METHOD OF MANUFACTURING FORMED BODY FOR ELECTRODE

    公开(公告)号:US20220131128A1

    公开(公告)日:2022-04-28

    申请号:US17647601

    申请日:2022-01-11

    Abstract: The present disclosure provides a method of manufacturing a formed body for an electrode including: a step of preparing an electrode material containing an electrode active material; a step of forming at least two projecting portions containing the electrode material and placed side by side on a support in a width direction of the support by supplying the electrode material onto the support; and a step of leveling the projecting portions on the support.

    FILM FORMING METHOD FOR ORGANIC SEMICONDUCTOR FILM

    公开(公告)号:US20210359212A1

    公开(公告)日:2021-11-18

    申请号:US17387111

    申请日:2021-07-28

    Inventor: Eijiro IWASE

    Abstract: An object of the present invention is to provide a film forming method for an organic semiconductor film, with which an organic semiconductor film having good uniformity and high mobility can be manufactured with good productivity. A coating liquid is prepared by dissolving an organic semiconductor material in a solvent, the coating liquid is sprayed by a spray unit, and the coating liquid is applied onto a temperature-controlled substrate while the coating liquid during the flight which has been sprayed by the spray unit is being heated, whereby problems are solved.

    ORGANIC THIN FILM TRANSISTOR AND METHOD OF MANUFACTURING ORGANIC THIN FILM TRANSISTOR

    公开(公告)号:US20210175449A1

    公开(公告)日:2021-06-10

    申请号:US17182900

    申请日:2021-02-23

    Inventor: Eijiro IWASE

    Abstract: Provided are an organic thin film transistor having high bendability and high stability in air and a method of manufacturing the organic thin film transistor. The organic thin film transistor includes: a gas barrier layer consisting of a resin layer and an inorganic layer; a transistor element that is formed on one main surface side of the gas barrier layer and includes a gate electrode, an insulating film, an organic semiconductor layer, a source electrode, and a drain electrode; and a sealing layer that is laminated on a side of the transistor element opposite to the gas barrier layer through an adhesive layer, in which a thickness of the resin layer in the gas barrier layer is less than a thickness ranging from the inorganic layer to the sealing layer in the gas barrier layer.

    GAS BARRIER FILM AND METHOD FOR PRODUCING GAS BARRIER FILM

    公开(公告)号:US20200180285A1

    公开(公告)日:2020-06-11

    申请号:US16793450

    申请日:2020-02-18

    Inventor: Eijiro IWASE

    Abstract: A gas barrier film has, in sequence, a support, an inorganic layer, and a resin film, the inorganic layer and the resin film being supported on the support. The resin film has a hydroxy group. The inorganic layer and the resin film are directly joined to each other with separate portions that are partially present at an interface between the inorganic layer and the resin film. The gas barrier film has one or more sets of a combination of the inorganic layer and the resin film. A method for producing the gas barrier film includes forming an inorganic layer by a gas-phase deposition method, subsequently laminating a resin film having a hydroxy group with the inorganic layer, and heating the resulting film laminate.

    FUNCTIONAL FILM AMD METHOD FOR PRODUCING FUNCTIONAL FILM
    37.
    发明申请
    FUNCTIONAL FILM AMD METHOD FOR PRODUCING FUNCTIONAL FILM 审中-公开
    功能薄膜生产功能膜的AMD方法

    公开(公告)号:US20160207285A1

    公开(公告)日:2016-07-21

    申请号:US15084062

    申请日:2016-03-29

    Abstract: A functional film has an organic layer and an inorganic layer which are alternately formed on a support and a protective material which is stuck to a rear surface of the support through an adhesive layer and has thermal characteristics different from thermal characteristics of the support, in which an adhesive force between the adhesive layer and the support is 0.01 N/25 mm to 0.15 N/25 mm, and an adhesive force between the adhesive layer and the protective material is 5 N/25 mm to 50 N/25 mm. In a state where a long laminate composed of the support, the adhesive layer, and the protective material is being transported in a longitudinal direction, the organic layer and the inorganic layer are alternately formed on the surface of the support. As a result, a low-cost functional film, in which the inorganic layer or the like is not damaged and which stably demonstrates the intended performance, is obtained.

    Abstract translation: 功能膜具有交替形成在支撑体上的有机层和无机层,以及通过粘合剂层粘附到载体的后表面的保护材料,其具有与载体的热特性不同的热特性,其中 粘合剂层和载体之间的粘合力为0.01N / 25mm至0.15N / 25mm,粘合剂层和保护材料之间的粘合力为5N / 25mm至50N / 25mm。 在由支撑体,粘合剂层和保护材料构成的长层压体沿长度方向输送的状态下,有机层和无机层交替地形成在载体的表面上。 结果,获得了其中无机层等不被损坏并且稳定地表现出预期性能的低成本功能膜。

    FUNCTIONAL FILM AND ORGANIC EL DEVICE
    40.
    发明申请
    FUNCTIONAL FILM AND ORGANIC EL DEVICE 有权
    功能膜和有机EL器件

    公开(公告)号:US20150137108A1

    公开(公告)日:2015-05-21

    申请号:US14606298

    申请日:2015-01-27

    Inventor: Eijiro IWASE

    Abstract: A functional film of the present invention includes a support body of which a retardation value is less than or equal to 300 nm; a protective inorganic layer which is formed on the support body; one or more combinations of an inorganic layer and an organic layer which are formed on the protective inorganic layer; and a mixed layer having a thickness of 1 to 100 nm which is formed between the support body and the underlying inorganic layer, and is mixed with a component of the support body and a component of the protective inorganic layer.

    Abstract translation: 本发明的功能膜包括延迟值小于或等于300nm的支撑体; 保护性无机层,其形成在所述支撑体上; 在保护性无机层上形成的无机层和有机层的一种或多种组合; 以及在支撑体和下面的无机层之间形成的厚度为1〜100nm的混合层,并与保护体的成分和保护无机层的成分混合。

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