摘要:
A fuel cell system includes a fuel cell stack, an oxidizer supply unit, a reformer, a fuel tank, and a water tank. The reformer generates a hydrogen-containing reformed gas reformed from hydrocarbon-based fuel and supplies it to the fuel cell stack. The fuel tank supplies the hydrocarbon-based fuel to the reformer. The water tank supplies water to the reformer. The reformer includes a reforming unit configured to have a reforming reaction generated therein, a combustion unit configured to supply heat energy to the reforming unit, and a carbon monoxide reduction unit configured to reduce the concentration of carbon monoxide in a reformed gas discharged from the reforming unit. A combustion gas pipe is connected to the combustion unit. A reformed gas pipe is disposed between the reforming unit and the carbon monoxide reduction unit. At least one of the combustion gas pipe and the reformed gas pipe is configured to pass through the inside of the water tank or to raise a temperature of the water tank through contact with the water tank, thereby preventing the freezing of the water tank.
摘要:
The present invention relates to a wire rod used in bolts for automobile engines, for example, and more specifically to a wire rod having an improved resistance to hydrogen delayed fracture, to a manufacturing method for same, to a bolt using same and a method for manufacturing the bolt. Provided are a high strength wire rod having a superior resistance to hydrogen delayed fracture and a method for manufacturing same, a high strength bolt using the wire rod and a method for manufacturing same, wherein.the wire rod comprises, 0.3-0.7 wt % C, 0.05-2.0 wt % Si, 0.7-1.5 wt % Mn, 0.01-0.1 wt % Ni, and 30-70 ppm La, and the remainder thereof is comprised by Fe and inevitable impurities.
摘要:
The present invention relates to a method for manufacturing a solid body having a superhydrophobic surface structure formed by using a surface treatment of a metal body, a replication process, and a polymer sticking phenomenon to increase efficiency of fluid transfer and prevent foreign materials from being accumulated in the tube, and a superhydrophobic fluid transfer tube using the method. The superhydrophobic fluid transfer tube includes a fluid guider and a solid body provided on a fluid contact surface of the fluid guider and has micrometer-scaled unevenness and nanometer-scaled protrusions. In the method, a plurality of nanometer-scaled holes are formed on a surface of a metal body through an anodizing process, a replica is formed by immersing the metal body provided with the nanometer-scaled holes in a non-wetting polymer material and solidifying the non-wetting polymer material, the solid body having the superhydrophobic surface is formed by removing the metal body and an anode oxide from the replica, and the solid body is provided to a fluid contact surface of a fluid guider for guiding a fluid.
摘要:
Provided is a wire rod having high strength and high toughness, which suppresses the generation of surface oxide and has superior surface properties through uniform oxide formation, and to a method for manufacturing same. For this purpose, a wire rod comprising 0.005˜ to 0.02 wt. % of Sb, having superior surface properties, high strength and high toughness, and a method for manufacturing same are provided.
摘要:
The present invention relates to a three-dimensional structure manufacturing method for performing surface treatment processes, and a replication step to provide hydrophobicity on an external surface of the three-dimensional structure. In the manufacturing method, the hydrophobicity may be provided to the external surface of the three-dimensional structure, a high cost device required in the conventional MEMS process is not used, the manufacturing cost is reduced, and the manufacturing process is simplified. In addition, it has been difficult to provide the hydrophobicity on an external surface of a three-dimensional structure having a large surface due to a spatial limitation, but in the exemplary embodiment of the present invention, the hydrophobicity may be provided to the external surface of the three-dimensional structure having a large surface, such as a torpedo, a submarine, a ship, and a vehicle, without the spatial limitation.
摘要:
A fuel cell system including a fuel cell stack having a plurality of unit cells is provided. A method of driving the fuel cell stack is also provided. The method may include supplying a fuel to a fuel cell stack, supplying an oxidizer to the fuel cell stack, controlling supply of the fuel and the oxidizer to operate the fuel cell stack, calculating a total operation time of the fuel cell, and/or varying a stack activation period in which the oxidizer is blocked to the fuel cell stack according to the total operation time and a stack activation cycle of which the stack activation period is generated.
摘要:
In a method of forming a dielectric layer pattern, lower patterns are formed on a substrate. A first dielectric layer is formed on sidewalls and upper surfaces of the lower patterns and a surface of the substrate. A mask pattern is formed on the first dielectric layer to partially expose the first dielectric layer. The exposed first dielectric layer on upper surfaces and upper sidewalls of the lower patterns is partially removed and the removed first dielectric layer is deposited on surfaces of the first dielectric layer between the lower patterns, to form a second dielectric layer having a thickness greater than that of the first dielectric layer. The second dielectric layer on the sidewalls of the lower patterns and the substrate is etched to form a dielectric layer pattern. Accordingly, damage to the underlying layer may be reduced, and an unnecessary dielectric layer may be completely removed.
摘要:
In a method of forming a dielectric layer pattern, lower patterns are formed on a substrate. A first dielectric layer is formed on sidewalls and upper surfaces of the lower patterns and a surface of the substrate. A mask pattern is formed on the first dielectric layer to partially expose the first dielectric layer. The exposed first dielectric layer on upper surfaces and upper sidewalls of the lower patterns is partially removed and the removed first dielectric layer is deposited on surfaces of the first dielectric layer between the lower patterns, to form a second dielectric layer having a thickness greater than that of the first dielectric layer. The second dielectric layer on the sidewalls of the lower patterns and the substrate is etched to form a dielectric layer pattern. Accordingly, damage to the underlying layer may be reduced, and an unnecessary dielectric layer may be completely removed.
摘要:
For fabricating a field effect transistor, an extra-doped channel region is formed below a surface of a semiconductor substrate. An opening is formed in the semiconductor substrate into the extra-doped channel region. A gate insulator is formed at walls of the opening such that the extra-doped channel region abuts the gate insulator at a bottom portion of the opening. The opening is filled with a gate electrode. Such an extra-doped channel region prevents undesired body effect in the field effect transistor.
摘要:
Provided herein are methods of forming a metal oxide layer pattern on a substrate including providing a preliminary metal oxide layer on a substrate; etching the preliminary metal oxide layer to provide a preliminary metal oxide layer pattern, wherein the line width of the preliminary metal oxide layer pattern gradually increases in a vertically downward direction; and etching the preliminary metal oxide layer pattern to form a metal oxide layer pattern in a manner so as to decrease the line width of a lower portion of the preliminary metal oxide layer. The present invention also provides methods of manufacturing a semiconductor device including forming a metal oxide layer and a first conductive layer on a substrate; etching the metal oxide layer to provide a preliminary metal oxide layer pattern, wherein the line width of the preliminary metal oxide layer pattern gradually increase in a vertically downward direction; etching the first conductive layer to provide a first conductive layer pattern; and etching the preliminary metal oxide layer pattern to provide a metal oxide layer pattern in a manner so as to decrease the line width of a lower portion of the preliminary metal oxide layer pattern.