HEAT SPREADER FLATNESS DETECTION
    32.
    发明申请
    HEAT SPREADER FLATNESS DETECTION 失效
    散热片平面检测

    公开(公告)号:US20120217983A1

    公开(公告)日:2012-08-30

    申请号:US13033637

    申请日:2011-02-24

    IPC分类号: G01R27/08 G06F15/00 H05K7/20

    CPC分类号: G01N27/041 H05K7/20509

    摘要: A heat spreader includes a plurality of sensors that indicate that the heat spreader is flat against and in thermal contact with a plurality of chips when the heat spreader is loaded upon a chip stack. One or more nodes within the sensors are connected by electric conductors. The resistances of the conductors may be compared to determine if the nodes within the sensors are relatively flat. Sensor flatness may be indicated to a higher level electronic device such as a visual display. The display may ultimately be viewed by a user to determine whether the heat spreader is flat and in thermal contact with the plurality of chips when the heat spreader is loaded upon the chip stack.

    摘要翻译: 散热器包括多个传感器,这些传感器指示当散热器装载在芯片堆叠上时,散热器平坦地对抗多个芯片并与之热接触。 传感器内的一个或多个节点通过电导体连接。 可以比较导体的电阻,以确定传感器内的节点是否相对平坦。 传感器的平坦度可以指示到较高级别的电子设备,诸如视觉显示器。 用户可以最终看到显示器,以便当散热器装载在芯片堆叠上时,确定散热器是否平坦并与多个芯片热接触。

    STACKED MULTIPLE ELECTRONIC COMPONENT INTERCONNECT STRUCTURE
    35.
    发明申请
    STACKED MULTIPLE ELECTRONIC COMPONENT INTERCONNECT STRUCTURE 失效
    堆叠多个电子元件互连结构

    公开(公告)号:US20090119902A1

    公开(公告)日:2009-05-14

    申请号:US12175071

    申请日:2008-07-17

    IPC分类号: H01S4/00

    CPC分类号: H01R13/22 Y10T29/49002

    摘要: Forming a stacked multiple electronic component interconnect structure includes mounting a first double sided land grid to a first surface of a flexible cable and attaching a second double sided land grid array to a second surface of the flexible cable. A first electronic component is attached to a first surface of the first double sided land grid array and a second electronic component is secured to a second surface of the second double sided land grid array to form a stacked multiple electronic component interconnect structure. The stacked multiple electronic component interconnect structure is attached to a circuit board having an electronic component interface cavity. The second electronic component is mounted in the electronic component interface cavity. Finally, the method includes attaching a force member to apply a compressive force to the stacked multiple electronic component interconnect structure to maintain electrical contact between the first and second electronic components.

    摘要翻译: 形成堆叠的多个电子部件互连结构包括将第一双面接地栅格安装到柔性电缆的第一表面并将第二双面焊盘栅格阵列附接到柔性电缆的第二表面。 第一电子部件附接到第一双面焊盘栅格阵列的第一表面,并且第二电子部件固定到第二双面焊盘栅极阵列的第二表面以形成堆叠的多个电子部件互连结构。 堆叠的多个电子部件互连结构附接到具有电子部件接口腔的电路板。 第二电子部件安装在电子部件接口腔中。 最后,该方法包括附接力构件以向堆叠的多个电子元件互连结构施加压缩力以维持第一和第二电子部件之间的电接触。

    Dynamic air moving system
    36.
    发明授权
    Dynamic air moving system 失效
    动态空气移动系统

    公开(公告)号:US07352575B2

    公开(公告)日:2008-04-01

    申请号:US11461250

    申请日:2006-07-31

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20836 H05K7/20727

    摘要: Disclosed is a dynamic air moving system comprising a rail system disposed in an electronic enclosure, at least one fan housing moveably disposed on the rail system, the fan being actuatable along the rail system, a pivotable fan disposed in each of the at least one fan housings, at least one blade included with the fan, the at least one blade being rotatable about at least one blade axes, a fan controller chip controlling actuation of at least one fan housing, individual rotation of at least one blade, and rotation of the fan, a chip thermal sensor disposed on at least one chip located in the electronic enclosure, the thermal sensor being linked to the fan controller chip, and a drive thermal sensor disposed on at least one disk drive associated with the electronic enclosure, the drive thermal sensor being linked to the fan controller chip.

    摘要翻译: 公开了一种动态空气移动系统,其包括设置在电子外壳中的轨道系统,至少一个风扇壳体,其可移动地设置在轨道系统上,风扇可沿轨道系统致动,可枢转风扇设置在每个至少一个风扇 壳体,包括在风扇中的至少一个叶片,所述至少一个叶片可围绕至少一个叶片轴线旋转;风扇控制器芯片,其控制至少一个风扇壳体的致动,至少一个叶片的单独旋转, 风扇,设置在位于电子外壳中的至少一个芯片上的芯片热传感器,热传感器连接到风扇控制器芯片,以及设置在与电子外壳相关联的至少一个磁盘驱动器上的驱动热传感器,驱动热 传感器连接到风扇控制器芯片。

    Apparatus and method for determining residual stress
    37.
    发明授权
    Apparatus and method for determining residual stress 失效
    用于确定残余应力的装置和方法

    公开(公告)号:US06568250B1

    公开(公告)日:2003-05-27

    申请号:US09668781

    申请日:2000-09-22

    申请人: Arvind K. Sinha

    发明人: Arvind K. Sinha

    IPC分类号: G01N348

    摘要: An apparatus measures residual stress in a sample under test by measuring the penetration of an indenter on a unprocessed sample under test, and after processing of the sample under test, measuring again the penetration of the indenter on the processed sample under test, and deriving from the two penetration measurements the residual stress in a sample under test. The apparatus and method of the preferred embodiments are especially useful in determining residual stress in a printed wiring board. In this manner a direct measurement of residual stress is possible without destroying the printed wiring board.

    摘要翻译: 一种装置通过测量待测试的未加工样品上的压头的穿透度来测量待测试样品中的残余应力,并且在测试样品处理之后,再次测量压头在被测试样品上的渗透性,并从 两次穿透测量被测样品中的残余应力。 优选实施例的装置和方法在确定印刷线路板中的残余应力方面特别有用。 以这种方式,可以在不破坏印刷线路板的情况下直接测量残余应力。

    Duplex flexible heat exchanger
    38.
    发明授权
    Duplex flexible heat exchanger 有权
    双相柔性换热器

    公开(公告)号:US09170056B2

    公开(公告)日:2015-10-27

    申请号:US12959477

    申请日:2010-12-03

    摘要: A method and system for cooling an electrical heat source is disclosed. A heat exchanger has two principal sub-assemblies. A closed-loop fluid flow is provided through a second sub-assembly, disposed next to a heat source. An open-loop fluid flow is provided though a first sub-assembly in communication with a second sub-assembly. Each of the first and second sub-assemblies has a rotational element. The fluid flow entering the first sub-assembly rotates the first rotational element, and magnetic communication between the rotational elements causes movement of the second rotational element, thereby achieving fluid movement within the second sub-assembly. Operationally, the closed-loop sub-assembly removes heat from the heat source and transfers it to the open-loop sub-assembly for subsequent heat transfer in a downstream fluid flow.

    摘要翻译: 公开了一种用于冷却电热源的方法和系统。 热交换器具有两个主要子组件。 通过设置在热源旁边的第二子组件提供闭环流体流。 通过与第二子组件连通的第一子组件提供开环流体流。 第一和第二子组件中的每一个具有旋转元件。 进入第一子组件的流体流使第一旋转元件旋转,并且旋转元件之间的磁连通引起第二旋转元件的移动,从而实现第二子组件内的流体运动。 操作上,闭环子组件从热源移除热量并将其传送到开环子组件,以便在下游流体流中进行随后的热传递。

    Plug and receptacle arrangement with connection sensor
    39.
    发明授权
    Plug and receptacle arrangement with connection sensor 失效
    插头和插座安装与连接传感器

    公开(公告)号:US08550840B2

    公开(公告)日:2013-10-08

    申请号:US13297659

    申请日:2011-11-16

    IPC分类号: H01R3/00

    CPC分类号: H01R13/03 H01R13/7031

    摘要: An electrical connector monitoring system for a plug and receptacle assembly, that includes a plug connected to the plug assembly, a recess located within the plug, an electrically insulative layer disposed in the recess, a wear member disposed on the plug that at least partially traverses the insulated recess and in electrical contact with the plug, a contact member movably connected with a receptacle of the receptacle, and a signal device in electrical connection through a circuit with the plug, wear member, and contact member when the plug is fully seated within the receptacle.

    摘要翻译: 一种用于插头和插座组件的电连接器监视系统,其包括连接到插头组件的插头,位于插头内的凹部,设置在凹部中的电绝缘层,设置在插头上的耐磨构件,该耐磨构件至少部分地穿过 所述绝缘凹槽与所述插塞电接触,所述接触构件与所述插座的插座可移动地连接,以及当所述插头完全安置在内部时,通过电路与插头,耐磨构件和接触构件电连接的信号装置 容器