Abstract:
To accomplish fast automated micro-sampling, provided is a charged particle beam apparatus, which is configured to automatically fabricate a sample piece from a sample, the charged particle beam apparatus including: a charged particle beam irradiation optical system configured to radiate a charged particle beam; a sample stage configured to move the sample that is placed on the sample stage; a sample piece transportation unit configured to hold and convey the sample piece separated and extracted from the sample; a holder fixing base configured to hold a sample piece holder to which the sample piece is transported; and a computer configured to perform position control with respect to a second target, based on a machine learning model in which first information including a first image of a first target is learned, and on second information including a second image, which is obtained by irradiation with the charged particle beam.
Abstract:
A charged particle beam apparatus which automatically prepares a sample piece from a sample, includes: a charged particle beam irradiation optical system configured to perform irradiation of a charged particle beam; a sample stage configured to move, the sample being placed on the sample stage; a sample piece relocation unit configured to hold and transport the sample piece which is separated and picked up from the sample; a holder fixing stage which holds a sample piece holder to which the sample piece is relocated; and a computer which performs positional control in relation to a target object based on a template and positional information which is obtained from an image of the target object, the template being generated based on an absorption current image of the target object which is acquired using the irradiation of the charged particle beam.
Abstract:
(Task) To repeatedly perform an operation of extracting a sample piece formed by processing a sample with an ion beam and of transferring the extracted sample piece to a sample piece holder.(Problem Solving Means) A charged particle beam apparatus includes a computer that sets a shaping processing region including a bottom portion of s ample piece in a thickness direction of the sample piece corresponding to a depth direction at the time of processing a sample after a needle holds the sample piece, and controls a focused ion beam irradiation optical system to irradiate the shaping processing region with a focused ion beam to thereby shape the sample piece.
Abstract:
A cross-section processing-and-observation method includes: a cross-section exposure step of irradiating a sample with a focused ion beam to expose a cross-section of the sample; a cross-sectional image acquisition step of irradiating the cross-section with an electron beam to acquire a cross-sectional image of the cross-section; and a step of repeatedly performing the cross-section exposure step and the cross-sectional image acquisition step along a predetermined direction of the sample at a setting interval to acquire a plurality of cross-sectional images of the sample. In the cross-sectional image acquisition step, a cross-sectional image is acquired under different condition settings for a plurality of regions of the cross-section.
Abstract:
A charged particle beam device (10a) includes a computer (21) which controls multiple charged particle beam irradiation optical systems, the needle (18), and a gas supply portion (17) to transfer a sample piece Q to a predetermined position of the sample piece holder P, based on at least images of a sample piece holder (P), a needle (18), and the sample piece (Q) previously acquired by multiple charged particle beams.
Abstract:
A charged particle beam apparatus includes a stage for fixing a sample, a driving mechanism for driving the stage, a focused ion beam column, an electron beam column, a detector that detects a secondary charged particle emitted from the sample irradiated with a charged particle beam, a gas supplying device that supplies gas for forming a deposition film on a surface of the sample, and a control device that generates image data indicating the position distribution of the secondary charged particle detected by the detector. The control device irradiates the sample with the electron beam prior to irradiating the sample with a focused ion beam, recognizes an alignment mark provided in the sample in the image data by the electron beam, and performs positioning of an irradiation region of the sample using the alignment mark.
Abstract:
A cross-section processing-and-observation method, including a cross-section exposure step in which a sample is irradiated with a focused ion beam to expose a cross-section of the sample, and a cross-sectional image acquisition step in which the cross-section is irradiated with an electron beam to acquire a cross-sectional image of the cross-section. The cross-section exposure step and the cross-sectional image acquisition step are repeatedly performed along a predetermined direction of the sample at a setting interval to acquire multiple cross-sectional images of the sample. The method also includes a specific observation target detection step in which a predetermined specific observation target from the cross-sectional image acquired a the cross-sectional image acquisition step is detected. In the specific observation target detection step, after a predetermined specific observation target is detected, the setting interval of the cross-section exposure step is set to be shorter than that before the specific observation target is detected.
Abstract:
A focused ion beam apparatus includes: a focused ion beam tube configured to irradiate a focused ion beam onto a sample; a detector configured to detect secondary particles generated from the sample due to the irradiation and to output detection information regarding detected secondary particles; an image forming unit configured to form an observation image of the sample based on the detection information; a storage unit configured to store positional relation between a first processing area set on an observation image of a first sample and a cross-section surface of the first sample; and a processing area setting unit configured to automatically set a second processing area on an observation image of a second sample based on the positional relation stored in the storage unit and a position of a cross-section surface of the second sample on the observation image of the second sample.
Abstract:
Provided is a focused ion beam apparatus including a control portion configured to: store in advance, in a condenser voltage table, a calculation value of a condenser voltage for obtaining a reference beam current for all each of a plurality of apertures; obtain an experimental value of the condenser voltage for obtaining the reference beam current for a reference aperture; obtain a correction value of the condenser voltage by subtracting the calculation value stored for the reference aperture from the experimental value for the reference aperture; obtain setting values of the condenser voltage by adding the correction value to the calculation values stored for each of the plurality of the apertures; and store the obtained setting value in the condenser voltage table.
Abstract:
Provided is a composite charged particle beam apparatus, including: an electron beam column for irradiating a sample with an electron beam; an ion beam column for irradiating the sample with an ion beam to perform etching processing; a sample stage drive portion for moving a sample stage in an irradiation axis direction of the electron beam; and a column adjusting portion for moving the ion beam column relatively to a sample chamber such that the sample is irradiated with the ion beam at a position irradiated with the electron beam.