利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

141 条记录 (耗时 0.03 秒)

    Chip capacitor embedment method
    1.
    发明申请
    Chip capacitor embedment method 审中-公开
    片式电容器嵌入法

    公开(公告)号：US20110179642A1

    公开(公告)日：2011-07-28

    申请号：US13064542

    申请日：2011-03-30

    申请人： Han Kim ,  Je-Gwang Yoo ,  Mi-Ja Han ,  Dae-Hyun Park

    发明人： Han Kim ,  Je-Gwang Yoo ,  Mi-Ja Han ,  Dae-Hyun Park

    IPC分类号： H05K3/30

    CPC分类号： H05K1/0231 ,  H01L2224/16225 ,  H05K1/0236 ,  H05K1/165 ,  H05K1/185 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09663 ,  H05K2201/10636 ,  H05K2201/10643 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49146

    摘要： A method of embedding a chip capacitor in a printed circuit board including a first conductive layer and a dielectric layer placed on the first conductive layer includes removing the dielectric layer to form a cavity exposing the first conductive layer; seating a chip capacitor in the cavity; filling a filled material at a space excluding a space occupied by the chip capacitor in the cavity; forming a via penetrating the filled material and being connected to the chip capacitor; and stacking a conductive material to constitute a second conductive layer in surfaces of the via and the dielectric layer and in an surface of the filled material filled in the cavity.

    摘要翻译： 将片状电容器嵌入到包括放置在第一导电层上的第一导电层和介电层的印刷电路板中的方法包括去除电介质层以形成露出第一导电层的空腔; 将片状电容器放置在空腔中; 在不包括空腔中的片状电容器占据的空间的空间填充填充材料; 形成穿过填充材料并连接到片式电容器的通孔; 并且在通孔和电介质层的表面和填充在空腔中的填充材料的表面中堆叠导电材料以构成第二导电层。

    Printed circuit board with embedded chip capacitor and chip capacitor embedment method
    2.
    发明申请
    Printed circuit board with embedded chip capacitor and chip capacitor embedment method 审中-公开
    印刷电路板采用嵌入式芯片电容和片式电容器嵌入法

    公开(公告)号：US20090085691A1

    公开(公告)日：2009-04-02

    申请号：US12007793

    申请日：2008-01-15

    申请人： Han Kim ,  Je-Gwang Yoo ,  Mi-Ja Han ,  Dae-Hyun Park

    发明人： Han Kim ,  Je-Gwang Yoo ,  Mi-Ja Han ,  Dae-Hyun Park

    IPC分类号： H03H7/00 ,  H05K3/30

    CPC分类号： H05K1/0231 ,  H01L2224/16225 ,  H05K1/0236 ,  H05K1/165 ,  H05K1/185 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09663 ,  H05K2201/10636 ,  H05K2201/10643 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49146

    摘要： A printed circuit board having an embedded chip capacitor is disclosed. According to an embodiment of the present invention, a printed circuit board having an embedded chip capacitor can include a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, placed between the first conductive layer and the second conductive layer and having a second electrode, connected to the second conductive layer; and a via, connecting the first conductive layer to a first electrode of the chip capacitor. With the present invention, a problem mixed signals can be solved in the printed circuit board including an analog circuit and a digital circuit board by using the chip capacitor embedded in the printed circuit board as an electromagnetic bandgap structure. Here, various electrical devices or elements are mounted in the printed circuit board.

    摘要翻译： 公开了一种具有嵌入式芯片电容器的印刷电路板。 根据本发明的实施例，具有嵌入式芯片电容器的印刷电路板可以包括第一导电层; 远离所述第一导电层放置的第二导电层; 芯片电容器，放置在第一导电层和第二导电层之间，并具有连接到第二导电层的第二电极; 以及将所述第一导电层连接到所述芯片电容器的第一电极的通孔。 利用本发明，通过使用嵌入在印刷电路板中的片状电容器作为电磁带隙结构，可以在包括模拟电路和数字电路板的印刷电路板中解决问题混合信号。 这里，各种电气设备或元件安装在印刷电路板中。

    Electromagnetic bandgap structure and printed circuit board
    5.
    发明授权
    Electromagnetic bandgap structure and printed circuit board 有权
    电磁带隙结构和印刷电路板

    公开(公告)号：US08853560B2

    公开(公告)日：2014-10-07

    申请号：US13411005

    申请日：2012-03-02

    申请人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

    发明人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

    IPC分类号： H05K1/11 ,  H05K1/02

    CPC分类号： H05K1/0236 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/115 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T428/12465

    摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.

    摘要翻译： 公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。

    Printed circuit board having electromagnetic bandgap structure
    7.
    发明申请
    Printed circuit board having electromagnetic bandgap structure 失效
    具有电磁带隙结构的印刷电路板

    公开(公告)号：US20110067914A1

    公开(公告)日：2011-03-24

    申请号：US12654361

    申请日：2009-12-17

    申请人： Hyo-Jic Jung ,  Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Dae-Hyun Park

    发明人： Hyo-Jic Jung ,  Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Dae-Hyun Park

    IPC分类号： H05K9/00 ,  H05K1/11

    CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

    摘要： Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductor and a second conductor arranged on different planar surfaces, a third conductor arranged on a same planar surface that is different from a planar surface where the second conductor is arranged, and a first stitching via unit configured to connect the first conductor to the third connector through the planar surface where the second conductor is arranged and being electrically separated from the second conductor. The first conductor can include a first plate, a second plate spaced from the first plate, and a second stitching unit configured to electrically connect the first plate to the second plate through a planar surface that is different from a planar surface where the first plate and the second plate are arranged.

    摘要翻译： 公开了一种印刷电路板，其中插入用于阻挡噪声的电磁带隙结构。 电磁带隙结构可以包括布置在不同平面上的第一导体和第二导体，布置在与布置第二导体的平面不同的相同平面上的第三导体，以及第一缝合通孔单元， 通过布置第二导体的平面表面将第一导体连接到第三连接器，并与第二导体电分离。 第一导体可以包括第一板，与第一板间隔开的第二板，以及第二缝合单元，其被配置为通过与第一板和第二板的平坦表面不同的平面表面将第一板电连接到第二板 布置第二板。

    Electromagnetic bandgap structure and printed circuit board
    8.
    发明申请
    Electromagnetic bandgap structure and printed circuit board 有权
    电磁带隙结构和印刷电路板

    公开(公告)号：US20090145646A1

    公开(公告)日：2009-06-11

    申请号：US12230871

    申请日：2008-09-05

    申请人： Mi-Ja Han ,  Dae-Hyun Park ,  Han Kim

    发明人： Mi-Ja Han ,  Dae-Hyun Park ,  Han Kim

    IPC分类号： H01G4/228 ,  H05K1/18

    CPC分类号： H01P1/20327 ,  H01L2224/16225 ,  H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09681

    摘要： According to the present invention, the board can include a dielectric layer; a plurality of conductive plates; and a stitching via, to electrically connect two of the conductive plates to each other. Here, the stitching via can include a first via and a second via, respectively, passing through the dielectric layer and having one end part being placed on a same planar surface as each of the two conductive plates; a connection pattern, having each end part being connected to the other end part of the first via and the second via, respectively; and a first extension pattern, placed on the same planar surface as one of the conductive plates and having one end part being connected to the one end part of the first via and the end part being connected to one of the conductive plates.

    摘要翻译： 根据本发明，电路板可以包括电介质层; 多个导电板; 以及缝合通孔，以将两个导电板彼此电连接。 这里，缝合通孔可以分别包括通过电介质层的第一通孔和第二通孔，并且具有一个端部与两个导电板中的每一个放置在同一平面上; 连接图案，其每个端部分别连接到第一通孔和第二通孔的另一端部; 和第一延伸图案，其放置在与导电板之一相同的平面上，并且具有一个端部连接到第一通孔的一个端部，并且端部连接到导电板之一。

    Electromagnetic bandgap structure and printed circuit board
    9.
    发明授权
    Electromagnetic bandgap structure and printed circuit board 有权
    电磁带隙结构和印刷电路板

    公开(公告)号：US08422248B2

    公开(公告)日：2013-04-16

    申请号：US13137504

    申请日：2011-08-22

    申请人： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

    发明人： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

    IPC分类号： H05K9/00

    CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/116 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09663 ,  H01L2224/0401

    摘要： An electromagnetic bandgap structure, including: a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, having one end part which is connected to the first metal layer; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer, whereas the other end part of the via is connected to a via land which is placed in a hole formed in the metal plate, and the via land is connected to the metal plate through a metal line.

    摘要翻译： 一种电磁带隙结构，包括：第一金属层; 第一介电层，堆叠在第一金属层中; 金属板，堆叠在第一介电层中; 通孔，其具有连接到所述第一金属层的一个端部; 第二电介质层，堆叠在所述金属板和所述第一介电层中; 以及第二金属层，层叠在第二电介质层中，而通孔的另一端部连接到放置在形成在金属板中的孔中的通孔焊盘，并且通路焊盘通过 金属线。

    Electromagnetic bandgap structure and printed circuit board
    10.
    发明授权
    Electromagnetic bandgap structure and printed circuit board 有权

    公开(公告)号：US08420949B2

    公开(公告)日：2013-04-16

    申请号：US12230871

    申请日：2008-09-05

    申请人： Mi-Ja Han ,  Dae-Hyun Park ,  Han Kim

    发明人： Mi-Ja Han ,  Dae-Hyun Park ,  Han Kim

    IPC分类号： H05K1/16 ,  H01G4/228

    CPC分类号： H01P1/20327 ,  H01L2224/16225 ,  H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09681

    摘要： According to the present invention, the board can include a dielectric layer; a plurality of conductive plates; and a stitching via, to electrically connect two of the conductive plates to each other. Here, the stitching via can include a first via and a second via, respectively, passing through the dielectric layer and having one end part being placed on a same planar surface as each of the two conductive plates; a connection pattern, having each end part being connected to the other end part of the first via and the second via, respectively; and a first extension pattern, placed on the same planar surface as one of the conductive plates and having one end part being connected to the one end part of the first via and the end part being connected to one of the conductive plates.