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公开(公告)号：US10802467B2
公开(公告)日：2020-10-13
申请号：US15399935
申请日：2017-01-06
Applicant: GENERAL ELECTRIC COMPANY
Inventor： James Fredric Wiedenhoefer , Brian Magann Rush
IPC: G05B19/4097 , B29C64/393 , B33Y50/02 , G06F30/00
Abstract: The present disclosure provides methods of defining internal secondary structures of an object to be formed at least in part by additive manufacturing. The object may include a primary structure having a volume. The methods may include applying a balancing parameter within an axis-aligned bounding box that encompasses the primary structure. The methods may further include refining the balancing parameter until the volume is delimited into a plurality of the internal structures. The plurality of internal structures may be oriented at an angle to a global z-axis that is substantially parallel to a build direction, such as angled in a range of 40 degrees to 70 degrees to the z-axis.
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公开(公告)号：US20200178941A1
公开(公告)日：2020-06-11
申请号：US16212863
申请日：2018-12-07
Applicant: General Electric Company
Inventor： Naveenan Thiagarajan , Warren Lee , Brian Magann Rush
Abstract: An ultrasound probe is presented. The ultrasound probe includes an ultrasound probe handle. Moreover, the ultrasound probe also includes a phase change chamber monolithic with respect to a portion of the ultrasound probe handle, where the phase change chamber includes hermetic chamber walls extending around and defining an enclosed chamber and a material disposed within the hermetic chamber walls, where the material is configured to change phase in response to heat from a component of the ultrasound probe.
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公开(公告)号：US10660236B2
公开(公告)日：2020-05-19
申请号：US14592387
申请日：2015-01-08
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Brian Magann Rush , William Dwight Gerstler , Stefano Angelo Mario Lassini , Todd Garrett Wetzel
Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.
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公开(公告)号：US20180049307A1
公开(公告)日：2018-02-15
申请号：US15237054
申请日：2016-08-15
Applicant: General Electric Company
CPC classification number: H05K1/0203 , H05K5/0256 , H05K7/20309 , H05K7/2039 , H05K7/20672
Abstract: An electronic system includes a chassis. The chassis includes a first endwall, a second endwall, and a sidewall. The electronic system also includes at least one circuit card cartridge coupled to the chassis. The at least one circuit card cartridge is positioned between the first endwall and the second endwall. The at least one circuit card cartridge includes a printed circuit board including a first surface and at least one electronic component. The at least one electronic component is mounted on the first surface. The at least one circuit card cartridge further includes at least one heat transfer assembly coupled to the printed circuit board. The at least one heat transfer assembly is configured to contact the at least one electronic component and extend adjacent the printed circuit board across the first surface.
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公开(公告)号：US09303858B2
公开(公告)日：2016-04-05
申请号：US13779822
申请日：2013-02-28
Applicant: General Electric Company
Inventor： Charles Erklin Seeley , Stanton Earl Weaver, Jr. , Brian Magann Rush , Mark Howard Giammattei
IPC: B60Q1/06 , F21V29/00 , F04B43/04 , H01L23/467 , F04B43/09 , F04B45/027 , F21V29/63
CPC classification number: F15D1/007 , F04B43/046 , F04B43/095 , F04B45/027 , F21V29/60 , F21V29/63 , H01L23/467 , H01L2924/0002 , H01L2924/00
Abstract: A cooling system is provided. The cooling system includes an enclosure. The enclosure is defined by walls among which at least one is movable. The enclosure further includes at least one aperture on at least one wall. The system further includes an amplification element that is coupled with at least one walls of the enclosure. Further, the cooling system includes an actuation unit mechanically coupled with the amplification element. The actuation unit includes at least one actuation signal triggered actuator configured to cause a displacement the amplification element. In the cooling system, the amplification element is configured to amplify the actuator caused displacement through to the at least one wall of the enclosure such that fluid enters and exits the enclosure from the at least one aperture.
Abstract translation: 提供冷却系统。 冷却系统包括一个外壳。 外壳由墙壁限定，其中至少一个是可移动的。 外壳还包括至少一个壁上的至少一个孔。 该系统还包括与外壳的至少一个壁耦合的放大元件。 此外，冷却系统包括与放大元件机械耦合的致动单元。 致动单元包括至少一个致动信号触发的致动器，其构造成使放大元件发生位移。 在冷却系统中，放大元件被配置为放大致动器，使得位移通过至壳体的至少一个壁，使得流体从至少一个孔进入和离开外壳。
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Patent Agency Ranking
公开(公告)号：US20150022975A1
公开(公告)日：2015-01-22
申请号：US13946408
申请日：2013-07-19
Applicant: General Electric Company
Inventor： Eric Ayres Browne , Satish Sivarama Gunturi , Brian Magann Rush , Rixin Lai , Anurag Kasyap Vejjupalle Subramanyam
IPC: H05K7/20
CPC classification number: H05K7/20309 , H01L23/4012 , H01L25/117 , H01L2924/0002 , H05K7/20936 , H01L2924/00
Abstract: A method and system for cooling a heat-generating component are provided. The system includes a heat generating electronic component including a heat conductive face, a heat sink device including at least one open face pin fin array surface directly coupled to the conductive face, each fin including a distal end including an outwardly facing contact area, the contact areas covering only a portion of the conductive face, the contact areas configured to carry electrical current therethrough, and an immersion of dielectric fluid contained in a vessel, the vessel including a heat-conductive hull at least partially submerged in a heat sink fluid.
Abstract translation: 提供了用于冷却发热部件的方法和系统。 该系统包括包括导热面的发热电子部件，散热装置，其包括直接联接到导电面的至少一个开放面销翅片阵列表面，每个散热片包括包括面向外的接触区域的远端， 仅覆盖导电面的一部分的区域，被配置为承载电流通过的接触区域以及容纳在容器中的介电流体的浸没，所述容器包括至少部分地浸没在散热器流体中的导热壳体。
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公开(公告)号：US11745847B2
公开(公告)日：2023-09-05
申请号：US17114908
申请日：2020-12-08
Applicant: General Electric Company
Inventor： Nicholas William Rathay , Gregory Alexander Natsui , Brian Magann Rush
CPC classification number: B64C1/38 , B64C1/0683 , B64C3/36 , B64C30/00 , F28D15/0266 , F28D15/046
Abstract: A hypersonic aircraft includes one or more leading edge assemblies that are designed to manage thermal loads experienced at the leading edges during high speed or hypersonic operation. Specifically, the leading edge assemblies may include an outer wall tapered to a leading edge or stagnation point. The outer wall may define a vapor chamber and a capillary structure within the vapor chamber for circulating a working fluid in either liquid or vapor form to cool the leading edge. In addition, a thermal enhancement feature can enhance a heat transfer from the outer wall at the leading edge to the outer wall within the condenser section of the vapor chamber.
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公开(公告)号：US11683919B2
公开(公告)日：2023-06-20
申请号：US17399371
申请日：2021-08-11
Applicant: General Electric Company
Inventor： Karthik Bodla , Nathaniel Benedict Hawes , Brian Magann Rush , Weijun Yin , Andrew Thomas Cross
CPC classification number: H05K7/20936 , F28D15/0233 , F28D15/0275 , F28D15/046 , H01F27/18 , H02K9/225 , H05K7/20945 , F28D2015/0216
Abstract: A heat pipe assembly includes walls having porous wick linings, an insulating layer coupled with at least one of the walls, and an interior chamber sealed by the walls. The linings hold a liquid phase of a working fluid in the interior chamber. The insulating layer is directly against a conductive component of an electromagnetic power conversion device such that heat from the conductive component vaporizes the working fluid in the porous wick lining of the at least one wall and the working fluid condenses at or within the porous wick lining of at least one other wall to cool the conductive component of the electromagnetic power conversion device. The assembly can be placed in direct contact with the device while the device is operating and/or experiencing time-varying magnetic fields that cause the device to operate.
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公开(公告)号：US11407488B2
公开(公告)日：2022-08-09
申请号：US17120674
申请日：2020-12-14
Applicant: General Electric Company
Inventor： Nicholas William Rathay , Corey Bourassa , Douglas Carl Hofer , Gregory Alexander Natsui , Brian Magann Rush
Abstract: A hypersonic aircraft includes one or more leading edge assemblies that are designed to manage thermal loads experienced at the leading edges during high speed or hypersonic operation. Specifically, the leading edge assemblies may include an outer wall tapered to a leading edge or stagnation point. The outer wall may define a vapor chamber and a capillary structure within the vapor chamber for circulating a working fluid in either liquid or vapor form to cool the leading edge. In addition, a dual-modal cooling structure can enhance heat transfer from the outer wall at the leading edge to the outer wall within the condenser section of the vapor chamber.
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公开(公告)号：US11352120B2
公开(公告)日：2022-06-07
申请号：US16685563
申请日：2019-11-15
Applicant: General Electric Company
Inventor： Nicholas William Rathay , Brian Magann Rush , Gregory Alexander Natsui
Abstract: A hypersonic aircraft includes one or more leading edge assemblies that are designed to cool the leading edge of certain portions of the hypersonic aircraft that are exposed to high thermal loads, such as extremely high temperatures and/or thermal gradients. Specifically, the leading edge assemblies may include an outer wall tapered to a leading edge or stagnation point. A coolant supply may be in fluid communication with at least one fluid passageway that passes through the outer wall to deliver a flow of cooling fluid to the stagnation point. In addition, a nose cover is positioned at least partially over or within the at least one fluid passageway and is formed from a material that ablates or melts when the leading edge is exposed to a predetermined critical temperature, the nose cover being configured for restricting the flow of coolant until the nose cover is ablated or melted away.
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