Abstract:
The present disclosure provides a method of manufacturing a formed body for an electrode including: a step of preparing an electrode material containing an electrode active material; a step of forming at least two projecting portions containing the electrode material and placed side by side on a support in a width direction of the support by supplying the electrode material onto the support; and a step of leveling the projecting portions on the support.
Abstract:
An object of the present invention is to provide a film forming method for an organic semiconductor film, with which an organic semiconductor film having good uniformity and high mobility can be manufactured with good productivity. A coating liquid is prepared by dissolving an organic semiconductor material in a solvent, the coating liquid is sprayed by a spray unit, and the coating liquid is applied onto a temperature-controlled substrate while the coating liquid during the flight which has been sprayed by the spray unit is being heated, whereby problems are solved.
Abstract:
Provided are an organic thin film transistor having high bendability and high stability in air and a method of manufacturing the organic thin film transistor. The organic thin film transistor includes: a gas barrier layer consisting of a resin layer and an inorganic layer; a transistor element that is formed on one main surface side of the gas barrier layer and includes a gate electrode, an insulating film, an organic semiconductor layer, a source electrode, and a drain electrode; and a sealing layer that is laminated on a side of the transistor element opposite to the gas barrier layer through an adhesive layer, in which a thickness of the resin layer in the gas barrier layer is less than a thickness ranging from the inorganic layer to the sealing layer in the gas barrier layer.
Abstract:
A gas barrier film includes a substrate, a peeling resin layer from which the substrate can be peeled off, one or more inorganic layers, and an adhesive layer provided on an inorganic layer most spaced from the substrate, in which an inorganic layer is provided on a surface of the peeling resin layer, the peeling resin layer is a resin layer including a phenyl group, and the adhesive layer is solid at normal temperature and has fluidity by heating, thereby exhibiting adhesiveness.
Abstract:
A gas barrier film has, in sequence, a support, an inorganic layer, and a resin film, the inorganic layer and the resin film being supported on the support. The resin film has a hydroxy group. The inorganic layer and the resin film are directly joined to each other with separate portions that are partially present at an interface between the inorganic layer and the resin film. The gas barrier film has one or more sets of a combination of the inorganic layer and the resin film. A method for producing the gas barrier film includes forming an inorganic layer by a gas-phase deposition method, subsequently laminating a resin film having a hydroxy group with the inorganic layer, and heating the resulting film laminate.
Abstract:
An organic layer not containing halogen is formed on a substrate using a coating material, and a silicon nitride layer is formed on the organic layer by plasma CVD. Owing to the configuration, there is provided a functional film manufacturing method capable of stably manufacturing a high-performance functional film such as a gas barrier film having excellent gas barrier properties, as well as a functional film.
Abstract:
A functional film has an organic layer and an inorganic layer which are alternately formed on a support and a protective material which is stuck to a rear surface of the support through an adhesive layer and has thermal characteristics different from thermal characteristics of the support, in which an adhesive force between the adhesive layer and the support is 0.01 N/25 mm to 0.15 N/25 mm, and an adhesive force between the adhesive layer and the protective material is 5 N/25 mm to 50 N/25 mm. In a state where a long laminate composed of the support, the adhesive layer, and the protective material is being transported in a longitudinal direction, the organic layer and the inorganic layer are alternately formed on the surface of the support. As a result, a low-cost functional film, in which the inorganic layer or the like is not damaged and which stably demonstrates the intended performance, is obtained.
Abstract:
Provided are a laminate film which enables to enhance luminance, and a backlight unit and a liquid crystal display device including this laminate film, as well as a method for producing this laminate film. Provided are laminate films including an optical functional layer and a barrier layer stacked on at least one surface of the optical functional layer, laminate films each having a film having a higher refractive index than a refractive index of the optical functional layer, on a lateral surface of the optical functional layer. It is preferable that the optical functional layer include at least one of a quantum dot and a quantum rod.
Abstract:
An organic layer not containing halogen is formed on a substrate using a coating material, and a silicon nitride layer is formed on the organic layer by plasma CVD. Owing to the configuration, there is provided a functional film manufacturing method capable of stably manufacturing a high-performance functional film such as a gas barrier film having excellent gas barrier properties, as well as a functional film.
Abstract:
A functional film of the present invention includes a support body of which a retardation value is less than or equal to 300 nm; a protective inorganic layer which is formed on the support body; one or more combinations of an inorganic layer and an organic layer which are formed on the protective inorganic layer; and a mixed layer having a thickness of 1 to 100 nm which is formed between the support body and the underlying inorganic layer, and is mixed with a component of the support body and a component of the protective inorganic layer.