

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H01P1/2005 ,  H01L2224/16 ,  H01P1/203 ,  H05K1/0236 ,  H05K1/0237 ,  H05K2201/09309 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure including: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate, wherein the first stitching via electrically connects the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above or below the one conductive plate, and the second stitching via electrically connects the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface that is different from the planar surface through which the part of the first stitching via is connected, the two planar surfaces being placed in a same direction based on the conductive plates.

摘要翻译： 一种电磁带隙结构，包括：至少三个导电板; 第一缝合通孔，被配置为将任一导电板电连接到另一个导电板; 以及第二缝合通孔，其被配置为将所述一个导电板电连接到另一个导电板，其中所述第一缝合通孔将所述第一缝合通孔的一部分通过平面 表面在一个导电板的上方或下方，并且第二缝合通孔通过允许第二缝合通孔的一部分通过不同于平面的平面表面连接一个导电板到另一个导电板，通过该平面 第一缝合通孔的部分被连接，两个平面被放置在相同的方向上，基于导电板。