-
公开(公告)号：US08078306B2
公开(公告)日：2011-12-13
申请号：US12289507
申请日：2008-10-29
申请人： Hidetaka Nakao , Eisaku Hayashi , Kunio Oishi , Isao Hayakawa , Yoshiaki Miyake , Yoshikuni Tateyama , Takeshi Ashihara
发明人： Hidetaka Nakao , Eisaku Hayashi , Kunio Oishi , Isao Hayakawa , Yoshiaki Miyake , Yoshikuni Tateyama , Takeshi Ashihara
IPC分类号： G06F19/00
CPC分类号： B24B37/013 , B24B49/16
摘要： An apparatus polishes an object material such as a film on a substrate. This apparatus includes a polishing table for holding a polishing pad having a polishing surface, a motor configured to drive the polishing table, a holding mechanism configured to hold a substrate having an object material to be polished and to press the substrate against the polishing surface, a dresser configured to dress the polishing surface, and a monitoring unit configured to monitor a removal amount of the object material. The monitoring unit is operable to calculate the removal amount of the object material using a model equation containing a variable representing an integrated value of a torque current of the motor when polishing the object material and a variable representing a cumulative operating time of the dresser.
摘要翻译： 一种装置在基板上抛光诸如膜之类的物体材料。 该设备包括：用于保持具有抛光表面的抛光垫的抛光台，构造成驱动抛光台的电机;保持机构，其构造成保持具有待抛光物体的基板，并将基板压靠在抛光表面上; 修整器，其被配置为修整抛光表面;以及监视单元，被配置为监视对象材料的移除量。 监视单元可操作以使用包含表示电机的转矩电流的积分值的变量的模型方程来计算物体材料的去除量，以及表示修整器的累积操作时间的变量。
-
公开(公告)号：US06645053B1
公开(公告)日：2003-11-11
申请号：US09622638
申请日：2000-11-08
申请人： Norio Kimura , You Ishii , Yoshikuni Tateyama
发明人： Norio Kimura , You Ishii , Yoshikuni Tateyama
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B53/02
摘要： A polishing apparatus has a turntable with a polishing cloth attached thereto and a top ring for holding and pressing a workpiece to be polished against the polishing cloth under a certain pressure. The polishing apparatus also has a first dressing unit having a contact-type dresser for dressing the polishing cloth by bringing the contact-type dresser in contact with the polishing cloth, and a second dressing unit having a noncontact-type dresser for dressing the polishing cloth with a fluid jet applied therefrom to the polishing cloth. The contact-type dresser comprises a diamond dresser or an SiC dresser.
摘要翻译： 抛光装置具有安装有抛光布的转台和用于在一定压力下将待抛光的工件保持并压在抛光布上的顶环。 抛光装置还具有第一修整单元，其具有接触型修整器，用于通过使接触型修整器与抛光布接触来修整抛光布;以及第二修整单元，具有用于修整抛光布的非接触式修整器 其中流体喷射从其施加到抛光布上。 接触式修整器包括钻石修整器或SiC修整器。
-
公开(公告)号：US06561876B1
公开(公告)日：2003-05-13
申请号：US09604331
申请日：2000-06-27
IPC分类号： B24B722
CPC分类号： B24B37/042 , H01L21/31053
摘要： A CMP method for polishing and flattening a film having a rugged surface and formed on a surface of semiconductor substrate by making use of an abrasive cloth while feeding an abrasive agent to the film, wherein the abrasive agent comprises abrasive grains having a surface potential adjusted to negative, and a surfactant formed of a water soluble polymer. Cerium oxide or silicon oxide can be employed as the abrasive grain. As for the surfactant, it is possible to employ ammonium polyacrylate or an organic amine salt.
摘要翻译： 一种用于抛光和平坦化具有粗糙表面并且在半导体衬底的表面上通过使用研磨剂同时向该膜施加研磨剂而形成的研磨剂的CMP方法，其中所述研磨剂包括具有调节为 由水溶性聚合物形成的表面活性剂。 可以使用氧化铈或氧化硅作为磨料颗粒。 对于表面活性剂，可以使用聚丙烯酸铵或有机胺盐。
-
公开(公告)号：US06036582A
公开(公告)日：2000-03-14
申请号：US92046
申请日：1998-06-05
申请人： Hideo Aizawa , Kenya Ito , Hiromi Yajima , Kenichi Shigeta , Yoshikuni Tateyama
发明人： Hideo Aizawa , Kenya Ito , Hiromi Yajima , Kenichi Shigeta , Yoshikuni Tateyama
摘要： A polishing apparatus for polishing semiconductor wafers has a space divided into a plurality of rooms cleaned to different degrees. A storage unit for storing semiconductor wafers is disposed in one of the rooms. A polishing unit for chemically and mechanically polishing a semiconductor wafer supplied from the storage unit is disposed in another one of the rooms. A delivery gate is disposed between the storage unit and the polishing unit and has a temporary storage chamber defined therein for temporarily storing a semiconductor wafer therein.
摘要翻译： 用于研磨半导体晶片的抛光装置具有被划分成不同程度清洁的多个房间的空间。 用于存储半导体晶片的存储单元设置在其中一个房间中。 用于对从存储单元供应的半导体晶片进行化学和机械抛光的抛光单元设置在另一个房间中。 输送门设置在存储单元和抛光单元之间，并且具有限定在其中的临时存储室，用于在其中临时存储半导体晶片。
-
35.发明授权Method of manufacturing semiconductor device using chemical mechanical polishing 有权使用化学机械抛光制造半导体器件的方法公开(公告)号：US07101801B2
公开(公告)日：2006-09-05
申请号：US10704628
申请日：2003-11-12
IPC分类号： H01L21/302
CPC分类号： H01L21/76229 , C09G1/02 , H01L21/31053
摘要： A method for manufacturing a semiconductor device, which includes performing a first chemical mechanical polishing of a surface of an object having an uneven surface by making use of a first polishing liquid containing abrasive particles and a surfactant, and performing a second chemical mechanical polishing of the surface of the object that has been polished by the first chemical mechanical polishing by making use of a second polishing liquid containing abrasive particles and having a concentration of a surfactant lower than that of the first polishing liquid, wherein the first chemical mechanical polishing is switched to the second chemical mechanical polishing when the uneven surface of object is flattened.
摘要翻译： 一种半导体装置的制造方法，其特征在于，包括利用含有研磨粒子和表面活性剂的第一研磨液对所述具有凹凸表面的物体的表面进行第一次化学机械研磨，并对所述半导体装置进行第二化学机械研磨 通过使用含有研磨颗粒并且具有低于第一研磨液的表面活性剂浓度的第二研磨液，通过第一化学机械抛光抛光的物体的表面，其中将第一化学机械抛光切换到 第二次化学机械抛光时物体表面不平整。
-
公开(公告)号：US06835116B2
公开(公告)日：2004-12-28
申请号：US09764318
申请日：2001-01-19
申请人： Shozo Oguri , Hideo Aizawa , Kenichi Shigeta , Yoshikuni Tateyama
发明人： Shozo Oguri , Hideo Aizawa , Kenichi Shigeta , Yoshikuni Tateyama
IPC分类号： B24B4900
CPC分类号： B24B53/017 , B24B49/12
摘要： A polishing apparatus for polishing a workpiece comprises a polishing table having a polishing surface and a top ring for holding the workpiece and pressing the workpiece against the polishing surface. The polishing table and the top ring are rotated independently of each other. The polishing apparatus further comprises a dresser for dressing the polishing surface with certain timing and a sensor for observing a property of the polishing surface on the polishing table when the polishing surface is being dressed by the dresser.
摘要翻译： 用于抛光工件的抛光装置包括具有抛光表面的抛光台和用于保持工件并将工件压靠在抛光表面上的顶环。 抛光台和顶环彼此独立地旋转。 抛光装置还包括用于在某些时刻修整抛光表面的修整器和用于在抛光表面被修整器修整时观察研磨台上抛光表面的特性的传感器。
-
公开(公告)号：US5664989A
公开(公告)日：1997-09-09
申请号：US683265
申请日：1996-07-18
申请人： Rempei Nakata , Hisashi Kaneko , Nobuo Hayasaka , Takeshi Nishioka , Yoshikuni Tateyama , Yutaka Nakano , Yasutaka Sasaki
发明人： Rempei Nakata , Hisashi Kaneko , Nobuo Hayasaka , Takeshi Nishioka , Yoshikuni Tateyama , Yutaka Nakano , Yasutaka Sasaki
CPC分类号： B24B37/22
摘要： A polishing pad comprises at least a first layer having a first main surface serving to polish a substrate to be polished and a second main surface, and a second layer positioned to face the second main surface of the first layer and having fine bags arranged therein, fluid being hermetically sealed in the fine bag.
摘要翻译： 抛光垫至少包括具有用于抛光待抛光基板的第一主表面和第二主表面的第一层，以及设置成面对第一层的第二主表面并且具有布置在其中的细小袋的第二层， 流体密封在细袋中。
-
公开(公告)号：US07888139B2
公开(公告)日：2011-02-15
申请号：US12549261
申请日：2009-08-27
IPC分类号： H01L21/00
CPC分类号： H01L27/11507 , H01L21/0206 , H01L21/31053 , H01L21/32139 , H01L28/55
摘要： A first electrode film, a ferroelectric film, and a second electrode film are accumulated above a semiconductor in this order, a hard mask is accumulated above the second electrode, scrub cleaning is performed on the surface of the hard mask with an surfactant, the hard mask on which the scrub cleaning is performed has been patterned according to a planar shape of a ferroelectric capacitor, and etching is performed by using as a hard mask the hard mask that has been patterned.
摘要翻译： 第一电极膜，铁电体膜和第二电极膜依次堆积在半导体上方，硬掩模在第二电极上方积聚，用表面活性剂对硬掩模的表面进行擦洗清洗 根据铁电电容器的平面形状，对其进行擦洗清洁的掩模进行了图案化，并且通过使用已经被图案化的硬掩模作为硬掩模来进行蚀刻。
-
公开(公告)号：US20100144062A1
公开(公告)日：2010-06-10
申请号：US12549261
申请日：2009-08-27
IPC分类号： H01L21/8246
CPC分类号： H01L27/11507 , H01L21/0206 , H01L21/31053 , H01L21/32139 , H01L28/55
摘要： A first electrode film, a ferroelectric film, and a second electrode film are accumulated above a semiconductor in this order, a hard mask is accumulated above the second electrode, scrub cleaning is performed on the surface of the hard mask with an surfactant, the hard mask on which the scrub cleaning is performed has been patterned according to a planar shape of a ferroelectric capacitor, and etching is performed by using as a hard mask the hard mask that has been patterned.
摘要翻译： 第一电极膜，铁电体膜和第二电极膜依次堆积在半导体上方，硬掩模在第二电极上方积聚，用表面活性剂对硬掩模的表面进行擦洗清洗 根据铁电电容器的平面形状，对其进行擦洗清洁的掩模进行了图案化，并且通过使用已经被图案化的硬掩模作为硬掩模来进行蚀刻。
-
公开(公告)号：US20090111358A1
公开(公告)日：2009-04-30
申请号：US12289507
申请日：2008-10-29
申请人： Hidetaka Nakao , Eisaku Hayashi , Kunio Oishi , Isao Hayakawa , Yoshiaki Miyake , Yoshikuni Tateyama , Takeshi Ashihara
发明人： Hidetaka Nakao , Eisaku Hayashi , Kunio Oishi , Isao Hayakawa , Yoshiaki Miyake , Yoshikuni Tateyama , Takeshi Ashihara
CPC分类号： B24B37/013 , B24B49/16
摘要： The present invention provides a apparatus for polishing an object material such as a film on a substrate. This apparatus includes a polishing table for holding a polishing pad having a polishing surface, a motor configured to drive the polishing table, a holding mechanism configured to hold a substrate having an object material to be polished and to press the substrate against the polishing surface, a dresser configured to dress the polishing surface, and a monitoring unit configured to monitor a removal amount of the object material. The monitoring unit is operable to calculate the removal amount of the object material using a model equation containing a variable representing an integrated value of a torque current of the motor when polishing the object material and a variable representing a cumulative operating time of the dresser.
摘要翻译： 本发明提供一种用于在基板上研磨诸如膜的物体材料的装置。 该设备包括：用于保持具有抛光表面的抛光垫的抛光台，构造成驱动抛光台的电机;保持机构，其构造成保持具有待抛光物体的基板，并将基板压靠在抛光表面上; 修整器，其被配置为修整抛光表面;以及监视单元，被配置为监视对象材料的移除量。 监视单元可操作以使用包含表示电机的转矩电流的积分值的变量的模型方程来计算物体材料的去除量，以及表示修整器的累积操作时间的变量。
-
-
-
-
-
-
-
-
-
搜索结果
41 条记录 (耗时 0.021 秒)
