公开(公告)号：US06036582A

公开(公告)日：2000-03-14

申请号：US92046

申请日：1998-06-05

申请人： Hideo Aizawa ,  Kenya Ito ,  Hiromi Yajima ,  Kenichi Shigeta ,  Yoshikuni Tateyama

发明人： Hideo Aizawa ,  Kenya Ito ,  Hiromi Yajima ,  Kenichi Shigeta ,  Yoshikuni Tateyama

IPC分类号： B23Q37/00 ,  B24B37/04 ,  B24B1/00

CPC分类号： B24B37/04 ,  B23Q37/00

摘要： A polishing apparatus for polishing semiconductor wafers has a space divided into a plurality of rooms cleaned to different degrees. A storage unit for storing semiconductor wafers is disposed in one of the rooms. A polishing unit for chemically and mechanically polishing a semiconductor wafer supplied from the storage unit is disposed in another one of the rooms. A delivery gate is disposed between the storage unit and the polishing unit and has a temporary storage chamber defined therein for temporarily storing a semiconductor wafer therein.

摘要翻译： 用于研磨半导体晶片的抛光装置具有被划分成不同程度清洁的多个房间的空间。 用于存储半导体晶片的存储单元设置在其中一个房间中。 用于对从存储单元供应的半导体晶片进行化学和机械抛光的抛光单元设置在另一个房间中。 输送门设置在存储单元和抛光单元之间，并且具有限定在其中的临时存储室，用于在其中临时存储半导体晶片。

公开(公告)号：US6116994A

公开(公告)日：2000-09-12

申请号：US58163

申请日：1998-04-10

申请人： Kenya Ito ,  Hideo Aizawa

发明人： Kenya Ito ,  Hideo Aizawa

IPC分类号： B24B37/34 ,  B24B47/20 ,  B24B5/00

CPC分类号： B24B37/345 ,  B24B47/20

摘要： A compact polishing apparatus has been developed which can be installed in a relatively small space, and is highly rigid without increasing the weight of the apparatus. The polishing apparatus comprises a polishing table, a top ring head for rotatably holding a substrate, a substrate transfer device for transferring the substrate to and from a substrate storage section, a substrate delivery device for delivery of the substrate between the top ring head and the substrate transfer device at a delivery position outside of the polishing table. A guide rail device is laid between the polishing table and the substrate delivery device, and a carriage device movable along the guide rail device is provided for carrying the top ring device thereon.

摘要翻译： 已经开发了一种紧凑的抛光装置，其可以安装在相对较小的空间中，并且高度刚性，而不增加装置的重量。 抛光装置包括抛光台，用于可旋转地保持基板的顶环头，用于将基板转移到基板存储部分的基板转移装置，用于将基板输送到顶环头部和 在抛光台外的输送位置处的基板转印装置。 导轨装置被放置在抛光台和基板输送装置之间，并且可沿着导轨装置移动的支架装置用于在其上承载顶环装置。

公开(公告)号：US09199352B2

公开(公告)日：2015-12-01

申请号：US12986481

申请日：2011-01-07

申请人： Masaya Seki ,  Kenya Ito ,  Masayuki Nakanishi

发明人： Masaya Seki ,  Kenya Ito ,  Masayuki Nakanishi

IPC分类号： B24B9/00 ,  B24B9/06 ,  B24B21/00 ,  B24B37/27

CPC分类号： B24B9/065 ,  B24B21/004 ,  B24B37/27

摘要： A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and to rotate the substrate and at least one polishing head disposed near the peripheral portion of the substrate. The polishing head has at least one protrusion extending along a circumferential direction of the substrate, and the polishing head is configured to press a polishing surface of a polishing tape by the protrusion against the peripheral portion of the substrate from above or below.

摘要翻译： 抛光装置精确而均匀地抛光基板的顶边部分和/或底边部分。 抛光装置包括旋转保持机构，其构造成水平地保持基板并旋转基板和设置在基板的周边部分附近的至少一个抛光头。 抛光头具有沿着基板周向延伸的至少一个突出部，并且抛光头构造成通过突起抵靠基板的周边部分从上方或下方按压抛光带的抛光表面。

公开(公告)号：US08840992B2

公开(公告)日：2014-09-23

申请号：US12908187

申请日：2010-10-20

申请人： Hiroyuki Iizuka ,  Kenya Ito ,  Koji Ohguma ,  Mikio Yamahiro

发明人： Hiroyuki Iizuka ,  Kenya Ito ,  Koji Ohguma ,  Mikio Yamahiro

IPC分类号： G11B5/708 ,  C09D133/08 ,  B32B5/16

CPC分类号： B32B5/16 ,  C09D133/08 ,  Y10T428/25 ,  Y10T428/257 ,  Y10T428/265

摘要： The curable resin composition of the present invention contains inorganic particles and a curable resin. The inorganic particles includes an inorganic particle (a-1) having a Mohs hardness of 7 or more and an average particle diameter of 1 μm or less, an inorganic particle (a-2) having a Mohs hardness of 4 or more to less than 7 and an average particle diameter of 1 μm or less, and an inorganic particle (a-3) having a Mohs hardness of less than 4 and an average particle diameter of 1 μm or less. The curable resin is at least one selected from a group consisting of a thermosetting resin and an active energy ray-curable resin.

摘要翻译： 本发明的固化性树脂组合物含有无机粒子和固化性树脂。 无机粒子包括莫氏硬度为7以上，平均粒径为1μm以下的无机粒子（a-1），莫氏硬度为4以上的无机粒子（a-2） 7，平均粒径为1μm以下，以及莫氏硬度小于4，平均粒径为1μm以下的无机粒子（a-3）。 可固化树脂是选自热固性树脂和活性能量射线固化树脂中的至少一种。

公开(公告)号：US20140113115A1

公开(公告)日：2014-04-24

申请号：US14127964

申请日：2012-06-18

申请人： Kenya Ito ,  Koji Ohguma ,  Takuro Tanaka ,  Yuka Takahashi ,  Aki Kuromatsu ,  Mikio Yamahiro

发明人： Kenya Ito ,  Koji Ohguma ,  Takuro Tanaka ,  Yuka Takahashi ,  Aki Kuromatsu ,  Mikio Yamahiro

IPC分类号： B29C45/14 ,  B32B38/00

CPC分类号： B29C45/14688 ,  B29C45/14 ,  B29C45/14811 ,  B29C45/14827 ,  B32B7/06 ,  B32B27/16 ,  B32B38/0036 ,  B32B2270/00 ,  B32B2451/00 ,  B44C1/1729 ,  Y10T428/24851 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31551 ,  Y10T428/31554 ,  Y10T428/31598 ,  Y10T428/31663 ,  Y10T428/31946

摘要： Provided is a transfer film for in-mold molding which is superior in solvent resistance, heat resistance, durability, blocking resistance, and moldability, and is capable of suppressing the generation of gate flow, and also provided is a method for producing such a film. The film is provided with: a transfer layer (11) which is to be transferred to an in-mold molded body and which is to be cured when irradiated with active energy rays after the transfer; and a film shaped substrate (L0). The transfer layer (11) comprises an IMD layer (L2) laminated on the substrate (L0) and to be arranged on the outermost surface of the molded body after the in-mold molding. The TMD layer (L2) is constituted by a mixture composition containing at least one active-energy curable resin and at least one thermosetting resin.

摘要翻译： 提供了一种模内成型用转印膜，其耐溶剂性，耐热性，耐久性，耐粘连性和成型性优异，并且能够抑制栅极流动的产生，并且还提供了制造这种膜的方法 。 膜设置有：转印层（11），其被转印到模内成型体中，并且在转印后用活性能量射线照射时被固化; 和薄膜状基板（L0）。 转印层（11）包括层叠在基板（L0）上的IMD层（L2），并且在模内成型之后布置在成形体的最外表面上。 TMD层（L2）由含有至少一种活性能固化树脂和至少一种热固性树脂的混合物组合物构成。

公开(公告)号：US08641480B2

公开(公告)日：2014-02-04

申请号：US13036114

申请日：2011-02-28

申请人： Masayuki Nakanishi ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota ,  Takeshi Nishioka

发明人： Masayuki Nakanishi ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota ,  Takeshi Nishioka

IPC分类号： B24B1/00

CPC分类号： B24B1/00 ,  B24B55/00

摘要： A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having abrasive particles fixed on the surface, against the peripheral portion of the substrate while allowing the polishing tape to travel in one direction; and a conditioning apparatus, disposed upstream of the polishing head in the traveling direction of the polishing tape, for conditioning the surface of the polishing tape in advance in order to prevent the abrasive particles from falling off the surface of the polishing tape during polishing.

摘要翻译： 抛光装置可以有效地防止研磨颗粒在抛光过程中从抛光带上脱落。 抛光装置包括：抛光头，用于通过将具有固定在表面上的研磨颗粒的研磨带的表面按压在基板的周边部分上，同时允许研磨带沿单向移动来抛光基板的周边部分 ; 以及调整装置，其设置在研磨带的行进方向上的抛光头的上游，用于预先调整研磨带的表面，以防止研磨颗粒在抛光期间从研磨带的表面脱落。

公开(公告)号：US08506362B2

公开(公告)日：2013-08-13

申请号：US12667891

申请日：2008-07-08

申请人： Dai Fukushima ,  Atsushi Shigeta ,  Tamami Takahashi ,  Kenya Ito ,  Masaya Seki ,  Hiroaki Kusa

发明人： Dai Fukushima ,  Atsushi Shigeta ,  Tamami Takahashi ,  Kenya Ito ,  Masaya Seki ,  Hiroaki Kusa

IPC分类号： B24B7/26

CPC分类号： B24B21/002 ,  B24B9/065 ,  H01L21/02021

摘要： A polishing apparatus includes a substrate holder configured to hold and rotate a substrate, a press pad configured to press a polishing tape having a polishing surface against a bevel portion of the substrate held by the substrate holder, and a feeding mechanism configured to cause the polishing tape to travel in its longitudinal direction. The press pad includes a hard member having a pressing surface for pressing the bevel portion of the substrate through the polishing tape, and at least one elastic member for pressing the hard member against the bevel portion of the substrate through the belt-shaped polishing tool.

摘要翻译： 抛光装置包括：基板保持器，其构造成保持和旋转基板;压垫，其构造成将具有抛光表面的抛光带压靠在由基板保持器保持的基板的斜面部分上;以及馈送机构，其构造成使抛光 胶带沿其纵向行进。 压垫包括具有用于通过研磨带挤压基板的斜面部分的按压表面的硬质部件和用于通过带状抛光工具将硬质部件压靠在基板的斜面部分上的至少一个弹性部件。

公开(公告)号：US08049986B2

公开(公告)日：2011-11-01

申请号：US12543845

申请日：2009-08-19

申请人： Kenya Ito ,  Takehiko Hamaguchi

发明人： Kenya Ito ,  Takehiko Hamaguchi

IPC分类号： G11B21/02 ,  G11B27/36 ,  G11B5/09

CPC分类号： G11B5/012 ,  B82Y10/00 ,  G11B5/1278 ,  G11B5/743 ,  G11B5/746 ,  G11B5/82 ,  G11B2005/0013

摘要： According to one embodiment, a control method for a magnetic disk device includes writing data by varying a phase of the array period of the plurality of magnetic elements or a phase of the time period of the recording signal in one section of the track from a corresponding phase in another section of the track, reading a reproduction signal from the track, and determining a phase shift between the array period of the plurality of magnetic elements and the time period of the recording signal, based on a reproduction signal read from the one section and a reproduction signal read from the other section. In another embodiment, a magnetic disk includes a track in which magnetic elements are magnetically separated and arranged in an array period, and a phase of the array period in one section is different from a phase in another section of the track.

摘要翻译： 根据一个实施例，一种用于磁盘装置的控制方法包括：通过改变多个磁性元件的阵列周期的相位或从轨道的一个部分中的记录信号的时间段的相位来写入数据 在轨道的另一部分中相位，从轨道读取再现信号，并且基于从一个部分读取的再现信号，确定多个磁性元件的阵列周期与记录信号的时间段之间的相移 以及从另一部分读取的再现信号。 在另一个实施例中，磁盘包括其中磁性元件以阵列周期被磁性地分离和布置的轨道，并且一个部分中的阵列周期的相位不同于轨道的另一部分中的相位。

公开(公告)号：US20110189470A1

公开(公告)日：2011-08-04

申请号：US12908187

申请日：2010-10-20

申请人： Hiroyuki Iizuka ,  Kenya Ito ,  Koji Ohguma ,  Mikio Yamahiro

发明人： Hiroyuki Iizuka ,  Kenya Ito ,  Koji Ohguma ,  Mikio Yamahiro

IPC分类号： B32B5/16 ,  C09D133/08

CPC分类号： B32B5/16 ,  C09D133/08 ,  Y10T428/25 ,  Y10T428/257 ,  Y10T428/265

摘要： The curable resin composition of the present invention contains inorganic particles and a curable resin. The inorganic particles includes an inorganic particle (a-1) having a Mohs hardness of 7 or more and an average particle diameter of 1 μm or less, an inorganic particle (a-2) having a Mohs hardness of 4 or more to less than 7 and an average particle diameter of 1 μm or less, and an inorganic particle (a-3) having a Mohs hardness of less than 4 and an average particle diameter of 1 μm or less. The curable resin is at least one selected from a group consisting of a thermosetting resin and an active energy ray-curable resin.

摘要翻译： 本发明的固化性树脂组合物含有无机粒子和固化性树脂。 无机粒子包括莫氏硬度为7以上，平均粒径为1μm以下的无机粒子（a-1），莫氏硬度为4以上的无机粒子（a-2） 7，平均粒径为1μm以下，Mohs硬度小于4，平均粒径为1μm以下的无机粒子（a-3）。 可固化树脂是选自热固性树脂和活性能量射线固化树脂中的至少一种。

公开(公告)号：US07976361B2

公开(公告)日：2011-07-12

申请号：US12213186

申请日：2008-06-16

申请人： Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa ,  Kenya Ito

发明人： Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa ,  Kenya Ito

IPC分类号： B24B1/00

CPC分类号： B24B21/002 ,  B24B9/065 ,  H01L21/68707 ,  H01L21/68792

摘要： A polishing apparatus is suitable for use in polishing a periphery of a substrate, such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold a workpiece and a polishing head configured to bring a polishing tape into contact with the workpiece. The polishing apparatus also includes a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot at a predetermined point.

摘要翻译： 抛光装置适用于抛光半导体晶片等基板的周边。 抛光装置包括：保持部，其构造成保持工件;以及抛光头，其被配置为使研磨带与工件接触。 抛光装置还包括供给卷轴，其构造成将抛光带供给到抛光头，构造成重绕与工件接触的研磨带的倒带卷轴和摆动机构，其构造成使抛光头与第一抛光头进行摆动运动， 其枢轴在预定点。